JPH0189770U - - Google Patents
Info
- Publication number
- JPH0189770U JPH0189770U JP18511887U JP18511887U JPH0189770U JP H0189770 U JPH0189770 U JP H0189770U JP 18511887 U JP18511887 U JP 18511887U JP 18511887 U JP18511887 U JP 18511887U JP H0189770 U JPH0189770 U JP H0189770U
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- dummy part
- pitch
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案実施例による多面取りシート基
板の面付け展開図、第２図は第１図におけるリー
ドフレーム取付け部の拡大図、第３図は従来にお
けるシート基板の面付け展開図、第４図はリード
フレームの構成図である。各図において、
１：多面取りシート基板、２：単体基板、３：
リード挿入穴、６：リードフレーム、７：面付け
ピツチ調整用ダミー部、ｐ：リードフレームのリ
ード間隔ピツチ、Ａ：単体基板の指定横幅寸法、
Ｂ：ダミー部の幅寸法、Ｃ：単体基板とダミー部
を対とする面付けピツチ。
FIG. 1 is a developed view of the multi-panel sheet board according to the embodiment of the present invention, FIG. 2 is an enlarged view of the lead frame attachment part in FIG. 1, and FIG. 3 is a developed view of the conventional sheet board, FIG. 4 is a diagram showing the structure of the lead frame. In each figure, 1: multi-panel sheet board, 2: single board, 3:
Lead insertion hole, 6: Lead frame, 7: Dummy part for surface mounting pitch adjustment, p: Lead spacing pitch of lead frame, A: Specified width dimension of single board,
B: Width dimension of the dummy part, C: Imposition pitch for pairing the single board and the dummy part.
Claims (1)
けして製作されるプリント配線基板において、前
記の多面取り基板上で同列に並べて面付けされた
単体基板の相互間にそれぞれ面付けピツチ調整用
のダミー部を画成し、かつ該ダミー部の幅寸法を
各単体基板とこれに隣接するダミー部を対とした
面付けピツチが各単体基板に植設される外部接続
用リードフレームのリード片ピツチの整数倍とな
るように設定したことを特徴とするプリント配線
基板。 In a printed wiring board manufactured by imposing a plurality of single substrates on a multi-panel sheet board, there is a method for adjusting the mounting pitch between the single substrates arranged in the same row on the multi-panel sheet board. A dummy part is defined, and the width dimension of the dummy part is set as the lead piece pitch of the lead frame for external connection in which the imposition pitch pairs each single board and the dummy part adjacent thereto, and is embedded in each single board. A printed wiring board characterized in that the printed wiring board is set to be an integral multiple of .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18511887U JPH0510378Y2 (en) | 1987-12-04 | 1987-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18511887U JPH0510378Y2 (en) | 1987-12-04 | 1987-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0189770U true JPH0189770U (en) | 1989-06-13 |
| JPH0510378Y2 JPH0510378Y2 (en) | 1993-03-15 |
Family
ID=31476446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18511887U Expired - Lifetime JPH0510378Y2 (en) | 1987-12-04 | 1987-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510378Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003163421A (en) * | 2001-11-28 | 2003-06-06 | Kyocera Corp | Multi-cavity wiring board |
-
1987
- 1987-12-04 JP JP18511887U patent/JPH0510378Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003163421A (en) * | 2001-11-28 | 2003-06-06 | Kyocera Corp | Multi-cavity wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510378Y2 (en) | 1993-03-15 |
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