JPH0186718U - - Google Patents
Info
- Publication number
- JPH0186718U JPH0186718U JP18236487U JP18236487U JPH0186718U JP H0186718 U JPH0186718 U JP H0186718U JP 18236487 U JP18236487 U JP 18236487U JP 18236487 U JP18236487 U JP 18236487U JP H0186718 U JPH0186718 U JP H0186718U
- Authority
- JP
- Japan
- Prior art keywords
- bottom plate
- electrode pad
- conductive pattern
- component
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の一実施例の電子部品の底面か
ら見た斜視図、第２図は第１図に示す実施例の側
面図、第３図は第１図に示す実施例の側断面図、
第４図は従来の表面実装部品の一例を示す斜視図
である。
１１……底板、１２……カバー、１３……電極
パツド、１４……リード端子。
Fig. 1 is a perspective view of an electronic component according to an embodiment of the present invention seen from the bottom, Fig. 2 is a side view of the embodiment shown in Fig. 1, and Fig. 3 is a side cross-section of the embodiment shown in Fig. 1. figure,
FIG. 4 is a perspective view showing an example of a conventional surface mount component. 11... Bottom plate, 12... Cover, 13... Electrode pad, 14... Lead terminal.
Claims (1)
する電子部品において、 セラミツク製の底板と、 この底板に保持した部品と、 上記底板を封止するカバーと、 上記底板の底面に形成し上記電子部品の端子を
導出した電極パツドと、 上記底板の面内に位置して上記電極パツドに一
端部を接続し他端部に上記導電パターンに接続す
る接続部を形成したリード板とを具備することを
特徴とする表面実装部品。[Scope of Claim for Utility Model Registration] Electronic components that are attached directly to a conductive pattern formed on the surface of a board: a ceramic bottom plate, a component held on the bottom plate, a cover for sealing the bottom plate, and the bottom plate. an electrode pad formed on the bottom surface of the bottom plate from which the terminal of the electronic component is led out; and a connecting portion located within the plane of the bottom plate that connects one end to the electrode pad and the other end to connect to the conductive pattern. A surface mount component comprising a lead plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18236487U JPH0186718U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18236487U JPH0186718U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186718U true JPH0186718U (en) | 1989-06-08 |
Family
ID=31473812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18236487U Pending JPH0186718U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186718U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027454B2 (en) * | 1976-12-24 | 1985-06-28 | ロ−ベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Decoding circuit to read binary switch status |
-
1987
- 1987-11-30 JP JP18236487U patent/JPH0186718U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027454B2 (en) * | 1976-12-24 | 1985-06-28 | ロ−ベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Decoding circuit to read binary switch status |