JPH0180264U - - Google Patents
Info
- Publication number
- JPH0180264U JPH0180264U JP1987171796U JP17179687U JPH0180264U JP H0180264 U JPH0180264 U JP H0180264U JP 1987171796 U JP1987171796 U JP 1987171796U JP 17179687 U JP17179687 U JP 17179687U JP H0180264 U JPH0180264 U JP H0180264U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic film
- ceramic
- power supply
- reheated
- melted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案による一実施例の斜視図、第２
図は従来技術による斜視図である。
図において、１はヒータチツプ、１ａは加熱部
、１ａ―１は鏝面、１ｂは給電用電極、２はセラ
ミツクス皮膜、３は高密度セラミツクス皮膜を示
す。
Fig. 1 is a perspective view of one embodiment of the present invention;
The figure is a perspective view according to the prior art. In the figure, 1 is a heater chip, 1a is a heating part, 1a-1 is a trowel surface, 1b is a power supply electrode, 2 is a ceramic film, and 3 is a high-density ceramic film.
Claims (1)
１ａの平坦な鏝面１ａ―１にセラミツクス粉末を
溶射してセラミツクス皮膜２を形成し、更に該セ
ラミツクス皮膜を再加熱溶融してガラス質の高密
度セラミツクス皮膜３に変質させてなることを特
徴とする半田付け用ヒータチツプ。 A ceramic film 2 is formed by thermally spraying ceramic powder on the flat trowel surface 1a-1 of the heating part 1a, which has both ends extended and has a power supply electrode 1b.The ceramic film is then reheated and melted to form a glassy high-quality ceramic film. A soldering heater chip characterized by being made of a density ceramic film 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171796U JPH0180264U (en) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171796U JPH0180264U (en) | 1987-11-09 | 1987-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180264U true JPH0180264U (en) | 1989-05-30 |
Family
ID=31463807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171796U Pending JPH0180264U (en) | 1987-11-09 | 1987-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180264U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011171554A (en) * | 2010-02-19 | 2011-09-01 | Nippon Avionics Co Ltd | Heater tool for thermocompression bonding |
-
1987
- 1987-11-09 JP JP1987171796U patent/JPH0180264U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011171554A (en) * | 2010-02-19 | 2011-09-01 | Nippon Avionics Co Ltd | Heater tool for thermocompression bonding |