JPH0177217U - - Google Patents
Info
- Publication number
- JPH0177217U JPH0177217U JP1987172012U JP17201287U JPH0177217U JP H0177217 U JPH0177217 U JP H0177217U JP 1987172012 U JP1987172012 U JP 1987172012U JP 17201287 U JP17201287 U JP 17201287U JP H0177217 U JPH0177217 U JP H0177217U
- Authority
- JP
- Japan
- Prior art keywords
- copper
- tungsten
- contact
- powder
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910001080 W alloy Inorganic materials 0.000 claims 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011812 mixed powder Substances 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Arc-Extinguishing Devices That Are Switches (AREA)
- Contacts (AREA)
Description
第１図は開閉器の側面図、第２図は第１図のＡ
―Ａ矢視図、第３図は本考案の一実施例を示す可
動ブレードの斜視図、第４図はレーザ光照射状態
を示す斜視図である。
１０，１１……可動ブレード、３０……粉末。
Figure 1 is a side view of the switch, Figure 2 is A of Figure 1.
3 is a perspective view of a movable blade showing an embodiment of the present invention, and FIG. 4 is a perspective view showing a laser beam irradiation state. 10, 11...Movable blade, 30...Powder.
Claims (1)
銅とタングステンの混合粉末を配し、高エネルギ
ー密度のレーザ光を照射し前記表面に銅―タング
ステンの合金層を形成した事を特徴とする開閉器
の接触子。 A switch characterized in that tungsten powder or a mixed powder of copper and tungsten is arranged on the surface of a contact made of copper material, and a copper-tungsten alloy layer is formed on the surface by irradiation with high energy density laser light. contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987172012U JPH0177217U (en) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987172012U JPH0177217U (en) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0177217U true JPH0177217U (en) | 1989-05-24 |
Family
ID=31464008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987172012U Pending JPH0177217U (en) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0177217U (en) |
-
1987
- 1987-11-12 JP JP1987172012U patent/JPH0177217U/ja active Pending
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