JPH0192139U - - Google Patents
Info
- Publication number
- JPH0192139U JPH0192139U JP18820287U JP18820287U JPH0192139U JP H0192139 U JPH0192139 U JP H0192139U JP 18820287 U JP18820287 U JP 18820287U JP 18820287 U JP18820287 U JP 18820287U JP H0192139 U JPH0192139 U JP H0192139U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal substrate
- earth lead
- airtight terminal
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案に係る気密端子の一実施例を示
す正断面図、第２図は前記気密端子の封着時を示
す正断面図である。第３図は従来の気密端子の正
断面図、第４図及び第５図は従来の気密端子の製
造工程における正断面図である。
１……金属基板（ステム基板）、３……透孔、
５……ガラス、６……リード線、１１……貫通孔
、２１……アースリード、２１ａ……膨出部。
FIG. 1 is a front sectional view showing an embodiment of the airtight terminal according to the present invention, and FIG. 2 is a front sectional view showing the airtight terminal when sealed. FIG. 3 is a front sectional view of a conventional airtight terminal, and FIGS. 4 and 5 are front sectional views of the conventional airtight terminal in the manufacturing process. 1...Metal substrate (stem substrate), 3...Through hole,
5...Glass, 6...Lead wire, 11...Through hole, 21...Earth lead, 21a...Bulging portion.
Claims (1)
ド線を封着するとともに、貫通孔に無電解ニツケ
ルメツキを施したアースリードを嵌挿一体化する
ものにおいて、 上記アースリードの金属基板下面との隣接位置
に貫通孔の径よりも大きい膨出部を形成したこと
を特徴とする気密端子。[Scope of Claim for Utility Model Registration] A device in which a lead wire is sealed through a glass through a through hole drilled in a metal substrate, and an earth lead plated with electroless nickel is inserted and integrated into the through hole, An airtight terminal characterized in that a bulge larger than the diameter of a through hole is formed at a position adjacent to the lower surface of a metal substrate of an earth lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18820287U JPH0192139U (en) | 1987-12-09 | 1987-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18820287U JPH0192139U (en) | 1987-12-09 | 1987-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0192139U true JPH0192139U (en) | 1989-06-16 |
Family
ID=31479312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18820287U Pending JPH0192139U (en) | 1987-12-09 | 1987-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0192139U (en) |
-
1987
- 1987-12-09 JP JP18820287U patent/JPH0192139U/ja active Pending
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