JPH0189426U - - Google Patents
Info
- Publication number
- JPH0189426U JPH0189426U JP18548887U JP18548887U JPH0189426U JP H0189426 U JPH0189426 U JP H0189426U JP 18548887 U JP18548887 U JP 18548887U JP 18548887 U JP18548887 U JP 18548887U JP H0189426 U JPH0189426 U JP H0189426U
- Authority
- JP
- Japan
- Prior art keywords
- switch
- contact structure
- contact
- contact part
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Contacts (AREA)
Description
図面はこの考案の一実施例を示し、第１図は小
型スイツチの接点構造を示す要部斜視図、第２図
は小型スイツチの接点構造を示す要部縦断面図、
第３図は従来のスイツチの接点構造を示す要部縦
断面図である。
１１……基板、１２……貴金属メツキ線、１３
……線挿通孔、１４……プリント配線、１５……
ハンダ、１６……導電体。
The drawings show an embodiment of this invention, in which Fig. 1 is a perspective view of the main part showing the contact structure of a small switch, and Fig. 2 is a vertical sectional view of the main part showing the contact structure of the small switch.
FIG. 3 is a vertical cross-sectional view of a main part showing the contact structure of a conventional switch. 11...Substrate, 12...Precious metal plated wire, 13
...Wire insertion hole, 14...Printed wiring, 15...
Solder, 16... conductor.
Claims (1)
接離させてスイツチング操作するスイツチの接点
構造であつて、 前記固定接点部を、前記基板を貫通して、該基
板の下面側で所定のプリント配線にハンダ付けし
た導電性の線状体で形成したスイツチの接点構造
。 (2) 線状体は導電性の良好な貴金属メツキ線で
形成した 実用新案登録請求の範囲第１項記載のスイツチ
の接点構造。[Claims for Utility Model Registration] (1) A contact structure for a switch in which switching is performed by bringing a movable contact part into and out of contact with a fixed contact part formed on a substrate, wherein the fixed contact part is inserted through the substrate. , the contact structure of the switch is formed of a conductive linear body soldered to a predetermined printed wiring on the bottom side of the board. (2) The contact structure of the switch according to claim 1 of the utility model registration, wherein the linear body is formed of a noble metal plated wire with good conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18548887U JPH0189426U (en) | 1987-12-04 | 1987-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18548887U JPH0189426U (en) | 1987-12-04 | 1987-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189426U true JPH0189426U (en) | 1989-06-13 |
Family
ID=31476802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18548887U Pending JPH0189426U (en) | 1987-12-04 | 1987-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189426U (en) |
-
1987
- 1987-12-04 JP JP18548887U patent/JPH0189426U/ja active Pending