JPH0196890U - - Google Patents
Info
- Publication number
- JPH0196890U JPH0196890U JP19211387U JP19211387U JPH0196890U JP H0196890 U JPH0196890 U JP H0196890U JP 19211387 U JP19211387 U JP 19211387U JP 19211387 U JP19211387 U JP 19211387U JP H0196890 U JPH0196890 U JP H0196890U
- Authority
- JP
- Japan
- Prior art keywords
- tray
- packaging
- groove
- leads
- ics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の一実施例にＩＣを収納した状
態の部分斜視図、第２図は本考案の他の実施例に
ＩＣを収納した状態を示す部分斜視図、第３図は
従来のＩＣ梱包用トレーと収納ＩＣを示す平面図
、第４図と第５図はそれぞれ従来のＩＣ梱包用ト
レーにＩＣを収納した状態の一例および他の例を
示す部分断面図である。
１……収納ＩＣ、２……ＩＣ本体、３……リー
ド、４……リード収容溝、５……本体収容凹み、
６……仕切り壁、７……トレー底部、８……台座
、９……平坦なトレー底部。
Fig. 1 is a partial perspective view of one embodiment of the present invention in which an IC is housed, Fig. 2 is a partial perspective view of another embodiment of the present invention in which an IC is housed, and Fig. 3 is a conventional FIGS. 4 and 5 are plan views showing an IC packaging tray and stored ICs, and are partial sectional views showing one example and another example of a state in which ICs are stored in a conventional IC packaging tray, respectively. 1... Storage IC, 2... IC body, 3... Lead, 4... Lead accommodation groove, 5... Body accommodation recess,
6... Partition wall, 7... Tray bottom, 8... Pedestal, 9... Flat tray bottom.
Claims (1)
るＩＣ梱包用トレーにおいて、前記ＩＣの横方向
移動を防止するための、前記ＩＣのリードを個々
に入れる溝または、前記リードを入れる溝とＩＣ
本体を個々に入れる凹部が前記トレーの底部に設
けられていることを特徴とするＩＣ梱包用トレー
。 In an IC packaging tray in which a plurality of flat ICs are arranged side by side and stored, there is a groove in which the leads of the IC are individually placed, or a groove in which the leads are placed and the IC.
A tray for IC packaging, characterized in that a recess into which the main bodies are individually placed is provided at the bottom of the tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19211387U JPH0196890U (en) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19211387U JPH0196890U (en) | 1987-12-18 | 1987-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0196890U true JPH0196890U (en) | 1989-06-27 |
Family
ID=31482986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19211387U Pending JPH0196890U (en) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0196890U (en) |
-
1987
- 1987-12-18 JP JP19211387U patent/JPH0196890U/ja active Pending
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