JPH0179873U - - Google Patents

Info

Publication number
JPH0179873U
JPH0179873U JP1987174854U JP17485487U JPH0179873U JP H0179873 U JPH0179873 U JP H0179873U JP 1987174854 U JP1987174854 U JP 1987174854U JP 17485487 U JP17485487 U JP 17485487U JP H0179873 U JPH0179873 U JP H0179873U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
layer
multilayer printed
laminates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987174854U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987174854U priority Critical patent/JPH0179873U/ja
Publication of JPH0179873U publication Critical patent/JPH0179873U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例による多層印刷配
線基板、第2図はこの考案の他の実施例、第3図
は従来の多層印刷配線基板を示す部分図である。 1は、積層時の多層印刷配線基板、2〜7は第
1層〜第6層の印刷面、8は層番号表示である。
なお、図中同一符号は同一または相当部分を示す
。
FIG. 1 is a partial view showing a multilayer printed wiring board according to one embodiment of this invention, FIG. 2 is a partial view showing another embodiment of this invention, and FIG. 3 is a partial view showing a conventional multilayer printed wiring board. 1 is a multilayer printed wiring board when laminated, 2 to 7 are printed surfaces of the first to sixth layers, and 8 is a layer number display.
Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線板用基材を複数使用し積層して製品と
する多層印刷配線基板において、印刷配線基板を
構成している各層にそれぞれが何番目の層である
かを明確に示す層番号表示を備えた多層印刷配線
基板。
In a multilayer printed wiring board that uses multiple printed wiring board base materials and laminates them to form a product, each layer that makes up the printed wiring board is equipped with a layer number display that clearly indicates the number of each layer. multilayer printed wiring board.
JP1987174854U 1987-11-16 1987-11-16 Pending JPH0179873U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987174854U JPH0179873U (en) 1987-11-16 1987-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987174854U JPH0179873U (en) 1987-11-16 1987-11-16

Publications (1)

Publication Number Publication Date
JPH0179873U true JPH0179873U (en) 1989-05-29

Family

ID=31466686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987174854U Pending JPH0179873U (en) 1987-11-16 1987-11-16

Country Status (1)

Country Link
JP (1) JPH0179873U (en)

Similar Documents

Publication Publication Date Title
JPH03116062U (en)
JPH0179866U (en)
JPH03103771U (en)
JPS60194522U (en) stretch label
JPS63172174U (en)
JPS6056540U (en) Laminated composite for molding
JPH0254268U (en)
JPH03122571U (en)
JPS6054166U (en) Tatami sample for exhibition
JPS6020172U (en) multilayer printed board
JPH02120869U (en)
JPS63198525U (en)
JPH03102767U (en)
JPS63130222U (en)
JPS61106966U (en)
JPS62125494U (en)
JPS58189556U (en) Double-sided copper-clad laminate
JPS6343725U (en)
JPS63146015U (en)
JPS6298269U (en)
JPH0385685U (en)
JPS63140674U (en)
JPH0183366U (en)
JPH0227332U (en)
JPS6393672U (en)