JPH0180938U - - Google Patents
Info
- Publication number
- JPH0180938U JPH0180938U JP1987176516U JP17651687U JPH0180938U JP H0180938 U JPH0180938 U JP H0180938U JP 1987176516 U JP1987176516 U JP 1987176516U JP 17651687 U JP17651687 U JP 17651687U JP H0180938 U JPH0180938 U JP H0180938U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- joint surface
- insulating layer
- case
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案の一実施例の断面図、第２図及
び第３図は従来の断面図、第４図ａ，ｂは本考案
の原理を説明する図である。
１……ケース、２……メタライズ層、３……キ
ヤツプ、４……メタライズ層、５……はんだ、７
……絶縁層。
FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIGS. 2 and 3 are conventional cross-sectional views, and FIGS. 4a and 4b are diagrams explaining the principle of the present invention. 1... Case, 2... Metallized layer, 3... Cap, 4... Metallized layer, 5... Solder, 7
...Insulating layer.
Claims (1)
のキヤツプとの接合面の外周にメタライズ層を、
内周に絶縁層をもうけ、ケース接合面に対向する
ように外周にメタライズ層を、内周に絶縁層をも
うけてなるキヤツプとを、はんだにて一体になし
たことを特徴とするＩＣパツケージ。 A metallized layer is applied to the outer periphery of the joint surface with the cap of the case, which has a recess that can accommodate a semiconductor chip.
An IC package characterized by having an insulating layer on the inner periphery, a metallized layer on the outer periphery facing the case joint surface, and a cap having an insulating layer on the inner periphery, which are integrated by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176516U JPH0180938U (en) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176516U JPH0180938U (en) | 1987-11-20 | 1987-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180938U true JPH0180938U (en) | 1989-05-30 |
Family
ID=31468246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176516U Pending JPH0180938U (en) | 1987-11-20 | 1987-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180938U (en) |
-
1987
- 1987-11-20 JP JP1987176516U patent/JPH0180938U/ja active Pending
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