JPH0195599A - Control panel - Google Patents

Abstract

PURPOSE:To enable an efficient cooling by providing two cooling air intakes, and allowing the two wind tunnels provided in the container space to be communicated with the respective cooling air intakes at the cooling air intakes side and to merge with each other at the cooling air discharge port side. CONSTITUTION:The cooling air intake is divided into two cooling air intakes 5A, 5B, and the two wind tunnels 12, 18 provided surrounding units to be cooled 8, 10 in the container space are made to respectively communicate with the cooling air intakes 5A, 5B and to merge with each other at the cooling air discharge port 6 side. Accordingly, a cooling air A having flowed from the cooling air intake 5A into a room 4A flows out into the wind tunnel 12 through a duct 17 after cooling the electrical appliance unit 10, and the cooling air A having flowed from the cooling air intake 5B into a room 4B enters the wind tunnel 12, moves upward while removing heat from a radiator fins 8A group of the semiconductor unit 8, merges with the cooling air A from the duct 17 at a merging section 19, and flows out into the atmosphere from the cooling air discharge port 6. With this, an efficient cooling can be performed.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to an improvement in the cooling structure of a control panel.

[Conventional technology]

FIG. 2 shows a conventional example of a control panel for a static power conversion device, for example, a constant voltage constant frequency power supply device. In the figure, 1 is a box of a control panel, and IA is a front panel of the box 1. The inside of the box 1 is divided by a partition wall 2 into a storage space 3 on the front panel IA side and a storage space 4 on the blue plate IB side. The storage space 4 communicates with the outside through a cooling air intake 5 formed at the lower part of the back plate IB and a cooling air outlet 6 formed at the top IC. An air flow (cooling air) A flowing from the cooling air intake port 5 toward the cooling air outlet 6 is formed. Among the units constituting the power converter, the units that are dust-resistant, that is, the semiconductor unit 8 that consists of switching elements such as transistors and constitutes the main circuit, and the control unit 9 that includes printed circuit boards, etc., are housed in the storage space 3, and other units are housed in the storage space 3. The electrical equipment unit 10 is stored in the storage space 4 because it requires cooling. Although the semiconductor unit 8 hates dust as described above, it needs to be cooled, so the group of radiating fins 8A is placed in the storage space 4.
It is designed to protrude inward for forced ventilation cooling, similar to the electrical equipment unit 10. Reference numeral 11 denotes a plate-shaped partition, which defines a wind tunnel 12 surrounding the group of radiation fins 8A of the semiconductor unit 8 between the partition wall 2 and the left and right side plates ID and IE, and hangs down from the top plate IC by a predetermined length. ing. 13.14
is a filter.

In this conventional cooling structure, the cooling air A cools the electrical equipment unit 10 and then enters the wind tunnel 12. While passing through the wind tunnel 12, the cooling air A absorbs heat from the heat dissipation fins 8A and reaches the cooling air outlet 6.
Exit to.

[Problem that the invention seeks to solve]

In this way, in the conventional system, the cooling air A flowing into the wind tunnel 12 has already taken the heat from the electrical equipment unit 10, and its temperature is higher than the outside air temperature, and this temperature increase reduces the heat removal effect. Since the reduced cooling air A touches the group of radiating fins 8A of the semiconductor unit 8 and flows toward the cooling air outlet 6,
The cooling efficiency for the semiconductor unit 8 is low, and even though they are arranged in the same cooling air flow path, one cooled unit, the electrical equipment unit 10, is sufficiently cooled, but the other cooled unit, the heat radiation fin, is cooled sufficiently. There was a problem in that the cooling of the 8A group was insufficient. Of course, if the group of heat dissipating fins 8A of the semiconductor unit 8 and the electrical equipment unit 10 are arranged in parallel and each is provided with its own wind tunnel, the problem will disappear, but the control panel will become larger and the required installation space will increase.
There was a problem that the cost required for the box 1 was high.

This invention was made in order to solve the above-mentioned conventional problems, and in order to save space, a plurality of cooled units are arranged in series with the cooling air outlet, which leads to an increase in the size of the box. (The purpose is to provide a control panel that can be efficiently cooled without any problems.)

[Means for solving problems]

In order to achieve the above-mentioned object, the present invention has a first cooling air inlet and a cooling air outlet in a storage space in a control panel box.
and a second cooled unit that receives cooling air from the cooling air outlet side of the first cooled unit, the cooling air intake port is connected to the first cooled unit. A first wind tunnel that is divided into a cooling air intake and a second cooling air intake, and extends within the storage space to surround the first cooled unit, and a first wind tunnel that extends to surround the second cooled unit. two wind tunnels are defined, and the first wind tunnel and the second wind tunnel communicate with the first cooling air intake and the second cooling air intake, respectively, on the cooling air intake side, and the cooling air exhaust. The configuration is such that they merge with each other on the exit side.

[Effect]

In the cooling structure of the present invention, the cooling air taken in from the first cooling air intake cools the first unit to be cooled, and then flows directly to the cooling air outlet, and from the second cooling air intake. After the taken-in cooling air cools the second cooled unit, it flows directly to the cooling air outlet, and both the first cooled unit and the second cooled unit are cooled by the cooling air at the outside temperature. .

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

1 and 2, 5A and 5B are first and second cooling air intakes, and the first cooling air intake 5A is located at a height opposite to the electrical equipment unit 10 on the back plate IB. Furthermore, the second cooling air intake 5B is formed at a height opposite to the group of cooling fins 8A on the back plate IB. 15 is a horizontal partition, and the back plate IB
and the partition wall 2, and divides the inside of the storage space 4 into two upper and lower chambers: a chamber 4A serving as a wind tunnel on the side of the electrical equipment unit 10, and a chamber 4B on the side of the group of radiation fins 8A of the semiconductor unit 8. The first cooling air intake 5A opens into the chamber 4A, and the second cooling air intake 5B opens into the chamber 4B. Partition 11
A wind tunnel 12 is defined in the room B, and a space serving as a cooling airflow population 12A is separated from the horizontal partition 15. 16 is a vertical partition, and the radiation fins 8 are installed vertically on the horizontal partition 15.
It extends above Group A, and cooperates with the side plate ID and partition wall 2 to define a duct 17 within the wind tunnel 12. This duct 17 forms a wind tunnel 18 for the electrical equipment unit 10 together with the chamber 4A.The lower end of the duct 17 communicates with the chamber 4A through a hole 15A formed in the horizontal partition 15, and the upper end communicates with the chamber 4A through a hole 15A formed in the horizontal partition 15. They merge at merging section 19.

In this configuration, the cooling air A flowing into the chamber 4A from the cooling air intake 5A cools the electrical equipment unit) 10, then flows out into the wind tunnel 12 through the duct 17, and flows into the chamber 4B from the cooling air intake 5B. The cooling air A that has flowed into the wind tunnel 12 enters the wind tunnel 12 and rises while absorbing heat from the group of radiation fins 8A of the semiconductor unit 8. At the confluence part 19, the cooling air A flows from the duct 17 and flows out from the cooling air outlet 6. leaks into the outside air.

In the present embodiment, the group of radiation fins 8A of the semiconductor unit 8 and the electrical equipment unit 10 are cooled in the wind tunnel 12 and the chamber 4A, which are merging on the side of the cooling air outlet 6, but are essentially standing. Both can be sufficiently cooled.

In this embodiment, the inside of the storage space 4 is divided into upper and lower parts by the horizontal partition 15, and the lower chamber 4A on the electrical equipment unit 10 side is
Since the duct 17 passing through the wind tunnel 12 communicates with the vicinity of the cooling air outlet 6, the above effect can be obtained without changing the conventional arrangement of each cooled unit.

In the above embodiment, there is one duct 17, but a plurality of ducts may be provided.

〔Effect of the invention〕

As explained above, this invention provides a second
When two cooled units are arranged on the cooling air outlet side with respect to the first cooled unit, mutually independent wind tunnels that merge on the cooling air outlet side but take in cooling air from different cooling air intakes are installed. Since the first and second cooled units are cooled in their respective wind tunnels, both wave cooling units can be cooled with cooling air at the cooling air intake temperature, and depending on the location of the cooled units, It is possible to prevent the cooling capacity from decreasing.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, FIG. 2 is a partially sectional rear view of the above embodiment, and FIG. 3 is a longitudinal sectional view showing a conventional control panel. 1-box, 4-storage space, 4A, 4B-...room, 5A,
5B--Cooling air intake, 6--Cooling air outlet, 8-
Semiconductor unit, 8A...-Radiation fin, 10.-Electrical device unit, 12.18-Wind tunnel, 17--Duct, A.-Cooling air.

Claims (3)

[Claims] (1) A storage space with a cooling air intake port and a cooling air outlet opening toward the outside and partitioned inside the control panel box, a first cooled unit disposed within the storage space, and a first cooling unit disposed in the storage space; A second unit receives cooling air from the cooling air outlet side of the unit to be cooled.
In the control panel having a cooled unit and a cooling fan, the cooling air intake includes a first cooling air intake and a second cooling air intake, and the storage space includes a first wind tunnel and a second wind tunnel. the first wind tunnel extends around the first cooled unit, the second wind tunnel extends around the second cooled unit, and the first wind tunnel and the second wind tunnel A control panel characterized in that the cooling air intake ports communicate with the first cooling air intake and the second cooling air intake, respectively, on the cooling air intake side, and merge with each other on the cooling air outlet side. (2) The control panel according to claim 1, wherein the first wind tunnel has a duct extending inside the second wind tunnel toward the cooling air outlet side. (3) Claim 1, characterized in that the second cooled unit is a semiconductor unit, and its radiation fins extend from outside the storage space inside the control panel box into the second wind tunnel. The control panel described in item 1 or 2.