JPH0180948U - - Google Patents
Info
- Publication number
- JPH0180948U JPH0180948U JP1987176385U JP17638587U JPH0180948U JP H0180948 U JPH0180948 U JP H0180948U JP 1987176385 U JP1987176385 U JP 1987176385U JP 17638587 U JP17638587 U JP 17638587U JP H0180948 U JPH0180948 U JP H0180948U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- electronic component
- mounting hole
- fin
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の放熱器の一実施例の斜視図、
第２図は第１図の放熱器を使用して電子部品をプ
リント板へ実装した状態の断面図、第３図は従来
の放熱器を用いた電子部品の実装状態の断面図で
ある。
１……放熱器、２……取着穴、３……フイン、
４……ピン、１１……電子部品、１２……パツケ
ージ、１３……リード、２１……放熱器、２２…
…取着穴、２３……フイン、３１……プリント板
。
FIG. 1 is a perspective view of an embodiment of the radiator of the present invention;
FIG. 2 is a cross-sectional view of electronic components mounted on a printed board using the heat sink of FIG. 1, and FIG. 3 is a cross-sectional view of electronic components mounted using a conventional heat sink. 1...Radiator, 2...Mounting hole, 3...Fin,
4...Pin, 11...Electronic component, 12...Package, 13...Lead, 21...Radiator, 22...
...Mounting hole, 23...Fin, 31...Printed board.
Claims (1)
に嵌合する取着穴と、この取着穴の周囲に一体に
形成したフインと、このフインの隅部に突出形成
したピンとを備え、前記電子部品をプリント板に
実装した状態でこのピンの先端をプリント板の表
面に当接させるように構成したことを特徴とする
電子部品の放熱器。 The electronic component is equipped with a mounting hole that fits into a package of an electronic component mounted on a printed board, a fin integrally formed around the mounting hole, and a pin protruding from a corner of the fin. A heatsink for an electronic component, characterized in that the tip of the pin is in contact with the surface of the printed board when mounted on the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176385U JPH0180948U (en) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176385U JPH0180948U (en) | 1987-11-20 | 1987-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180948U true JPH0180948U (en) | 1989-05-30 |
Family
ID=31468126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176385U Pending JPH0180948U (en) | 1987-11-20 | 1987-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180948U (en) |
-
1987
- 1987-11-20 JP JP1987176385U patent/JPH0180948U/ja active Pending
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