JPH0180335U - - Google Patents
Info
- Publication number
- JPH0180335U JPH0180335U JP1987174097U JP17409787U JPH0180335U JP H0180335 U JPH0180335 U JP H0180335U JP 1987174097 U JP1987174097 U JP 1987174097U JP 17409787 U JP17409787 U JP 17409787U JP H0180335 U JPH0180335 U JP H0180335U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- screen printing
- uneven structure
- solder screen
- metal mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例による配線基板の
はんだスクリーン印刷の工程を示し、ａははんだ
スクリーン印刷する前の状態を示す斜視図、ｂは
はんだスクリーン印刷の工程を示した断面図、第
２図は従来のはんだスクリーン印刷の工程を示す
図、第３図は配線基板が２枚重ねで表面に凹凸が
ある場合にはんだスクリーン印刷を行う従来の工
程を示す図である。
図において１ａは上段のメタルマスク、１ｂは
下段のメタルマスク、２ａは上段の配線基板、２
ｂは下段の配線基板、３ははんだ、４はスキージ
である。なお、図中、同一符号は同一、または相
当部分を示す。
FIG. 1 shows the solder screen printing process for a wiring board according to an embodiment of the invention, in which a is a perspective view showing the state before solder screen printing, b is a sectional view showing the solder screen printing process, and FIG. FIG. 2 is a diagram showing a conventional process of solder screen printing, and FIG. 3 is a diagram showing a conventional process of performing solder screen printing when two wiring boards are stacked and have uneven surfaces. In the figure, 1a is an upper metal mask, 1b is a lower metal mask, 2a is an upper wiring board, 2
b is the lower wiring board, 3 is solder, and 4 is a squeegee. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
基板の接する側に凹凸となる張り合せた構造では
んだスクリーン印刷が出来るようにしたことを特
長とするメタルマスク。 A metal mask characterized by a structure in which a wiring board having an uneven structure is bonded with an uneven structure on the side in contact with the wiring board, so that solder screen printing can be performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987174097U JPH0180335U (en) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987174097U JPH0180335U (en) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180335U true JPH0180335U (en) | 1989-05-30 |
Family
ID=31465972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987174097U Pending JPH0180335U (en) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180335U (en) |
-
1987
- 1987-11-12 JP JP1987174097U patent/JPH0180335U/ja active Pending