JPH0180258U - - Google Patents
Info
- Publication number
- JPH0180258U JPH0180258U JP1987172323U JP17232387U JPH0180258U JP H0180258 U JPH0180258 U JP H0180258U JP 1987172323 U JP1987172323 U JP 1987172323U JP 17232387 U JP17232387 U JP 17232387U JP H0180258 U JPH0180258 U JP H0180258U
- Authority
- JP
- Japan
- Prior art keywords
- magnets
- processes
- article
- holding mechanism
- fluxer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第４図は本考案の実施例を示し、第
１図は、本考案保持機構を有する自動半田付装置
の正面図、第２図は、同上平面図、第３図は、要
部拡大縦断面図、第４図は、同上左側面図、第５
図は、従来例を示す部分縦断側面図、第６図は、
同上平面図である。
９……無端帯、１１……リンク、１２……スペ
ーサ、１３……マグネツト。
1 to 4 show an embodiment of the present invention, FIG. 1 is a front view of an automatic soldering device having a holding mechanism of the present invention, FIG. 2 is a plan view of the same, and FIG. Fig. 4 is an enlarged vertical sectional view of the same section, and Fig. 5 is a left side view of the same as above.
The figure is a partial vertical side view showing a conventional example, and FIG.
It is a top view same as the above. 9... Endless band, 11... Link, 12... Spacer, 13... Magnet.
Claims (1)
の所要工程へプリント基板を順次に移送せしめる
ようにした装置において、上記工程間に亘つて張
設した無端帯にマグネツトを等隔列設し、該マグ
ネツトにより被半田物を吸着保持して移送するよ
うにしたことを特徴とする自動半田付装置の品物
保持機構。 In a device that sequentially transfers printed circuit boards to required processes such as a fluxer, preheater, solder bath, and cooler, magnets are arranged in equally spaced rows on an endless strip stretched between the processes, and the magnets An article holding mechanism for an automatic soldering device, characterized in that the article to be soldered is held by suction and transferred.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987172323U JPH0180258U (en) | 1987-11-10 | 1987-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987172323U JPH0180258U (en) | 1987-11-10 | 1987-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180258U true JPH0180258U (en) | 1989-05-30 |
Family
ID=31464297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987172323U Pending JPH0180258U (en) | 1987-11-10 | 1987-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180258U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015457A (en) * | 1973-06-08 | 1975-02-18 |
-
1987
- 1987-11-10 JP JP1987172323U patent/JPH0180258U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015457A (en) * | 1973-06-08 | 1975-02-18 |
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