JPH0188879U - - Google Patents
Info
- Publication number
- JPH0188879U JPH0188879U JP18471187U JP18471187U JPH0188879U JP H0188879 U JPH0188879 U JP H0188879U JP 18471187 U JP18471187 U JP 18471187U JP 18471187 U JP18471187 U JP 18471187U JP H0188879 U JPH0188879 U JP H0188879U
- Authority
- JP
- Japan
- Prior art keywords
- bag
- moisture
- less
- semiconductor device
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000035699 permeability Effects 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
本考案の他の実施例の斜視図、第３図は従来の半
導体装置用防湿包装の斜視図である。
１……半導体装置、２……プラスチツクマガジ
ン、３……ストツパー、４……シリカゲル、５…
…（透湿度１ｇ／m2／２４Ｈ以下の）不透明袋、
６……袋の口（ヒートシール部分）、７ａ，７ｂ
……（透湿度３ｇ／m2／２４Ｈ以下の）透明また
は半透明フイルム部分。
FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a perspective view of another embodiment of the present invention, and FIG. 3 is a perspective view of a conventional moisture-proof packaging for semiconductor devices. 1... Semiconductor device, 2... Plastic magazine, 3... Stopper, 4... Silica gel, 5...
...An opaque bag (with moisture permeability of 1g/m 2 /24H or less),
6...Bag opening (heat seal part), 7a, 7b
...Transparent or translucent film portion (with moisture permeability of 3g/m 2 /24H or less).
Claims (1)
シリカゲルと共に半導体装置を収納し、前記袋の
内側に設けられた熱圧着層により袋の口を完全密
封された半導体装置用防湿包装において、不透明
袋の一部に透湿度３ｇ／m2／２４Ｈ以下の透明ま
たは半透明な部分を設けたことを特徴とする半導
体装置用防湿包装。 Moisture-proof packaging for semiconductor devices in which a semiconductor device is housed together with silica gel in an opaque bag with a moisture permeability of 1 g/m 2 /24H or less, and the mouth of the bag is completely sealed with a thermocompression bonding layer provided inside the bag, A moisture-proof packaging for a semiconductor device, characterized in that a transparent or semi-transparent part with a moisture permeability of 3 g/m 2 /24H or less is provided in a part of the opaque bag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471187U JPH0188879U (en) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471187U JPH0188879U (en) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0188879U true JPH0188879U (en) | 1989-06-12 |
Family
ID=31476052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18471187U Pending JPH0188879U (en) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0188879U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021002601A (en) * | 2019-06-21 | 2021-01-07 | パナソニックＩｐマネジメント株式会社 | Component tape management device, component tape management system, and component tape management method |
| WO2025083922A1 (en) * | 2023-10-19 | 2025-04-24 | 信越ポリマー株式会社 | Packaging bag and packaging method for article |
-
1987
- 1987-12-02 JP JP18471187U patent/JPH0188879U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021002601A (en) * | 2019-06-21 | 2021-01-07 | パナソニックＩｐマネジメント株式会社 | Component tape management device, component tape management system, and component tape management method |
| WO2025083922A1 (en) * | 2023-10-19 | 2025-04-24 | 信越ポリマー株式会社 | Packaging bag and packaging method for article |
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