JPH0177003U - - Google Patents
Info
- Publication number
- JPH0177003U JPH0177003U JP1987171633U JP17163387U JPH0177003U JP H0177003 U JPH0177003 U JP H0177003U JP 1987171633 U JP1987171633 U JP 1987171633U JP 17163387 U JP17163387 U JP 17163387U JP H0177003 U JPH0177003 U JP H0177003U
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- dielectric substrate
- chassis
- carriers
- substrate mounted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000969 carrier Substances 0.000 claims 2
Landscapes
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Waveguides (AREA)
Description
第1図aは、この考案及び従来型、共通の斜視
図、第1図bはこの考案の側面図、第2図は従来
型の側面図である。図において、1は誘電体基板
、3はキヤリア、4はネジ、6はシヤーシである
。
FIG. 1a is a common perspective view of this invention and the conventional type, FIG. 1b is a side view of this invention, and FIG. 2 is a side view of the conventional type. In the figure, 1 is a dielectric substrate, 3 is a carrier, 4 is a screw, and 6 is a chassis.
Claims (1)
基板と、上記第1のキヤリアと上下方向に段差を
有する第2のキヤリア上に取付けられた第2の誘
電体基板と、上記第1及び第2の誘電体基板間を
接続するため、第3のキヤリア上に取付けられた
第3の誘電体基板と、上記第1〜3のキヤリア及
び誘電体基板を固定するシヤーシと、上記第3の
キヤリアを、上記シヤーシの段差側面方向に固定
するネジとから構成したことを特徴とする基板間
接続回路。 a first dielectric substrate mounted on a first carrier; a second dielectric substrate mounted on a second carrier having a vertical step with respect to the first carrier; A third dielectric substrate mounted on a third carrier to connect the second dielectric substrates, a chassis for fixing the first to third carriers and the dielectric substrate, and a chassis for fixing the first to third carriers and the dielectric substrate; An inter-board connection circuit characterized in that the carrier is constituted by a screw that fixes the carrier in the step side direction of the chassis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171633U JPH0177003U (en) | 1987-11-10 | 1987-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171633U JPH0177003U (en) | 1987-11-10 | 1987-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0177003U true JPH0177003U (en) | 1989-05-24 |
Family
ID=31463629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171633U Pending JPH0177003U (en) | 1987-11-10 | 1987-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0177003U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002513218A (en) * | 1998-04-27 | 2002-05-08 | テレフオンアクチーボラゲツト エル エム エリクソン(パブル) | Suitable conductive layer |
-
1987
- 1987-11-10 JP JP1987171633U patent/JPH0177003U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002513218A (en) * | 1998-04-27 | 2002-05-08 | テレフオンアクチーボラゲツト エル エム エリクソン(パブル) | Suitable conductive layer |
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