JPH0191443A - Package for microwave integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a ceramic package for a microwave integrated circuit for accommodating a microwave amplifier or the like. .

(Prior Art) Conventionally, as a ceramic package for accommodating an amplifier or the like constituting a microwave integrated circuit, a first-layer ceramic package with patterned signal electrodes and bias voltage supply electrodes is used, for example, as shown in FIG. A ceramic frame 2 is constructed by laminating the substrate 2A and a second layer ceramic substrate 2B as an insulating layer, and a sealing conductor pattern 6 is provided on the ceramic frame 2. The metal base 1 not only serves as a substrate on which a microwave integrated circuit is mounted, but also serves as a substrate for fixing it to a case (not shown) or the like.

On the outer wall of the ceramic frame 2 on the side connected to an external circuit, etc., except for the area around the electrode pattern, there is a conductor pattern 7 for establishing electrical continuity between the metal base 1 and the sealing metal lid (not shown).
is formed. An integrated circuit amplifier (not shown) is attached to a region 5 of the metal substrate 1 surrounded by the frame 2,
On the other hand, the frame body 2 includes a high frequency input/output electrode pattern 3A,
A plurality of electrode patterns 3B and bias voltage supply electrode patterns 4A and 4B are arranged as shown. That is, frame body 2
The first layer ceramic plate 2A constituting the frame 2 is a ceramic substrate equipped with a high frequency microstrip line 8, a bias voltage supply microstrip line 9, and a grounding conductor pattern 7A, and the second layer constituting the frame 2 The ceramic board 2B is a ceramic substrate as an insulator provided with a grounding conductor pattern 7B.

In this way, the microwave integrated circuit amplifier, the high frequency output electrode pattern 3B, and the bias voltage supply electrode pattern 4B are electrically connected by bonding wires or gold ribbons. 6 is a sealing conductor pattern for hermetic sealing using a lid member (not shown) that covers the upper surface of the frame 2; lO is a sealing conductor pattern for fixing the metal base l to a case (not shown); It's a hole. A lead 11 is connected to the conductor patterns 3A and 3B and is connected to an external circuit (not shown).

As explained above, in a package consisting of a frame made of laminated ceramic, the high-frequency microstrip line 8
Microwaves leaking from the high frequency input terminal 12 (or high frequency output terminal 13) consisting of the high frequency input/output electrode patterns 3A, 3B and the lead terminal 11 are transmitted through the ceramic frame 2 to the high frequency output terminal 13 (or high frequency output terminal 13). Ring resonance generated at the input terminal 12) or caused by the ceramic frame 2 deteriorates the isolation between the high-frequency input and output terminals, leading to a decrease in the gain of the amplifier circuit and oscillation, especially when used at frequencies above several GHz. This was insufficient as a package for accommodating amplifiers and the like that make up a microwave integrated circuit. Furthermore, although the grounding conductor pattern 7 provided on the outer wall of the ceramic frame 2 is effective in grounding the lid member, it promotes the resonance phenomenon caused by the ceramic ring, so it is better not to provide it as explained above. In the form of
Difficulties have arisen in increasing the frequency of the package.

(Problems to be Solved by the Invention) The present invention eliminates the above-mentioned conventional drawbacks, and has a simple structure in which the conductive materials are fitted and integrally formed without using a complicated process. The object of the present invention is to provide an inexpensive package for a microwave integrated circuit that can be used in combination with a grounding conductor pattern to improve electromagnetic shielding and operate at a high frequency up to an ultra-high frequency of 30 GHz band.

(Means for Solving the Problems) The present invention provides a microwave integrated circuit which has a base body to which a microwave integrated circuit is attached, and a ceramic frame body provided on the base body to surround the microwave integrated circuit. In the package, the ceramic frame includes a first ceramic member through which at least one signal line conductor passes, and the first ceramic member.
It consists of two second ceramic members sandwiching a ceramic member, and a conductive material is provided within the cross section of the ceramic frame on both sides of the signal line conductor.

Further, a conductive pattern is provided on the upper and side surfaces of the second ceramic member, and the conductive pattern, the conductive material provided on the cross section of the ceramic frame, and the metal base are conductively connected to each other.

According to the package for a microwave integrated circuit of the present invention, a simple ceramic frame structure in which a ceramic member having a high frequency signal terminal member and a bias supply terminal is fitted and integrally formed through a conductive material; By using a conductive grounding pattern, the electromagnetic shielding properties of the high-frequency input/output terminals are improved without using complicated processes, and the deterioration of high-frequency characteristics caused by microwave leakage through the ceramic frame is prevented. As a result, it is possible to provide an inexpensive package for a microwave integrated circuit that can operate at ultra-high frequencies up to the 30 GHz band.

(Example) Examples of the present invention will be specifically described below with reference to the drawings. FIG. 1(a) is a perspective view of one embodiment of the present invention;
Figure (b) is a side view seen from P-Q in Figure 1 (a),
The figure is a diagram showing measurement results of high frequency characteristics of the present invention.

In FIG. 1(a), 26 is a metal base, 14 is a high frequency ceramic member, 23A and 23B are conductor patterns of a high frequency input/output microstrip line, and 24A.

24B is a conductor pattern of a microstrip line for bias voltage supply, 18 is a ceramic member for the frame excluding the high frequency ceramic member 14, 19 is a conductive material provided on the cross section of the ceramic member, 2OA, 208° 20C is a conductor pattern , 21 is a microwave integrated circuit mounting section, 23
25 is a seal ring, 25 is a screw hole, and 11 is a lead terminal.

The high frequency ceramic member 14 includes a conductor pattern 23 of a microstrip line with 50Ω impedance matching.
A rectangular ceramic substrate 15A having a conductive pattern 23B conductively connected to A and 23B and communicating with the microwave integrated circuit mounting section 21 side, and a rectangular ceramic substrate 15B serving as an insulator smaller than the ceramic substrate are used as line conductors. 23A and 23B are laminated so that a portion thereof is exposed. The frame 18 is electrically connected to bias voltage supply conductor patterns 24A and 24B, and is attached to an L-shaped first layer ceramic substrate 18A having a conductor pattern 24B connected to the microwave integrated circuit mounting section 21 side as an insulator. It is formed by laminating the second layer of ceramic substrates 18B such that conductor patterns 24A and 24B are partially exposed. The L-shaped ceramic member 18 has conductive patterns 24A, 24B and a ceramic substrate 18A in advance.
, 18B and lead terminals 11, conductive patterns 2OA, 20B are formed using a conductive paste material such as tungsten so that conductivity can be established between the ceramic surfaces of the bias supply terminal 22, excluding the insulated portion, on each surface.
Form 20C.

Furthermore, in the high-frequency ceramic member 14, the ceramic surfaces of the side surfaces of the terminals on both sides of the microstrip line conductors 23A and 23B and the upper surface of the ceramic substrate 15B are metalized in advance.

A rectangular frame is formed by applying a conductive material, for example, a conductive paste of molybdenum-manganese alloy, to the end faces of the high-frequency ceramic member 14 and the L-shaped ceramic member 18, and fitting and joining them. Thereafter, it is fired to form a ceramic and hermetically sealed. by this,
The high frequency ceramic member 14 includes an L-shaped ceramic member 18, a conductive material 19, a conductive pattern 2OA,
It has a shielded shape by 20B and 20C.

This rectangular frame 27 is brazed to the metal base 26 so as to have a mounting portion 21 which is a region for mounting a microwave integrated circuit (not shown).

Next, a metal seal ring 23 is brazed to the upper surface of the frame 27 for hermetic sealing.

Leads 11 for connection to an external circuit, etc. are brazed to the line conductors 23A and 24B.

In this way, the signal terminals and bias terminals of the microwave integrated circuit are connected to the line conductors 238.2 by wires or ribbons.
4B, hermetically sealed with a metal lid member, and fixed to a case (not shown) or the like using a screw hole. As a result, a lid member (not shown), a seal ring 23,
Conductive patterns 2OA, 20B.

20C and the conductive material 19 are all electrically connected to the metal base 26 as a grounded substrate.

(Effects of the Invention) As explained above, although the ceramic frame is used, the dielectric portion of the high-frequency ceramic member 14 and the L-shaped ceramic member 1 is connected to the conductive material 19 and the conductive pattern. 2OA, 20B, and 20C are electromagnetically shielded, so leakage electromagnetic waves from the high frequency input terminal A, which was a problem with conventional ceramic packages, are prevented from leaking through the ceramic frame or due to the ring shape of the ceramic frame. Since the generation of unnecessary electromagnetic waves in the high-frequency ceramic member 14 can be suppressed, it is expected that the package will be able to operate at higher frequencies.

Therefore, the characteristics of the package manufactured according to the above explanation are shown in FIG. It can be seen that even in the 30 GHz band, the package of the present invention exhibits no deterioration in insertion loss and achieves high isolation with signal terminal isolation of more than 30 dB or more.

When a conventional ceramic package is applied to a microwave integrated circuit amplifier, problems such as oscillation occur due to poor isolation between signal terminals of the package when the frequency reaches several GHz.

It can be seen that when the package of the present invention is applied to a microwave integrated circuit amplifier, the above problem does not occur, packaging can be performed without impairing the characteristics of the microwave integrated circuit amplifier, and the electromagnetic shielding effect described above is effective.

Therefore, by using the package of the present invention, the electromagnetic shielding properties of the high frequency input/output terminal and the ceramic dielectric frame can be improved without using complicated processes, and the high frequency It is possible to provide an inexpensive package for microwave integrated circuits that can operate at high frequencies up to ultra-high frequencies in the 306H2 band while preventing deterioration of characteristics.

Here, we have described a package with two high-frequency terminals and two bias supply terminals, but there is also a package with one high-frequency terminal and one bias supply terminal applied to an oscillator, etc., or a package with a high-frequency terminal applied to a mixer etc. It is clear that similar effects can be expected in the case of three locations, or one to two bias supply terminals.

Furthermore, it is clear that similar effects can be expected in the case of a package having an input/output high frequency terminal that also serves as a bias supply terminal.

[Brief explanation of the drawing]

FIG. 1(a) is a perspective view showing the structure of the package of the present invention, and FIG. 1(b) is a view of the package of the present invention shown in FIG. 1(a) from P-Q, that is, the high frequency input terminal side. 2 is a diagram showing the measurement results of the high frequency characteristics of the package of the present invention, and FIG. 3 is a perspective view of the conventional package. 1... Metal base 2... Ceramic frame 2A... First layer ceramic plate 2B... Second layer ceramic plate 3A, 3B... High frequency input/output electrode pattern 4^,
4B...Bias voltage supply electrode pattern 5...
One area of metal basic 1 6...Sealing conductor pattern 7...Conductor pattern 7
^, 7B...Grounding conductor pattern 8...High frequency microstrip line 9...Microstrip line 10...Screw hole 11...Lead terminal 1
2... High frequency input terminal 13... High frequency output terminal 14A... Ceramic member for high frequency input terminal 14B.
...Ceramic members for high frequency output terminals 15A, 15B
Ceramic substrate 18 L-shaped ceramic member 18A First layer ceramic substrate 18B Second layer ceramic substrate 19 Conductive material 2OA, 20B, 20C Conductive Pattern 21・
...Microwave integrated circuit mounting section 22...Bias supply terminal 23...Seal rings 23A, 23B...High frequency input/output conductor patterns 24A, 24B...Bias voltage supply conductor pattern 25...・Screw 26...Metal base 27...Frame

Claims (1)

[Scope of Claims] 1. A microwave integrated circuit package having a base to which a microwave integrated circuit is attached, and a ceramic frame provided on the base to surround the microwave integrated circuit, wherein the ceramic frame The body includes a first ceramic member through which at least one signal line conductor passes, and two second ceramic members sandwiching the first ceramic member, and a ceramic frame is provided on both sides of the signal line conductor within the cross section of the ceramic frame. A microwave integrated circuit package characterized by being provided with a conductive material. 2. A conductive pattern is provided on the top and side surfaces of the second ceramic member, and the conductive pattern, the conductive material provided on the cross section of the ceramic frame, and the metal base are electrically connected to each other. A package for a microwave integrated circuit according to claim 1.