JPH0189859U - - Google Patents
Info
- Publication number
- JPH0189859U JPH0189859U JP18671487U JP18671487U JPH0189859U JP H0189859 U JPH0189859 U JP H0189859U JP 18671487 U JP18671487 U JP 18671487U JP 18671487 U JP18671487 U JP 18671487U JP H0189859 U JPH0189859 U JP H0189859U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jet
- flow
- guide frame
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す噴流式はんだ
槽の横断面図、第２図は第１図の―線断面図
、第３図は従来の噴流式はんだ槽の横断面図、第
４図は第３図の―線断面図である。
１……はんだ槽、２……はんだ、２ａ……はん
だ噴流液面、６……プリント基板、１０……はん
だ流れ案内枠、１１，１２……分割仕切り板、１
４ａ，１４ｂ，１４ｃ……はんだ吹き出し口、１
５，１６，１７……噴流用フアン。
FIG. 1 is a cross-sectional view of a jet-flow soldering bath showing an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line -- in FIG. 1, and FIG. 3 is a cross-sectional view of a conventional jet-flow soldering bath. FIG. 4 is a sectional view taken along the line -- in FIG. DESCRIPTION OF SYMBOLS 1...Solder bath, 2...Solder, 2a...Solder jet liquid level, 6...Printed circuit board, 10...Solder flow guide frame, 11, 12...Divided partition plate, 1
4a, 14b, 14c...Solder outlet, 1
5, 16, 17... Jet fan.
Claims (1)
噴流用フアンによるはんだ流れの案内となつて被
はんだ付け基板面に臨んだはんだ吹き出し口から
はんだ噴流を生ぜしめるはんだ流れ案内枠とを備
えた噴流式はんだ槽において、 噴流用フアンを複数個設けるとともに、前記は
んだ流案内枠内に、各噴流用フアン毎にはんだ流
れを案内し、かつ、各噴流用フアン毎の吹き出し
口を形成する分割仕切り板を設けたことを特徴と
する噴流式はんだ槽。[Scope of Claim for Utility Model Registration] A jet fan installed in a solder bath, and a solder that guides the solder flow and generates a solder jet from a solder outlet facing the surface of a board to be soldered. In a jet type soldering bath equipped with a flow guide frame, a plurality of jet fans are provided, and the solder flow is guided for each jet fan within the solder flow guide frame, and the solder flow is guided for each jet fan within the solder flow guide frame, and A jet-flow solder bath characterized by being provided with a dividing partition plate that forms an outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18671487U JPH0189859U (en) | 1987-12-08 | 1987-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18671487U JPH0189859U (en) | 1987-12-08 | 1987-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189859U true JPH0189859U (en) | 1989-06-13 |
Family
ID=31477926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18671487U Pending JPH0189859U (en) | 1987-12-08 | 1987-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189859U (en) |
-
1987
- 1987-12-08 JP JP18671487U patent/JPH0189859U/ja active Pending
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