JPH0184500U - - Google Patents
Info
- Publication number
- JPH0184500U JPH0184500U JP1987180759U JP18075987U JPH0184500U JP H0184500 U JPH0184500 U JP H0184500U JP 1987180759 U JP1987180759 U JP 1987180759U JP 18075987 U JP18075987 U JP 18075987U JP H0184500 U JPH0184500 U JP H0184500U
- Authority
- JP
- Japan
- Prior art keywords
- alignment plate
- beads
- electronic component
- cover
- insertion device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Description
第1図、第2図はこの考案の一実施例を示し、
第1図は装置の構成と組立状態を示す斜視図と断
面図、第2図は組立てられた状態を示す側断面図
、第3図は従来例を示す分解構成図である。
図において、同一符号は同一または相当部分を
示し、1は電子部品、1aはリード線、2はビー
ズ、2aは貫通穴、5は整列皿、6は整列皿カバ
ーである。
Figures 1 and 2 show an embodiment of this invention,
FIG. 1 is a perspective view and a sectional view showing the configuration and assembled state of the device, FIG. 2 is a side sectional view showing the assembled state, and FIG. 3 is an exploded configuration diagram showing a conventional example. In the figures, the same reference numerals indicate the same or equivalent parts, 1 is an electronic component, 1a is a lead wire, 2 is a bead, 2a is a through hole, 5 is an alignment plate, and 6 is an alignment plate cover.
Claims (1)
合するカバーとを備えた電子部品のビーズ挿入装
置において、上記整列皿に上記ビーズを整列させ
るとともに、上記電子部品のリード線を上記ビー
ズの貫通穴に通し、上記カバーで上記電子部品を
保持するようにしたことを特徴とする電子部品の
ビーズ挿入装置。 In a bead insertion device for electronic components, which includes an alignment plate for aligning beads and a cover that fits into the alignment plate, the beads are aligned in the alignment plate, and the lead wires of the electronic component are inserted through the beads. A bead insertion device for an electronic component, characterized in that the electronic component is inserted through a hole and held by the cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180759U JPH0184500U (en) | 1987-11-27 | 1987-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180759U JPH0184500U (en) | 1987-11-27 | 1987-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184500U true JPH0184500U (en) | 1989-06-05 |
Family
ID=31472265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180759U Pending JPH0184500U (en) | 1987-11-27 | 1987-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184500U (en) |
-
1987
- 1987-11-27 JP JP1987180759U patent/JPH0184500U/ja active Pending
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