JPH0177003U - - Google Patents

Info

Publication number
JPH0177003U
JPH0177003U JP1987171633U JP17163387U JPH0177003U JP H0177003 U JPH0177003 U JP H0177003U JP 1987171633 U JP1987171633 U JP 1987171633U JP 17163387 U JP17163387 U JP 17163387U JP H0177003 U JPH0177003 U JP H0177003U
Authority
JP
Japan
Prior art keywords
carrier
dielectric substrate
chassis
carriers
substrate mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987171633U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987171633U priority Critical patent/JPH0177003U/ja
Publication of JPH0177003U publication Critical patent/JPH0177003U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Waveguides (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは、この考案及び従来型、共通の斜視
図、第1図bはこの考案の側面図、第2図は従来
型の側面図である。図において、1は誘電体基板
、3はキヤリア、4はネジ、6はシヤーシである
FIG. 1a is a common perspective view of this invention and the conventional type, FIG. 1b is a side view of this invention, and FIG. 2 is a side view of the conventional type. In the figure, 1 is a dielectric substrate, 3 is a carrier, 4 is a screw, and 6 is a chassis.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 第1のキヤリア上に取付けられた第1の誘電体
基板と、上記第1のキヤリアと上下方向に段差を
有する第2のキヤリア上に取付けられた第2の誘
電体基板と、上記第1及び第2の誘電体基板間を
接続するため、第3のキヤリア上に取付けられた
第3の誘電体基板と、上記第1〜3のキヤリア及
び誘電体基板を固定するシヤーシと、上記第3の
キヤリアを、上記シヤーシの段差側面方向に固定
するネジとから構成したことを特徴とする基板間
接続回路。
a first dielectric substrate mounted on a first carrier; a second dielectric substrate mounted on a second carrier having a vertical step with respect to the first carrier; A third dielectric substrate mounted on a third carrier to connect the second dielectric substrates, a chassis for fixing the first to third carriers and the dielectric substrate, and a chassis for fixing the first to third carriers and the dielectric substrate; An inter-board connection circuit characterized in that the carrier is constituted by a screw that fixes the carrier in the step side direction of the chassis.
JP1987171633U 1987-11-10 1987-11-10 Pending JPH0177003U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987171633U JPH0177003U (en) 1987-11-10 1987-11-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987171633U JPH0177003U (en) 1987-11-10 1987-11-10

Publications (1)

Publication Number Publication Date
JPH0177003U true JPH0177003U (en) 1989-05-24

Family

ID=31463629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987171633U Pending JPH0177003U (en) 1987-11-10 1987-11-10

Country Status (1)

Country Link
JP (1) JPH0177003U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002513218A (en) * 1998-04-27 2002-05-08 テレフオンアクチーボラゲツト エル エム エリクソン(パブル) Suitable conductive layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002513218A (en) * 1998-04-27 2002-05-08 テレフオンアクチーボラゲツト エル エム エリクソン(パブル) Suitable conductive layer

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