JPH01948A - Photosensitive resin composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a novel photosensitive resin composition, and more specifically to an electrical photosensitive resin composition used for solder resists, electroless plating resists, etc. in the production of printed wiring boards. The present invention relates to a photosensitive resin composition having excellent edge properties and heat resistance.

(Prior Art) It is well known that photosensitive resin compositions used as solder masks (also called permanent masks) and chemical plating resists are extremely useful in the production of printed wiring boards. .

The main role of the solder mask δI is to prevent short circuits during soldering, to prevent corrosion of the copper used, and to ensure long-term electrical insulation. Resin compositions containing epoxy resin as a main component are known as solder resists used for such solder masks.

Methods for forming a solder mask using such a solder resist include a method of screen printing an ink made of an epoxy resin solder resist onto a substrate and then curing it by heating or curing it with light. . However, such printing methods have problems such as bleeding, smearing, and skipping (a phenomenon in which the ink is not filled into the gaps in the circuit) during printing. I was becoming unable to cope.

One of the promising technologies to replace this printing method is.

This is a photographic method (a method in which a photosensitive layer of a certain thickness is coated on a substrate, irradiated with actinic rays through a negative film, and then developed to form an image). It is also known that in order to form high-precision images using photography, a photosensitive resin with properties that can be used as a solder mask is essential. Various compositions have been proposed. For example, JP-A-58-163937
Publication No. 59-5353j, Japanese Patent Publication No. 1987-5353-
208337 Publication 3 JP-A No. 61-271 etc., LL, I-) Lichloroethane, trichlorethylene,
Toluene, xylene.

Examples of resin compositions that can be developed with organic solvents such as butyl cellosolve and can be used as solder resists are disclosed.

On the other hand, we also consider the work environment and economic efficiency.

Products that can be developed with weak alkaline water such as sodium carbonate aqueous solution have been investigated, and examples of alkaline-developable photosensitive resin compositions have been disclosed in JP-A-60-121444 and JP-A-61-243869. The present inventors also previously proposed an alkali-developable photosensitive resin composition in Japanese Patent Application No. 62-38839.

However, none of these resin compositions has sufficient sensitivity to light, and when a solder mask is formed using a photographic method using this composition.

Not only did the exposure time have to be somewhat longer, but the longer the exposure time, the longer it was exposed to the heat generated by the light source, which caused the negative film to expand and cause the resolution of the pattern to deteriorate. There was a problem of decreased sex.

Conventionally, methods for increasing the sensitivity of photosensitive resin compositions, that is, the photopolymerization rate, include ethylene glycol diacrylate, diethylene glycol diacrylate, pentaerythritol triacrylate, and pentaerythritol tetraacrylate.

Esters of unsaturated carboxylic acids and aliphatic polyol compounds such as dipentaerythritol pentaacrylate and trimethylolpropane diacrylate (polyol-based acrylates), urethane acrylates with acryloyl or methacryloyl groups at the ends via urethane bonds, and ester bonds A photopolymerizable crosslinking agent (also referred to as a reactive diluent), typified by ester acrylate having an acryloyl group or methacryloyl group at the end thereof, is used.

However, these commonly used photopolymerizable crosslinking agents have low viscosity and a small number of acryloyl or methacryloyl groups per unit molecule, so in order to obtain the desired photospeed, it is necessary to It is necessary to add a large amount to the coating, in which case the coating becomes sticky when it dries. However, as described above, it is difficult to form a solder mask pattern using a photographic method.

Since it is unavoidable to use the photosensitive layer and the negative film in vacuum contact, it is essential that the dried coating film is non-tacky.

(Problems to be Solved by the Invention) It is an object of the present invention to provide a photosensitive resin composition that can be used as a solder mask in which two or more conventional problems are solved.

That is, the first object of the present invention is to provide a photosensitive resin composition useful as a solder mask that has excellent alkali resistance, organic solvent resistance, heat resistance, electrical insulation, mechanical strength, etc. A second object of the present invention is to provide a photosensitive resin composition that has good sensitivity to light and is easily cured in a short exposure time. Furthermore, a third object of the present invention is to provide a photosensitive resin composition that exhibits less tackiness when the coating film is dried.

(Means for Solving the Problems) In order to solve these problems, the inventors of the present invention, as a result of intensive research, discovered that a novel urethane acrylate having an acrylate group or a methacrylate group at the terminal was used as a photopolymerizable crosslinking agent. The present invention was accomplished by discovering that the object of the present invention can be achieved by using the compound as a compound.

That is, the present invention provides (a) a polymerizable monomer or/and oligomer thereof having a terminal acrylate group or/and methacrylate group represented by the following general formula (I); (b)
Consisting of a high molecular weight polymer and (c) a photopolymerization initiator, the above 3
Based on 100 parts by weight of total ingredients.

Ingredients (4 to 50 parts by weight of 81, 95 to 30 parts of component (b))
The gist of the present invention is a photosensitive resin composition characterized by containing 1 to 20 parts by weight of component (c).

X3/ \(Here +R1
represents a hydrogen atom or a methyl group) or an alkyl group having 1 to 3 carbon atoms, and Y represents a diisocyanate residue. However, +XI to X6 are included.

The present invention will be explained in detail below.

Firstly, component (a) contained in the photosensitive resin composition of the present invention.
A terminal acrylate group or a methacrylate group [hereinafter referred to as a terminal (meth)acrylate group]. ] The polymerizable monomer and/or oligomer thereof are those represented by the general formula (r) above.

In the above general formula (1), X, to X6 are =shiH2(J
-Shish = Shitl Z + (here, RI represents a hydrogen atom or a methyl group) or an alkyl group having 1 to 3 carbon atoms.

However, at least one of Xl-Xa.

It is. Here, R1 is preferably a hydrogen atom.

In the general formula CI), Y is a residue of a diisocyanate compound represented by the following general formula (II).

0CN-Y-NC〇---[II] In order to produce a polymerizable monomer having a terminal (meth)acrylate group represented by general formula (I) or/and an oligomer thereof, A molar ratio of a diisocyanate compound and a compound having at least two (meth)acrylate groups and one hydroxyl group in the same molecule is 1.
It can be obtained by carrying out a heating reaction so that the ratio becomes 2.

Specific examples of the diisocyanate compound represented by the general formula (II) include 1, for example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, trimethyl hexamethylene diisocyanate, lysine diisocyanate, 4,4'-diphenylmethane diisocyanate, hydrogenated 4,4'- Examples include diphenylmethane diisocyanate, 2.4-tolylene diisocyanate, 2.6-tolylene diisocyanate, xylylene diisocyanate, isophorone diisocyanate, and the like.

Specific examples of compounds having at least two (meth)acrylate groups and one hydroxyl group in the same molecule for producing the polymerizable hexamer represented by general formula [I] include 1
For example, pentaerythritol tri(meth)acrylate dipentaerythritol penta(meth)acrylate, trimethylolpropane diacrylate 2-hydroxy-1-acryloxy-3-methacryloxypropane.

2-hydroxy-1,3-dimethacryloxypropane,
Examples include glycerin di(meth)acrylate.

The high molecular weight polymer which is the component (b) contained in the photosensitive resin composition of the present invention can give a good coating film as a two-component composition, and any unexposed area can be removed by a developer, but any polymer can be used, but suitable (i) a polymer in which the hydrogen atoms of the hydroxyl groups of a novolak-type epoxy acrylate, bisphenol-type epoxy resin, or phenoxy resin are at least partially substituted, or (11) a vinyl-based polymer is used.

Examples of polymers (i) include those in which (meth)acrylic acid is added to the epoxy group of a novolac type epoxy resin, and those in which acid anhydride is added to the hydroxyl group to make it developable in a weak alkaline aqueous solution. .

It is obtained by directly reacting (meth)acrylic acid or acid anhydride with the hydroxyl groups of a polymer obtained by polycondensation reaction of a bisphenol compound and epihalohydrin, and its main repeating unit is represented by the following general formula [111) or CrV3
This is shown in .

In the formula, R+, Rz-Rs represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogen atom, R4 represents a hydrogen atom or a methyl group, and Z represents a hydrogen atom or -C-X-CO0
H (Here, X represents the residue of an acid anhydride.) In the formula, +R5 to R8 represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogen atom, and X represents -CH, -.

C (cR3)! , S represents Oz-.

CH.

■ (Here, X represents a residue of an acid anhydride.)

An example of the vinyl polymer (ii) is obtained by polymerizing a vinyl group-containing monomer.

These monomers include methyl (meth)acrylate,
Ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, (meth)acrylic acid, glycidyl (meth)acrylate, acrylonitrile, styrene, 2.4.6-tribromof enyl (meth)acrylate and the like. Furthermore, polymers of allyl esterified metals such as diallyl phthalate, diallyl isophthalate, triallyl cyanurate, and triallyl isocyanurate can also be used.

The photopolymerization initiator as component (c) contained in the photosensitive resin composition of the present invention includes 1, for example, acetophenone, 2,
2-jethoxyacetophenone, P-dimethylacetophenone, P-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, P
Acetophenones such as -tert-butyltrichloroacetophenone, dibenzophenone, 2-chlorobenzophenone, P, P'-dichlorobenzophenone, P, P'
-bisdimethylaminobenzophenone (also called Michler's ketone), P,P'-bisdiethylaminobenzophenone, 3.3',4.4'-tetra-(tert
-butylperoxycarbonyl) benzophenones such as benzophenone, benzoin ethers such as benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin-n-butyl ether, benzyl dimethyl ketal, tetramethylthiuram Monosulfide, tetramethylthiuram disulfide, thioxanthone, 2-chlorothioxanthone,
Sulfur compounds such as 2,4 diethylthioxanthone and 2-methylthioxanthone, and 2-ethylanthraquinone.

'1-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone.

2. Anthraquinones such as 3-diphenylanthraquinone, organic peroxides such as azobisisobutyronitrile, benzoyl peroxide, di-tert-butyl peroxide, cumene peroxide, 2,4.5-triarylimidazole, etc. body, riboflavin tetrabutyrate,
2-mercaptobenzimidazole, 2-mercaptobenzoxazole.

Thiol compounds such as 2-mercaptobenzothiazole,
2,4.6-)lis(trichloromethyl)-s-triazine, 2.2.2-1-ribromoethanol.

Examples include organic halogen compounds such as tribromomethylphenylsulfone.

These compounds can also be used in combination.

In addition, although it does not act as a photopolymerization initiator by itself,
It is also possible to add compounds that can increase the ability of the photopolymerization initiator when used in combination with the above compounds. Such compounds include, for example, tertiary amines such as triethanolamine, which are effective when used in combination with benzophenone.

The photosensitive resin composition of the present invention comprises component (a) and component (b).
and component (c), and the blending ratio of each component varies depending on the purpose of use, but component (a) is 4 to 50 parts by weight, and component (b) is 95 to 95 parts by weight, based on 100 parts by weight of the total weight of the three components. 3
0 parts by weight and component (c) must be in the range of 1 to 20 parts by weight and are selected within this range.

In the photosensitive resin composition of the present invention, if the blending ratio of component (a) is less than 4 parts by weight, the sensitivity, that is, the photopolymerization rate becomes low, which is not preferable. on the other hand.

If it exceeds 50 parts by weight, the coating film becomes sticky after drying, which is not preferable.

Moreover, when the blending ratio of component (b) exceeds 95 parts by weight.

This is not preferred because the photopolymerization rate becomes low. on the other hand.

When the amount is less than 30 parts by weight, not only does the dried coating film become sticky, but also the physical properties of the coating film, such as adhesion, heat resistance, and chemical resistance, tend to deteriorate.

Furthermore, if the blending ratio of component (c1) is less than 1 part by weight, the photopolymerization rate will be low, which is not preferable.

On the other hand, if it exceeds 20 parts by weight, light will not pass through the coating film.
＜This is not preferable because it becomes difficult for the coating film to reach the substrate, and the adhesion between the resin and the substrate tends to decrease.

Others 9 In the resin composition of the present invention, an epoxy resin, a thermal polymerization inhibitor, a filler, a dye,
Pigments, plasticizers, leveling agents, adhesion improvers, antifoaming agents,
j1 A fuel agent and an organic solvent for dilution can be blended.

The solvent is not particularly limited as long as it dissolves the photosensitive resin composition of the present invention, but examples include ketones such as methyl ethyl ketone and methyl isobutyl ketone, toluene,
Aromatic hydrocarbons such as xylene and monochlorobenzene, 1
, 1.1-1-lichloroethane, trichlorethylene,
Halogenated aliphatic hydrocarbons such as perchlorethylene, ethers such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, etc. are used.

The type of developer used in the development process is not particularly limited as long as it does not damage the exposed areas and dissolves the unexposed areas; Preferably used are halogenated aliphatic hydrocarbons such as, 1 to 2% by weight aqueous sodium carbonate solution, and the like.

Next, an example of use for printed wiring will be described as a preferred embodiment of using the resin composition of the present invention.

For example, when forming a pattern by a photographic method, the photosensitive resin composition of the present invention is made into a solution using a suitable solvent. The viscosity of the solution can be adjusted by changing the type of solvent or the concentration of the composition depending on the purpose. Then, use this solution by dipping.

It is applied onto a substrate to a thickness of 20 to 30 μm by a spray method, a roll coater method, or a spinner coating method, and the solvent is removed. Next, place a negative film on top of this,
A protective film is formed by irradiating actinic rays to harden the exposed areas and eluting the unexposed areas by development.

It is also possible to use this solution as a three-layer dry film by coating and drying this solution on a flexible support film, such as a polyester film, and covering this with a polyethylene film.

The protective coating is patterned using the above method.

It is a corrosion-resistant film for ordinary solder masks, chemical plating, etc., but it can be made into a protective film with even better properties by heat-treating it at 80 to 200°C for 10 minutes to 2 hours after development. .

(Examples) The present invention will be specifically explained below using five examples and reference examples.

Reference example 1 2.4-1-lylene diisocyanate 87.0 g (
0.50 mol), 298 g (1.0 mol) of pentaerythritol triacrylate, 0.0 mol of dibutyltin laurate.
32g and hydroquinone monomethyl ether o, 05
0 g of the mixed solution was heated at 70° C. for 4 hours to obtain a polymerizable monomer having a terminal acrylate group represented by -Funenin [I] (hereinafter, this monomer is referred to as compound A).

In the infrared absorption spectrum of Compound A, no absorption due to isocyanate groups was observed at 2260 cm''.

It was confirmed that the reaction proceeded quantitatively.

Reference Example 2 2, il-lylene diisocyanate 8 in Reference Example 1
Hexamethylene diisocyanate instead of 7.0 g!
A polymerizable monomer having a terminal acrylate group represented by -Funenin (T) was obtained by operating in the same manner as in Reference Example 1 except that -84.0 g (0.50 mol) was used (hereinafter referred to as This compound is referred to as compound B).

Reference Example 3 In place of 87.0 g of 2,4-1-lylene diisocyanate in Reference Example 1, isophorone diisocyanate 11
Reference Example 1 except that 1 rs (0.50 mol) was used.
By operating in the same manner as above, a polymerizable monomer having a terminal acrylate group represented by -Funenin [I] was obtained (hereinafter, this monomer is referred to as compound C).

Reference example 4 2.4-tolylene diisocyanate 52.2 g (0
, 30 mol), 150 g (0.61 mol) of trimethylolpropane diacrylate, 0.10 g of dibutyltin dilaurate, and 0.020 g of p-benzoquinone was heated at 80°C for 5 hours, ] A polymerizable monomer having a terminal acrylate group was obtained (hereinafter, this monomer is referred to as a compound).

Reference Example 5 In place of 150 g of trimethylolpropane diacrylate in Reference Example 4, 320 g of dipentaerythritol was used.
By operating in the same manner as in Reference Example 4 except that g (0.61 mol) was used, a polymerizable 7-mer having a terminal acrylate group represented by -Funenin [[] was obtained (hereinafter, this (referred to as compound E).

Reference Example 6 Isophorone diisocyanate) 44.4 g (0,2
0 mol).

Mixture of 85.6 g (0.40 mol) of 2-hydroxy-1-acryloxy-3-methacryloxypropane, 0.20 g of dibutyltin acetate and 0.010 g of 2.6-tert-butyl-4-methylphenol. The liquid was heated at 80° C. for 6 hours to obtain a polymerizable hexamer having a terminal (meth)acrylate group represented by -Funenin CI (hereinafter referred to as compound F).

Reference Example 7 Isophorone diisocyanate 44.4 in Reference Example 6
g instead of 2.4-1-lylene diisocyanate 34
．． Reference Example 6 except that 8 g (0.20 mol) was used.
By operating in the same manner as above, a polymerizable monomer having a terminal (meth)acrylate group represented by -Funenin [I] was obtained (hereinafter, this monomer is referred to as compound G).

Reference Example 8 Trimethylhexamethylene diisocyanate 63.0
g (0,30 mol), 2-hydroxy-1,3-dimethacryloxypropane 137 g (0,60 mol),
A mixed solution of 0.10 g of triethylene diamine and 0.020 g of hydroquinone monomethyl ether was heated at 80°C for 5 minutes.
By heating for a period of time, a polymerizable monomer having a terminal methacrylate group represented by -Funenin [I] was obtained (hereinafter, this monomer is referred to as compound H).

Examples 1-8. Comparative examples 1 to 3 Compounds A-H (component (a)) obtained in Reference Examples 1 to 8.

0-Taresol novolac type epoxy acrylate C (
bl component], photopolymerization initiator [component (c)], epoxy resin, filler, pigment, thermosetting agent, and organic solvent using a three-roll mill for testing at the compounding ratios shown in Table 1. parts by weight).

I mixed resist ink. Next, 1. These resist inks were applied to a thickness of 20 to 30 μm on a 1.8 mm thick copper clad laminate that had been degreased and cleaned, dried, and after drying, a negative film was adhered and heated using a 500 watt ultra-high pressure mercury lamp. (manufactured by Ushio Inc., tzv-590)
It was irradiated with ultraviolet light around 5 nm and an illumination intensity of 100 mW/ad for 30 seconds (exposure amount: 300 mJ/c++f). After exposure, the film was developed with modified chlorocene (Eterna IR, manufactured by Asahi Kasei Kogyo) at 25° C. for 30 seconds using an ultrasonic cleaner to remove the unexposed portions of the coating. after that.

Heat treatment was performed at 140° C. for 1 hour using a hot air dryer. Dry the coating film on the obtained sample.

Exposure hardness, coating hardness, adhesion to substrate, soldering heat resistance,
Chemical resistance and solvent resistance were evaluated. The results are shown in Table 2.

In addition, as a comparative example, a commercially available photopolymerizable crosslinking agent was used as component (a).

In addition, the above performance evaluation was performed by applying solder resist ink to a thickness of 20 to 30 μm on a copper-clad laminate.

The coating film obtained by drying at 70° C. for 30 minutes using a hot air dryer was subjected to the following procedures.

[Drying of paint film]

The drying properties of the coating film were evaluated according to JrS K-5400.

The evaluation ranks are as follows.

○: No tack observed at all △: Slight tack observed ×: Significant tack observed [Exposure sensitivity] Kodak Step Tablet Grade 2 [Manufactured by Eastman Kodak ■, optical density step 0.15. A negative film with 21 steps] was adhered to the coating film, and a 500 watt ultra-high pressure mercury lamp was used to irradiate the film with a light intensity of 300 mJ/cnl.

Next, this coating film was subjected to a developability test using the above-mentioned modified chlorocene aqueous solution, and the number of step tablets remaining on the copper foil was determined. (In this evaluation method, the higher the sensitivity, the more steps remain.) [Coating film hardness] 500m J using a 500W ultra-high pressure mercury lamp.
The hardness of the coating film irradiated with a light amount of /ct& is determined by JISD-0
The pencil hardness was evaluated according to 202.

[Adhesion with substrate]

500m J using a 500W ultra-high pressure mercury lamp
JIS D-
According to 0202, a cross cut was made to make a small number of 100 stitches, and then a peeling test was performed using cellophane tape (trade name of adhesive tape manufactured by Nichiban ■) to check the state of peeling of the stitches. The evaluation was performed visually.The evaluation ranks are as follows.

○: No peeling was observed at all measurement points △: Peeling was observed at 1 to 20 of 100 measurement points X: Peeling was observed at 21 or more points out of 100 measurement points [Soldering heat resistance] 500mJ/- using a 500W ultra-high pressure mercury lamp
The coating film irradiated with a light amount of JIS D-0202
It was immersed in a solder bath at 260° C. for 20 seconds according to the method, and the state of the coating film after immersion was evaluated. The evaluation ranks are as follows.

○: No abnormality in the appearance of the paint film ×: Blistering, melting, and peeling in the appearance of the paint film [Chemical resistance] 500mJ/cm using a 500W ultra-high pressure mercury lamp
The coating film irradiated with a light amount of cnl was immersed in the following chemicals under the following conditions, and the appearance and adhesion after immersion were evaluated.

Acid resistance: 10% by weight hydrochloric acid solution (50°C, 1 hour) Alkali resistance: 10% by weight aqueous caustic soda solution (30°C, 1 hour) Solvent resistance Nitrichloroethane (30°C, 1 hour): Methylene chloride (30°C, 1 hour) 1 hour): Isopropyl alcohol (30°C for 11 hours) The evaluation rank is as follows.

O: No abnormality ×: Dissolution or swelling Examples 9 to 12. Comparative Examples 4 to 7 Compound B obtained in Reference Example 2 [component (al), O-cresol novolac type epoxy acrylate [component (b)]
), a mixture of benzophenone/Michler's ketone in a weight ratio of 9:1 [component (c)), an epoxy resin (0-talesol novolanc type epoxy resin), a filler (talc), a pigment (phthalocyanine green).

The thermosetting agent (dicyandiamide), the thermal polymerization inhibitor (hydroquinone monomethyl ether), and the organic solvent (mixture of butyl cellosolve/cellosolve acetate 1:1 weight ratio) are blended in the proportions (parts by weight) shown in Table 3. Resist ink was prepared in the same manner as in the previous example.
Samples were prepared in the same manner as in the above examples, and the characteristics of the obtained samples were evaluated. The results are shown in Table 4 (Examples 9 to 12).

For comparison, compound A obtained in Reference Example 1 was used as component (a).
The same ingredients as in Examples 9 to 12 above were used, except that the ingredients were used in the proportions shown in Table 3.

Resist ink was prepared and samples were prepared in the same manner as in Examples 1 to 12. The results obtained are shown in Table 4 (Comparative Examples 4 to 7).

Table 1 [Note] ■The numbers in parentheses at the bottom of the proportions of components (a) to (c) are as follows:
The ratio is shown based on 100 parts by weight of the tertiary portion.

■Component (a) PEA; Pentaerythritol triacrylate TPD
;I-IJ methylolpropane diacrylate UAL
i Urethane acrylate ■Component (c) BPH; Benzophenone MK; Michler's ketone EAT; 2-ethylanthraquinone DAB; Diethylaminobenzophenone BDK; Benzyl dimethyl ketal.

DET; 2.4-diethylthioxanthone ■Epoxy resin CNE i O-cresol novolac type epoxy resin [Epicoat 180-3653BEA manufactured by Yuka Shell ■;
Bisphenol A type epoxy resin (Epicor manufactured by Yuka Seil ■) 10013 ■ Thermosetting agent DCAi dicyandiamide BFAi BF3/amine salt ■ Ratios in parentheses are weight ratios Table 2 Table 3 [Note] ■ Components (ratio of al to (c1) The numbers in parentheses at the bottom of
The ratio is shown based on 100 parts by weight of the three components.

Table 4 (Effects of the Invention) The resin composition of the present invention has no tackiness in the dried coating film, and has high sensitivity. Also, the acid resistance of the coating film.

Alkali resistance, solvent resistance, soldering heat resistance, electrical insulation 1
Mechanical strength 8 surface hardness etc. are also excellent. Therefore, the resin composition of the present invention is not only suitable for use in permanent protective masks such as solder resists and plating resists in the full additive method, but also as etching resists related to printed wiring boards, glabellar insulating materials, and photosensitive materials. It can be used as a photosensitive resin composition in a wide range of fields such as adhesives, paints, hard coat materials for plastics, PS plates as offset printing plates, photosensitive liquids and resist inks for screen printing.

Claims (1)

[Claims] (1) (a) A polymerizable monomer having a terminal acrylate group or/and methacrylate group represented by the following general formula [I] or/and its oligomer, (b) a high molecular weight polymer, and (c) a photopolymerization initiator. Component (a) is 4 to 50 parts by weight, component (b) is 95 to 30 parts by weight, and component (c) is 1 to 20 parts by weight, based on 100 parts by weight of the above three components.
A photosensitive resin composition characterized in that the parts by weight. ▲There are mathematical formulas, chemical formulas, tables, etc.▼...[I] In the formula, X_1 to (represents an atom or methyl group) or an alkyl group having 1 to 3 carbon atoms, and Y represents a diisocyanate residue. However, at least one of X_1 to X_6 is ▲There is a mathematical formula, chemical formula, table, etc.▼.