JPH0189771U - - Google Patents
Info
- Publication number
- JPH0189771U JPH0189771U JP18511687U JP18511687U JPH0189771U JP H0189771 U JPH0189771 U JP H0189771U JP 18511687 U JP18511687 U JP 18511687U JP 18511687 U JP18511687 U JP 18511687U JP H0189771 U JPH0189771 U JP H0189771U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- utility
- model registration
- barcode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図ないし第３図は多面取りシート基板を実
施対象とした本考案の実施例を示すものであり、
第１図は多面取りシート基板の平面図、第２図、
第３図はそれぞれ第１図における矢視―，
―に沿つた拡大断面図である。各図において、
１：多面取りシート基板、１２：銅箔、２：単
体基板、３：ダミー部、５：バーコード、８：は
んだ層。
Figures 1 to 3 show an embodiment of the present invention, which is applied to a multi-sided sheet substrate.
Figure 1 is a plan view of a multi-sided sheet board, Figure 2 is
Figure 3 is the arrow direction in Figure 1, respectively.
- is an enlarged sectional view along the line. In each figure, 1: multi-sided sheet board, 12: copper foil, 2: single board, 3: dummy part, 5: barcode, 8: solder layer.
Claims (1)
分にパターンニング工程で同時に銅箔面上にエツ
チング形成された当該プリント回路基板の型式等
を表示するバーコードを設けたことを特徴とする
プリント回路基板。 (2) 実用新案登録請求の範囲第１項記載のプリ
ント回路基板において、バーコードの表面にはん
だ層が被着されていることを特徴とするプリント
回路基板。 (3) 実用新案登録請求の範囲第１項記載のプリ
ント回路基板において、バーコードが多面取りシ
ート基板のダミー部に形成されていることを特徴
とするプリント回路基板。[Scope of Claim for Utility Model Registration] (1) A bar code indicating the model etc. of the printed circuit board that is etched on the copper foil surface at the same time as the patterning process in a part outside the circuit pattern area on the copper foil laminated board. A printed circuit board characterized by being provided with. (2) Utility Model Registration The printed circuit board according to claim 1, characterized in that a solder layer is adhered to the surface of the barcode. (3) Utility Model Registration The printed circuit board according to claim 1, characterized in that the barcode is formed on a dummy portion of the multi-sided sheet board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18511687U JPH0189771U (en) | 1987-12-04 | 1987-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18511687U JPH0189771U (en) | 1987-12-04 | 1987-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189771U true JPH0189771U (en) | 1989-06-13 |
Family
ID=31476444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18511687U Pending JPH0189771U (en) | 1987-12-04 | 1987-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189771U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145215A (en) * | 1991-11-19 | 1993-06-11 | Taiyo Yuden Co Ltd | Formation of parts-positioning mark for printed wiring board |
| JP2004501518A (en) * | 2000-06-21 | 2004-01-15 | ラウノ サルミ | Method for individually marking the foundation |
-
1987
- 1987-12-04 JP JP18511687U patent/JPH0189771U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145215A (en) * | 1991-11-19 | 1993-06-11 | Taiyo Yuden Co Ltd | Formation of parts-positioning mark for printed wiring board |
| JP2004501518A (en) * | 2000-06-21 | 2004-01-15 | ラウノ サルミ | Method for individually marking the foundation |