JPH0187900U - - Google Patents

Info

Publication number
JPH0187900U
JPH0187900U JP1987184612U JP18461287U JPH0187900U JP H0187900 U JPH0187900 U JP H0187900U JP 1987184612 U JP1987184612 U JP 1987184612U JP 18461287 U JP18461287 U JP 18461287U JP H0187900 U JPH0187900 U JP H0187900U
Authority
JP
Japan
Prior art keywords
cutting die
metal plate
cylinder
drilled
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987184612U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987184612U priority Critical patent/JPH0187900U/ja
Publication of JPH0187900U publication Critical patent/JPH0187900U/ja
Pending legal-status Critical Current

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Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Making Paper Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の実施例を示し、第１図は抜型を
示す斜視図、第２図はシリンダにセツトした状態
断面図、第３図は抜型のベースとなる金属薄平板
を示す斜視図、第４図はレーザーカツト加工を示
す斜視図である。 図中、Ａ：抜型、１：金属薄平板、２：切刃、
３：罫、４，４′：パイロツト穴。 The drawings show an embodiment of the present invention; FIG. 1 is a perspective view showing the cutting die, FIG. 2 is a cross-sectional view of the cutting die set in a cylinder, FIG. 3 is a perspective view showing a thin flat metal plate serving as the base of the cutting die, and FIG. FIG. 4 is a perspective view showing laser cut processing. In the figure, A: cutting die, 1: thin metal plate, 2: cutting blade,
3: Rule, 4, 4': Pilot hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属薄平板に、抜き形状を切断加工すると共に
、所定位置にシリンダセツト用のパイロツト穴を
２個開穿し、その平板を半円筒形に成形し、切断
加工した抜き形状の溝に切刃及び罫を挿入固定し
た回転式抜型。 A punched shape is cut into a thin flat metal plate, two pilot holes are drilled at predetermined positions for setting the cylinder, the flat plate is formed into a semi-cylindrical shape, and a cutting blade and a A rotary cutting die with inserted and fixed ruled lines.
JP1987184612U 1987-12-02 1987-12-02 Pending JPH0187900U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987184612U JPH0187900U (en) 1987-12-02 1987-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987184612U JPH0187900U (en) 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
JPH0187900U true JPH0187900U (en) 1989-06-09

Family

ID=31475960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987184612U Pending JPH0187900U (en) 1987-12-02 1987-12-02

Country Status (1)

Country Link
JP (1) JPH0187900U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015027740A (en) * 2013-07-30 2015-02-12 株式会社梅谷製作所 Corrugated board sheet processing device
JP2018094616A (en) * 2016-12-16 2018-06-21 澁谷工業株式会社 Laser processing apparatus and method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513880A (en) * 1978-07-17 1980-01-31 Honda Motor Co Ltd Display unit for present position for motorcar
JPS59196200A (en) * 1983-04-19 1984-11-07 松尾　正治 Edge tool roll

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513880A (en) * 1978-07-17 1980-01-31 Honda Motor Co Ltd Display unit for present position for motorcar
JPS59196200A (en) * 1983-04-19 1984-11-07 松尾　正治 Edge tool roll

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015027740A (en) * 2013-07-30 2015-02-12 株式会社梅谷製作所 Corrugated board sheet processing device
JP2018094616A (en) * 2016-12-16 2018-06-21 澁谷工業株式会社 Laser processing apparatus and method

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