JPH018294Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to an improvement of a diamond cutting saw (hereinafter referred to as DCS).

DCS is a metal (copper plate) disk with a bond made of brass, silver, tungsten, etc. mixed with diamond or artificial diamond attached around it, and there are several types depending on the hardness and softness of the metal.

By the way, when cutting stones, etc. with DCS, the stones, etc. are cut with the sharp edge of the diamond, so it is necessary to always provide a sharp diamond.

However, in DCS, which has a hard bond as described above, the bond does not wear out much, so new diamonds mixed in do not appear on the surface, and stones, etc. are cut with old diamonds that have dulled tips. Even though this old diamond has become dull, a certain pressure is applied to the DCS, so the DCS disk is pushed and bent by the pressure, and stones etc. are bent and cut. .
Also, it causes strain on the electric motor.

On the other hand, DCS, which has a soft bond, wears out the bond easily, so it does not have the above-mentioned disadvantages of the hard bond, but it does have the disadvantage of being subject to severe wear.

In addition, DCS according to Utility Application No. 55-130663,
Among the chips arranged at intervals around the circumference of the disk, two chips located symmetrically with respect to the center are formed smaller than chips located at other positions.
However, this DCS produced large vibrations and noise during cutting, and could not cut smoothly when the diameter was larger than 10 inches.

It is an object of the present invention to provide a diamond cutting saw that eliminates the above-mentioned drawbacks, generates relatively little vibration and noise during cutting, and can cut smoothly even diameters larger than 10 inches.

To achieve this objective, the gist of the DCS is that, according to the present invention, the chips located at three positions approximately evenly distributed on the circumference are formed to be slightly smaller than the chips located at other positions.

Next, embodiments of the present invention will be described based on the drawings.

In FIG. 1, 1 is a DCS, around which a group of chips 3 made of bond 2 mixed with diamond are protruded. A groove 4 is provided between adjacent chips 3.

In this DCS 1, according to the present invention, the chips 31 located at three positions approximately equally distributed on the circumference are formed to be slightly smaller than the other chips 3.
There are various ways to make the chip 3 smaller, such as triangular or semicircular, but from the viewpoint of ease of manufacture, it is preferable to make the circumferential length of the chip 3 small.

The number of small chips 31 is generally three, but it varies depending on the size of the DCS, and as the DCS becomes larger, the number of small chips 31 increases. In this case, the small chip 3
1 in succession.

5 is a mounting hole for the rotating shaft.

Next, when cutting stones, etc. using the DCS according to the present invention, a certain load is applied to the DCS, and the smaller chip 31 has a higher load per unit area than the larger chip 3. becomes large.

Therefore, the small chip 31 wears out first,
Height decreases. Then, impact and load are applied to the next chip 3 in the rotational direction, causing the diamond to wear away from the bond. For this reason, the bond comes into direct contact with stones and wears away, and new diamonds appear. In this case, the height of the bond is reduced due to wear, and furthermore, a load is applied to the next chip 3, and the above-mentioned actions are carried out in sequence, so that new diamonds always appear on the surface. FIG. 3 shows an exaggerated view of the wear state of the chip as described above.

Note that the difference between the highest tip and the lowest tip is about 0.3 mm to 1 mm.

In this way, in the present invention, the chips 31 located at three positions approximately evenly distributed on the circumference are made smaller than the chips 3 at other positions, so even with hard bond DCS, it is possible to cut stones etc. Chip 3
It is possible to perform so-called dressing,
New diamonds are constantly appearing on the surface.

Therefore, DCS depends on the hardness and softness of the object to be cut.
You can cut all objects with a type of hard-grained DCS without having to replace it, and it doesn't wear out as hard as soft adhesive, so you don't need to replace it frequently.

In the present invention, the small tips are arranged at three positions dividing the circumference of the disk into three equal parts, so that the small tips are separated as shown in the wear condition of the tips in Figure 3. It is thought that cutting is mainly performed in three sections, that is, with small chips.

Assuming that the depth of cut into the stone by the small chips 31 during one rotation of the DCS is constant, if the small chips are arranged symmetrically, the small chips will cut by half the depth of cut and at a relatively large pitch of 180°. As a result, the vibration and noise during cutting caused by the deflection of the disk become large, whereas in the case of the three-point arrangement of the present invention, the small chip has 1/3 the depth of cut and a finer 120° pitch. Since the cutting is performed with a diameter of 10 inches, the vibration and noise during cutting caused by the deflection of the disc are smaller compared to the symmetrical arrangement described above, and smooth cutting is possible even with a DCS with a diameter larger than 10 inches.

[Brief explanation of the drawing]

FIG. 1 is a front view of the diamond cutting saw of the present invention, FIG. 2 is a side view of the diamond cutting saw of FIG. 1, and FIG. 3 is a state diagram showing the state of reduced friction of the tip. 1...Diamond cutting saw, 3,
31... Chip, 4... Split groove, 5... Rotating shaft mounting hole.

Claims (1)

[Claims for Utility Model Registration] 1. Having a chip made of a bond containing diamond arranged at intervals around the circumference of a disc,
In a diamond cutting saw, the chips at multiple locations where the circumference is divided almost equally are formed to be smaller than the chips at other locations. A diamond cutting saw characterized by being installed in three equally divided positions. 2. A claim for utility model registration in which, in a diamond cutting saw having a relatively large diameter, a plurality of the above-mentioned somewhat small chips are arranged in a row in the circumferential direction at each of the three positions dividing the circumference into thirds. A diamond cutting saw as described in item 1 of the scope. 3. The diamond diamond according to claim 1 of the utility model registration in which the circumferential width of the chips is reduced in order to make the chips located at three positions approximately evenly distributed on the circumference somewhat smaller. Cutting saw. 4. The diamond cutting saw according to claim 1, wherein the bond forming the chip is a hard bond.