JPH0194696A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0194696A JPH0194696A JP25177787A JP25177787A JPH0194696A JP H0194696 A JPH0194696 A JP H0194696A JP 25177787 A JP25177787 A JP 25177787A JP 25177787 A JP25177787 A JP 25177787A JP H0194696 A JPH0194696 A JP H0194696A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- conductor
- opening
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、基材上に形成された導体のうちの接続用の端
子となる部分に対応する位置に方形の開口を有する絶縁
被膜か形成されたプリント配線板に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to the formation of an insulating coating having a rectangular opening at a position corresponding to a portion of a conductor formed on a base material that becomes a connection terminal. The present invention relates to a printed wiring board.
（従来の技術）
従来、プリント配線板の基材に形成された導体を被覆す
る絶縁被膜には、前記導体のうち接続用の端子となる部
分を露出させるために、第６図及び第７図に示すような
方形成いは円形の開口（２３ａ） （２：ｌｂ）か接続
用の端子（１１）となる導体に対応する位置に形成され
ている。(Prior Art) Conventionally, an insulating film covering a conductor formed on a base material of a printed wiring board has a coating shown in FIGS. 6 and 7 in order to expose a portion of the conductor that will become a connection terminal. A rectangular or circular opening (23a) (2:lb) as shown in FIG.
近年、プリント配線板にあっては、高密度配線及び高密
度実装が望まれており、その導体のうちの接続用の端子
となる部分は、高密度配線及び高密度実装に合致する方
形のものが主流となっている。そして、導体を保護する
ための絶縁被膜の、Ｌ記接続用の端子となる部分に、こ
れを露出させるための開口か形成されるが、この開口は
方形の接続用の端子の外形に合わせるため、或いは単に
設計のしやすさから、第６図に示したような方形の開口
（２３ａ）として形成される。In recent years, high-density wiring and high-density packaging are desired for printed wiring boards, and the portions of the conductors that serve as connection terminals are rectangular to meet high-density wiring and high-density packaging. has become the mainstream. Then, an opening is formed in the part of the insulating coating for protecting the conductor that will become the terminal for the L connection, to expose it, but this opening is made to match the outline of the rectangular connection terminal. , or simply for ease of design, it may be formed as a rectangular opening (23a) as shown in FIG.
（発明が解決しようとする問題点）
しかしながら、方形の開口（２３ａ）が形成された絶縁
被膜（２２）を有する従来のプリント配線板にあっては
、絶縁液［（２２）の開口（２３ａ）のコーナーか略直
角に形成されているので、温度変化の激しい環境下て使
用した場合、熱伸縮の作り返しによる歪か開口（２：ｌ
ａ）の直角コーナーに集中してしまう。このため、第６
図に示したように、絶縁被膜（２２）の開口（２：ｌａ
）のコーナーを形成している部分にクラック（２４）か
発生し、このクラック（２４）により導体間の絶縁抵抗
値か低下するという欠点を有している。すなわち、絶縁
液１０ （２２）にクラック（２４）か発生すると、こ
のクラック（２４）部分から絶縁被膜（２２）とプリン
ト配線板の基材或いは導体との密着が熱伸縮や湿気等に
よって除々に弱くなり、ひいては導体を保護するために
形成したはずの絶縁被膜（２２）の役目を果たさなくな
ってしまうのである。(Problems to be Solved by the Invention) However, in a conventional printed wiring board having an insulating coating (22) in which a rectangular opening (23a) is formed, the insulating liquid [opening (23a) of (22) The corners of the corners are formed at almost right angles, so when used in environments with rapid temperature changes, distortion due to thermal expansion and contraction or openings (2:l) may occur.
I end up concentrating on the right angle corner of a). For this reason, the sixth
As shown in the figure, the opening (2: la
) has the disadvantage that cracks (24) occur at the corners of the conductors, and the cracks (24) reduce the insulation resistance between the conductors. In other words, when a crack (24) occurs in the insulating liquid 10 (22), the adhesion between the insulating coating (22) and the printed wiring board base material or conductor gradually deteriorates from the crack (24) portion due to thermal expansion and contraction, moisture, etc. This weakens the conductor, and eventually it no longer plays the role of the insulating film (22) that was supposed to be formed to protect the conductor.
以、１−のような問題点は、高密度配線された高密度実
装か行なわれるプリント配線板の特に部品実装部におい
て顕著に見られる。これは、プリント配線板の各部位の
中て部品実装部が従来にない高密度配線を実現する部位
てあり、かつ最も過激な温度変化にさらされる部位だか
らである。これらの部品実装部は、具体的には前述した
導体のうちの第６図に示したような接続用の端子（１１
）となる方形の部分である。Problems like 1- above are particularly noticeable in the component mounting portion of printed wiring boards where high-density wiring and high-density mounting are performed. This is because, among the various parts of the printed wiring board, the component mounting part is the part that realizes unprecedentedly high-density wiring, and is also the part that is exposed to the most drastic temperature changes. Specifically, these component mounting parts are connected to connection terminals (11
) is a square part.
本発明は以トのような実状に鑑みてなされたものてあり
、その目的は、高密度配線及び高密度実装に適し、温度
変化の激しい環境下で使用した場合であって・ｂ、ａ伸
縮によりクラックか発生することがなく、導体間の絶縁
抵抗値が低下することのない、＃Ｊ熱熱衝性性優れた絶
縁被膜を有するプリント配線板を簡単な構成により提供
することにある。The present invention was made in view of the following circumstances, and its purpose is to provide a device suitable for high-density wiring and high-density packaging, and to be used in an environment with severe temperature changes. An object of the present invention is to provide a printed wiring board having a simple structure and having an insulating coating with excellent #J thermal resistance, which does not cause cracks or reduce the insulation resistance value between conductors.
（問題点を解決するための手段）
以上のような問題点を解決するために本発明の採った手
段を図面に従って説明すると、ｒ基材（１０）上に形成
された導体のうちの接続用の端子（１１）となる部分に
対応する位置に方形の開口（１３）を有する絶縁被膜（
１２）か形成されたプリント配線板において、
前記絶縁被膜（１２）の開口（１３）のコーナーを面取
りしたことを特徴とするプリント配線板１である。(Means for Solving the Problems) The means taken by the present invention to solve the above problems will be explained with reference to the drawings. An insulating coating (
12) The printed wiring board 1 is characterized in that the corner of the opening (13) of the insulating coating (12) is chamfered.
すなわち１本発明は、基材（ｌＯ）に形成された導体を
被覆する絶縁被膜（１２）の方形の開口（１３）のコー
ナーを面取りすることに特徴かある。That is, one feature of the present invention is that the corners of the rectangular opening (13) of the insulating coating (12) covering the conductor formed on the base material (1O) are chamfered.
本発明が対象とするプリント配線板にあっては、その基
材（１０）上に形成された導体を絶縁被膜（１２）によ
って保護するものであるが、本発明はこの導体のうちの
特に接続用の端子Ｈ）となる部分を対象としているもの
である。この接続用の端子（１１）となる部分は、プリ
ント配線板が外部と接触接続されたり、或いはワイヤボ
ンディング、半田付は笠によって部品の端子か接続され
る部分である。In the printed wiring board to which the present invention is directed, the conductor formed on the base material (10) is protected by an insulating coating (12). This is intended for the part that will become the terminal H) for the first time. The portion that becomes the connection terminal (11) is a portion where the printed wiring board is brought into contact with the outside, or where a terminal of a component is connected by wire bonding or soldering using a cap.
絶縁被膜（１２）の開口（１３）のコーナーの形状は。What is the shape of the corner of the opening (13) in the insulation coating (12)?
第１図に示すような円形、或いは第２Ｕ；！Ｊに示すよ
うな複数の鈍角か形成されたもの等、絶縁被膜（１２）
か熱伸縮を繰り返した場合、熱伸縮による歪か一点に集
中しないよう、これが分散されるような形状であればど
のような形状でもよい。特にコーナーの形状を円形にす
る場合には、その曲率半径が０．１ｍｍ以上となるよう
面取りするのか好ましい。なぜなら、その曲率半径か０
．１ｍｍより小さいと、熱伸縮による歪を分散させるこ
とができず、充分な効果が得られないためである。Circular as shown in Figure 1 or 2U;! Insulating coating (12), such as one formed with multiple obtuse angles as shown in J.
Any shape may be used as long as the distortion caused by thermal expansion and contraction is dispersed so that it is not concentrated in one point when thermal expansion and contraction is repeated. In particular, when the corner is circular, it is preferable to chamfer the corner so that the radius of curvature is 0.1 mm or more. Because its radius of curvature is 0
．． This is because if it is smaller than 1 mm, distortion due to thermal expansion and contraction cannot be dispersed, and a sufficient effect cannot be obtained.
しかしながら、逆にコーナーの曲率半径を大きくし過ぎ
ると、高密度配線及び高密度実装の妨げとなる場合もあ
るので、配線状態及び実装状態に応じて適宜決定する必
要かある。 また、絶縁被１模（Ｉ２）の開口（」３）
は、基材（１０）に形成された導体のうち接続用の端子
（１１）となる導体を露出させるものであるが、必ずし
も接続用の端子（１１）となる導体全体を露出させる必
要はなく、第３図及び第４図に示すように、部分的に露
出させるものてもよい。さらには、絶縁被膜（１２）の
開口（１３）は、第５図に示すような隣接する複数の接
続用の端子（１１）となる導体をまとめて露出させるも
のでもよい。However, if the radius of curvature of the corner is made too large, it may impede high-density wiring and high-density packaging, so it is necessary to appropriately determine the radius of curvature depending on the wiring state and mounting state. In addition, the opening of the insulation sheath 1 (I2) ("3)
The method exposes the conductor that will become the connection terminal (11) among the conductors formed on the base material (10), but it is not necessarily necessary to expose the entire conductor that will become the connection terminal (11). , as shown in FIGS. 3 and 4, it may be partially exposed. Furthermore, the opening (13) in the insulating coating (12) may expose a plurality of adjacent conductors serving as connection terminals (11) all at once as shown in FIG.
なお、本発明にあっては、絶縁被膜（１２）の材質、厚
み、その形成方法にあっては特に限定されず、当然基材
及びこの基材に形成される導体の材質、形状、その製造
方法にあっても特に限定されない。In the present invention, the material, thickness, and method of forming the insulating coating (12) are not particularly limited, and naturally the material, shape, and manufacturing method of the base material and the conductor formed on this base material are not limited. There are no particular limitations on the method.
また、発明が解決しようとする問題点にて記載した如く
、本発明の効果が特に顕著に現われる部品実装部におけ
る接続用の端子に対応する部位に設けた絶縁被膜にも本
発明を適用できることは言うまてもないことである。Furthermore, as described in the section on the problems to be solved by the invention, the present invention can also be applied to an insulating coating provided at a portion corresponding to a connection terminal in a component mounting area, where the effects of the present invention are particularly noticeable. Needless to say.
（発明の作用）
上述のような手段を採ることにより、以下のような作用
がある。(Actions of the invention) By adopting the above-mentioned means, the following effects can be obtained.
絶縁被膜の開口のコーナーを面取りしたことにより、絶
縁被膜か熱伸縮を作り返しても歪がコーナーに集中する
ことがなく、クラックか発生しないようになっている。By chamfering the corners of the openings in the insulating coating, even if the insulating coating undergoes thermal expansion and contraction, strain will not be concentrated at the corners and cracks will not occur.
このため、導体間の絶縁抵抗値が低下することがなく、
必要とされる導体間の絶縁抵抗値は常に維持される。Therefore, the insulation resistance value between conductors does not decrease,
The required insulation resistance between conductors is always maintained.
（実施例）
以下、図面に示す実施例に従って本発明の詳細な説明す
る。(Example) Hereinafter, the present invention will be described in detail according to an example shown in the drawings.
実施例１
板厚１．６ｍｍのガラスエポキシ基材（１０）上に、通
常の方法で導体回路を形成した。この導体回路のうち接
触接続用の端子（１１）となる導体に対応する位置に開
口（１３）を有する厚さ２０ｐＬｍの絶縁被膜（１２）
を、液状のフォトソルダーレジストインクを使用して形
成した。この際、開口（１３）のコーナーは、第１図に
示すように、その曲率半径か０．２ｍｍとなる円形に面
取りした。Example 1 A conductive circuit was formed on a glass epoxy base material (10) with a plate thickness of 1.6 mm by a conventional method. An insulating coating (12) with a thickness of 20 pLm having an opening (13) at a position corresponding to a conductor that will become a contact connection terminal (11) in this conductor circuit.
was formed using liquid photo solder resist ink. At this time, the corner of the opening (13) was chamfered into a circle with a radius of curvature of 0.2 mm, as shown in FIG.
実施例２
板厚０．１ｍｍの耐熱ガラスエポキシ基材（ｌＯ）上に
、通常の方法で導体回路を形成した。この導体回路のう
ちボンディング接続用の端子（１１）となる導体に対応
する位置に開口（１３）を有する厚さ１０ＩＬｍの絶縁
被膜（１２）を、熱硬化型ソルダーレジストインクをス
クリーン印刷することにより形成した。この際、開口（
１３）のコーナーは、第２図に示すように、１３５”の
鈍角が２つ形成されるように面取りした。Example 2 A conductor circuit was formed on a heat-resistant glass epoxy base material (IO) having a thickness of 0.1 mm by a conventional method. By screen printing thermosetting solder resist ink, an insulating coating (12) with a thickness of 10 ILm having an opening (13) at a position corresponding to a conductor that will become a terminal (11) for bonding connection in this conductor circuit is formed. Formed. At this time, the opening (
The corners of 13) were chamfered to form two obtuse angles of 135'' as shown in FIG.
実施例３
板厚１．６ｍｍのガラスポリイミド基材（１０）上に、
通常の方法て導体回路を形成した。この導体回路のうち
半田接続用の端子（１１）となる導体に対応する位置に
開口（１３）を有する厚さ２０ｇｍの絶。Example 3 On a glass polyimide base material (10) with a plate thickness of 1.6 mm,
A conductor circuit was formed using conventional methods. This conductor circuit has an opening (13) at a position corresponding to a conductor that will become a terminal (11) for solder connection, and has a thickness of 20 gm.
縁被膜（１２）を、液状のフォトソルダーレジストイン
クを使用して形成した。この際、開口（１３）のコーナ
ーは、ｉｉ図に示すように、その曲率半径が０．１ｍｍ
となる円形に面取りした。An edge coating (12) was formed using a liquid photo solder resist ink. At this time, the corner of the opening (13) has a radius of curvature of 0.1 mm, as shown in Figure ii.
It was chamfered into a circular shape.
比較例
実施例１と同様、板厚１．６ｍｍのガラスエポキシノ、
（材（１０）ヒに、通常の方法で導体回路を形成した。Comparative Example Same as Example 1, glass epoxy resin with a plate thickness of 1.6 mm,
(A conductor circuit was formed on material (10) using a conventional method.
この導体回路のうち接触接続用の端子（１］）となる導
体に対応する位置に開口（２３ａ）を有する厚さ２０Ｊ
Ｌｍの絶縁被膜（２２ａ）を液状のフォトソルダーレジ
ストインクを使用して形成した。開口（２３ａ）のコー
ナーは、第６図に示すように、直角とした（実際は、絶
縁波１１５１！（２２ａ）形成の際の不完全さにより、
曲率半径０．０５ｍｍの丸みが形成された）。A thickness of 20J with an opening (23a) at a position corresponding to the conductor that becomes the contact connection terminal (1]) in this conductor circuit.
The insulating film (22a) of Lm was formed using liquid photo solder resist ink. As shown in FIG. 6, the corners of the opening (23a) are made at right angles (actually, due to imperfections in the formation of the insulating wave 1151! (22a),
A roundness with a radius of curvature of 0.05 mm was formed).
以上のようにして得られた４種類のプリント配線板を、
常温から５分間で１２５℃にまで昇温させ、１２５℃で
３０分間維持した後、５分間で常温まて冷却し、常温で
５分間維持した。次いで、常温から５分間て一６５°Ｃ
にまで冷却し、−６５°Ｃで３０分間維持した後、５分
間で常温まで昇温させた。これをｌＯＯサイクル繰り返
す熱衝撃試験を行ない、３０倍の実体顕微鏡にて外部ｒ
ＪＡ察し、また各導体間の絶縁抵抗値を測定した。The four types of printed wiring boards obtained as described above are
The temperature was raised from room temperature to 125°C in 5 minutes, maintained at 125°C for 30 minutes, cooled to room temperature in 5 minutes, and maintained at room temperature for 5 minutes. Then, from room temperature to -65°C for 5 minutes.
After cooling to -65°C for 30 minutes, the temperature was raised to room temperature for 5 minutes. A thermal shock test was performed by repeating this for 100 cycles, and external r
JA and also measured the insulation resistance value between each conductor.
その結果を表に示す。The results are shown in the table.
（以下、余白）
（発明の効果）
以ヒのように本発明に係るプリント配線板は、ｒ ）、
ｔｉ材上に形成された導体のうちの接続用の端子となる
部分に対応する位置に方形の開口を有する絶縁被膜が形
成されたプリント配線板において、
前記絶縁被膜の開口のコーナーを面取りしたこと」にそ
の特徴があり、これにより温度変化の激しい環境下で使
用した場合であっても、熱伸縮による歪がコーナーに集
中することがないため、クラックか発生することがなく
、導体間の絶縁抵抗値が低下することのない、耐熱衝撃
性に優れた絶縁被膜を有するプリント配線板とすること
ができる。(Hereinafter, blank space) (Effects of the invention) As shown below, the printed wiring board according to the present invention has the following features:
In a printed wiring board on which an insulating coating is formed having a rectangular opening at a position corresponding to a portion of a conductor formed on a Ti material that becomes a connection terminal, the corner of the opening of the insulating coating is chamfered. Even when used in an environment with severe temperature changes, distortion due to thermal expansion and contraction does not concentrate at the corners, so cracks do not occur and the insulation between conductors is improved. It is possible to obtain a printed wiring board having an insulating coating with excellent thermal shock resistance and no decrease in resistance value.
第１図は本発明に係るプリント配線板の絶縁被膜の開口
部を示す部分拡大平面図、第２図〜第５図は本発明に係
るプリント配線板の絶縁被膜の別の開口部を示す部分拡
大平面図、第６図は従来のプリント配線板の絶縁被膜の
方形の開口部を示す部分拡大平面図、第７図は従来のプ
リント配線板の絶縁被膜の円形の開口部を示す部分拡大
平面図である。
符号の説明
１０−・・基材 目・・・接続用の端子１２
−・・絶縁波ｖ１３・・・開口
２２・・・絶縁被膜 ２３・・・開口２４・・−
クラックFIG. 1 is a partially enlarged plan view showing an opening in an insulating coating of a printed wiring board according to the present invention, and FIGS. 2 to 5 are parts showing other openings in an insulating coating of a printed wiring board according to the present invention. 6 is a partially enlarged plan view showing a rectangular opening in the insulating coating of a conventional printed wiring board; FIG. 7 is a partially enlarged plan view showing a circular opening in the insulating coating of a conventional printed wiring board. It is a diagram. Explanation of symbols 10 - Base material Eye... Connection terminal 12
-... Insulated wave v13... Opening 22... Insulating coating 23... Opening 24... -
crack
Claims (1)
なる部分に対応する位置に方形の開口を有する絶縁被膜
が形成されたプリント配線板において、 前記絶縁被膜の開口のコーナーを面取りしたことを特徴
とするプリント配線板。 ２）．前記開口のコーナーをその曲率半径が０．１ｍｍ
以上となる円形に面取りしたことを特徴とする特許請求
の範囲第１項記載のプリント配線板。[Claims] 1). In a printed wiring board in which an insulating coating is formed with a rectangular opening at a position corresponding to a portion of a conductor formed on a base material that becomes a connection terminal, the corner of the opening of the insulating coating is chamfered. A printed wiring board featuring: 2). The radius of curvature of the corner of the opening is 0.1 mm.
The printed wiring board according to claim 1, characterized in that the printed wiring board is chamfered into a circular shape as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25177787A JPH0194696A (en) | 1987-10-06 | 1987-10-06 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25177787A JPH0194696A (en) | 1987-10-06 | 1987-10-06 | Printed wiring board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19720692A Division JPH05206622A (en) | 1992-07-23 | 1992-07-23 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0194696A true JPH0194696A (en) | 1989-04-13 |
| JPH0582076B2 JPH0582076B2 (en) | 1993-11-17 |
Family
ID=17227768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25177787A Granted JPH0194696A (en) | 1987-10-06 | 1987-10-06 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0194696A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479475U (en) * | 1990-11-20 | 1992-07-10 | ||
| WO2006053036A3 (en) * | 2004-11-10 | 2006-07-06 | Unitive Int Ltd | Non-circular via holes for bumping pads and related structures |
| US7531898B2 (en) | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
| US7547623B2 (en) | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
| US7703889B2 (en) | 2004-04-26 | 2010-04-27 | Brother Kogyo Kabushiki Kaisha | Printed wiring board and electric device using the same |
| JP2013004919A (en) * | 2011-06-21 | 2013-01-07 | Ibiden Co Ltd | Printed wiring board and manufacturing method therefor |
| WO2026074615A1 (en) * | 2024-10-01 | 2026-04-09 | 三菱電機株式会社 | Semiconductor device and power conversion device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5690597A (en) * | 1979-12-24 | 1981-07-22 | Mitsubishi Electric Corp | Hybrid integrated circuit |
| JPS5920671U (en) * | 1982-07-28 | 1984-02-08 | 松下電器産業株式会社 | printed wiring board |
| JPS5961545U (en) * | 1982-10-19 | 1984-04-23 | 株式会社デンソー | integrated circuit device |
| JPS6018575U (en) * | 1983-07-15 | 1985-02-07 | 松下電器産業株式会社 | printed circuit board equipment |
-
1987
- 1987-10-06 JP JP25177787A patent/JPH0194696A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5690597A (en) * | 1979-12-24 | 1981-07-22 | Mitsubishi Electric Corp | Hybrid integrated circuit |
| JPS5920671U (en) * | 1982-07-28 | 1984-02-08 | 松下電器産業株式会社 | printed wiring board |
| JPS5961545U (en) * | 1982-10-19 | 1984-04-23 | 株式会社デンソー | integrated circuit device |
| JPS6018575U (en) * | 1983-07-15 | 1985-02-07 | 松下電器産業株式会社 | printed circuit board equipment |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479475U (en) * | 1990-11-20 | 1992-07-10 | ||
| US7531898B2 (en) | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
| US7547623B2 (en) | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
| US7703889B2 (en) | 2004-04-26 | 2010-04-27 | Brother Kogyo Kabushiki Kaisha | Printed wiring board and electric device using the same |
| WO2006053036A3 (en) * | 2004-11-10 | 2006-07-06 | Unitive Int Ltd | Non-circular via holes for bumping pads and related structures |
| JP2013004919A (en) * | 2011-06-21 | 2013-01-07 | Ibiden Co Ltd | Printed wiring board and manufacturing method therefor |
| WO2026074615A1 (en) * | 2024-10-01 | 2026-04-09 | 三菱電機株式会社 | Semiconductor device and power conversion device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582076B2 (en) | 1993-11-17 |
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