JPH0191520U - - Google Patents
Info
- Publication number
- JPH0191520U JPH0191520U JP1987186961U JP18696187U JPH0191520U JP H0191520 U JPH0191520 U JP H0191520U JP 1987186961 U JP1987186961 U JP 1987186961U JP 18696187 U JP18696187 U JP 18696187U JP H0191520 U JPH0191520 U JP H0191520U
- Authority
- JP
- Japan
- Prior art keywords
- resin sealing
- upper mold
- lower mold
- mold
- clamped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987186961U JPH0191520U (de) | 1987-12-07 | 1987-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987186961U JPH0191520U (de) | 1987-12-07 | 1987-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0191520U true JPH0191520U (de) | 1989-06-15 |
Family
ID=31478154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987186961U Pending JPH0191520U (de) | 1987-12-07 | 1987-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0191520U (de) |
-
1987
- 1987-12-07 JP JP1987186961U patent/JPH0191520U/ja active Pending