JPH0186237U - - Google Patents
Info
- Publication number
- JPH0186237U JPH0186237U JP1987183465U JP18346587U JPH0186237U JP H0186237 U JPH0186237 U JP H0186237U JP 1987183465 U JP1987183465 U JP 1987183465U JP 18346587 U JP18346587 U JP 18346587U JP H0186237 U JPH0186237 U JP H0186237U
- Authority
- JP
- Japan
- Prior art keywords
- supply device
- cylinder
- solder
- solder supply
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案に係る半田供給装置の一実施例
と溶融半田槽を示す側断面図、第２図は第１図の
半田供給装置側断面と溶融半田の被供給体の側面
を示す各図、第３図は本考案に係る半田供給装置
の他の実施例を示す側断面図、第４図は従来の半
田供給装置の一具体例を示す側面図、第５図と第
６図は第４図の半田供給装置の動作例を示す各側
面図、第７図乃至第９図は第４図の半田供給装置
の問題点を説明するための各側面図である。
４…筒体、６…多孔性保持部材、８…溶融半田
、１０…被供給体。
FIG. 1 is a side sectional view showing an embodiment of the solder supply device according to the present invention and a molten solder tank, and FIG. 2 is a side sectional view of the solder supply device of FIG. 3 is a side sectional view showing another embodiment of the solder supply device according to the present invention, FIG. 4 is a side view showing a specific example of the conventional solder supply device, and FIGS. 5 and 6 are FIG. 4 is a side view showing an example of the operation of the solder supply device, and FIGS. 7 to 9 are side views illustrating problems with the solder supply device shown in FIG. 4. 4... Cylindrical body, 6... Porous holding member, 8... Molten solder, 10... To be supplied.
Claims (1)
半田を収容する筒体に、筒体内の圧力を調整する
手段を接続したことを特徴とする半田供給装置。 1. A solder supply device, characterized in that a cylinder whose lower opening is closed with a porous holding member and which accommodates molten solder is connected to means for adjusting the pressure inside the cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987183465U JPH0186237U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987183465U JPH0186237U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186237U true JPH0186237U (en) | 1989-06-07 |
Family
ID=31474886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987183465U Pending JPH0186237U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186237U (en) |
-
1987
- 1987-11-30 JP JP1987183465U patent/JPH0186237U/ja active Pending