JPH0193761U - - Google Patents

Info

Publication number
JPH0193761U
JPH0193761U JP19029887U JP19029887U JPH0193761U JP H0193761 U JPH0193761 U JP H0193761U JP 19029887 U JP19029887 U JP 19029887U JP 19029887 U JP19029887 U JP 19029887U JP H0193761 U JPH0193761 U JP H0193761U
Authority
JP
Japan
Prior art keywords
film hybrid
printed circuit
flexible printed
thick film
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19029887U
Other languages
Japanese (ja)
Other versions
JPH0517899Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19029887U priority Critical patent/JPH0517899Y2/ja
Publication of JPH0193761U publication Critical patent/JPH0193761U/ja
Application granted granted Critical
Publication of JPH0517899Y2 publication Critical patent/JPH0517899Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案による厚膜ハイブリツドＩＣ
（厚膜ＨＩＣ）の一実施例を示す正面図、第２図
は第１図のものの平面図、第３図は第１図のもの
の側面図、第４図は第１図のものの展開斜視図、
第５図は第４図のものの要部の拡大説明図、第６
図は従来の厚膜ＨＩＣの一例を示す正面図、第７
図は第６図のものの平面図である。 １，１１…ＨＩＣ基板、２，１２…ＦＰＣ、３
…端子部、４，１４…端子ピン、１５…ＦＰＣ補
強板。 Figure 1 shows a thick film hybrid IC based on this idea.
(Thick film HIC) A front view showing one embodiment of the HIC, Figure 2 is a plan view of the one in Figure 1, Figure 3 is a side view of the one in Figure 1, and Figure 4 is an exploded perspective view of the one in Figure 1. ,
Figure 5 is an enlarged explanatory view of the main parts of Figure 4, and Figure 6
The figure is a front view showing an example of a conventional thick film HIC.
The figure is a plan view of the one shown in FIG. 1, 11...HIC board, 2, 12...FPC, 3
...Terminal part, 4, 14...Terminal pin, 15...FPC reinforcing plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 片面に部品が実装された２枚の厚膜ハイブリツ
ドＩＣ基板の非実装面どうしを、両者間にフレキ
シブルプリントサーキツトを挟んで重ね合わせ、
前記両厚膜ハイブリツドＩＣ基板の端子部と前記
フレキシブルプリントサーキツトの端子部とを導
電性の端子ピンで接合してなる厚膜ハイブリツド
ＩＣ。 The non-mounted surfaces of two thick-film hybrid IC boards with components mounted on one side are stacked together with a flexible printed circuit sandwiched between them.
A thick film hybrid IC formed by connecting the terminal portions of both of the thick film hybrid IC substrates and the terminal portion of the flexible printed circuit with conductive terminal pins.
JP19029887U 1987-12-15 1987-12-15 Expired - Lifetime JPH0517899Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19029887U JPH0517899Y2 (en) 1987-12-15 1987-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19029887U JPH0517899Y2 (en) 1987-12-15 1987-12-15

Publications (2)

Publication Number Publication Date
JPH0193761U true JPH0193761U (en) 1989-06-20
JPH0517899Y2 JPH0517899Y2 (en) 1993-05-13

Family

ID=31481283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19029887U Expired - Lifetime JPH0517899Y2 (en) 1987-12-15 1987-12-15

Country Status (1)

Country Link
JP (1) JPH0517899Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173394A (en) * 2004-12-16 2006-06-29 Fujikura Ltd How to connect printed circuit boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173394A (en) * 2004-12-16 2006-06-29 Fujikura Ltd How to connect printed circuit boards

Also Published As

Publication number Publication date
JPH0517899Y2 (en) 1993-05-13

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