JPH0184489U - - Google Patents

Info

Publication number
JPH0184489U
JPH0184489U JP1987181570U JP18157087U JPH0184489U JP H0184489 U JPH0184489 U JP H0184489U JP 1987181570 U JP1987181570 U JP 1987181570U JP 18157087 U JP18157087 U JP 18157087U JP H0184489 U JPH0184489 U JP H0184489U
Authority
JP
Japan
Prior art keywords
hollow body
view
utility
electronic component
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987181570U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987181570U priority Critical patent/JPH0184489U/ja
Publication of JPH0184489U publication Critical patent/JPH0184489U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

【図面の簡単な説明】
第１図と第２図は本考案に係る半導体装置の一
実施例とその動作例を示す斜視図と側面図、第３
図と第４図は本考案に係る半導体装置の他の２つ
の実施例を示す斜視図と側断面図、第５図乃至第
７図は本考案に係る半導体装置の更に他の実施例
を示す側断面図と斜視図と裏面より見た斜視図、
第８図は従来の半導体装置の一具体例を示す斜視
図である。 ６，１２ａ，１２ｂ，１７，２４……中空体、
８，２６……接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 取付面に、接着剤を収容した中空体を固定した
    ことを特徴とする電子部品。
JP1987181570U 1987-11-27 1987-11-27 Pending JPH0184489U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987181570U JPH0184489U (ja) 1987-11-27 1987-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987181570U JPH0184489U (ja) 1987-11-27 1987-11-27

Publications (1)

Publication Number Publication Date
JPH0184489U true JPH0184489U (ja) 1989-06-05

Family

ID=31473051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987181570U Pending JPH0184489U (ja) 1987-11-27 1987-11-27

Country Status (1)

Country Link
JP (1) JPH0184489U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016133104A1 (ja) * 2015-02-20 2016-08-25 学校法人常翔学園 コアシェル粒子混合物、接着剤、反応物の製造方法および積層体の製造方法
JP2019016646A (ja) * 2017-07-04 2019-01-31 Ａｓｔｉ株式会社 半導体取付構造と充電器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763895A (en) * 1980-10-04 1982-04-17 Tdk Electronics Co Ltd Method of mounting chip-shaped electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763895A (en) * 1980-10-04 1982-04-17 Tdk Electronics Co Ltd Method of mounting chip-shaped electronic part

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016133104A1 (ja) * 2015-02-20 2016-08-25 学校法人常翔学園 コアシェル粒子混合物、接着剤、反応物の製造方法および積層体の製造方法
JPWO2016133104A1 (ja) * 2015-02-20 2017-11-30 学校法人常翔学園 コアシェル粒子混合物、接着剤、反応物の製造方法および積層体の製造方法
JP2019016646A (ja) * 2017-07-04 2019-01-31 Ａｓｔｉ株式会社 半導体取付構造と充電器

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