JPH0196989A - Superconducting circuit substrate and manufacture thereof - Google Patents
Superconducting circuit substrate and manufacture thereofInfo
- Publication number
- JPH0196989A JPH0196989A JP62254963A JP25496387A JPH0196989A JP H0196989 A JPH0196989 A JP H0196989A JP 62254963 A JP62254963 A JP 62254963A JP 25496387 A JP25496387 A JP 25496387A JP H0196989 A JPH0196989 A JP H0196989A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- superconductor
- thick film
- superconducting
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000002887 superconductor Substances 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 20
- 239000002131 composite material Substances 0.000 claims description 16
- 238000010304 firing Methods 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 13
- 229910052788 barium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- FIPWRIJSWJWJAI-UHFFFAOYSA-N Butyl carbitol 6-propylpiperonyl ether Chemical compound C1=C(CCC)C(COCCOCCOCCCC)=CC2=C1OCO2 FIPWRIJSWJWJAI-UHFFFAOYSA-N 0.000 description 1
- 241000587161 Gomphocarpus Species 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子材料に使用されるセラミクス回路基板およ
びその作製方法に関する。より詳細には、回路を超電導
体で形成されたセラミクス回路基板およびその作製方法
に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a ceramic circuit board used in electronic materials and a method for producing the same. More specifically, the present invention relates to a ceramic circuit board in which a circuit is formed of a superconductor and a method for manufacturing the same.
従来の技術
従来酸化物超電導体を回路に使用しているセラミクス回
路基板および積層型のセラミクスパッケージの場合、セ
ラミクス基板上に酸化物超電導体で金属を用いた場合と
同様な回路が形成されていた。Conventional technology Conventionally, in the case of ceramic circuit boards and laminated ceramic packages that use oxide superconductors in circuits, circuits similar to those using metal oxide superconductors were formed on ceramic substrates. .
発明が解決しようとする問題点
セラミクス回路基板や積層型のセラミクスパッケージを
実際に電子部品として使用する際には、基板上の回路パ
ターンにボンディングを行ったり、ターミナルを形成す
る必要がある。しかし、酸化物超電導体は、−船釣な物
理特性、例えばぬれ特性、金属との接着性等が金属とは
大きく異なるため、上記のような従来のボンディングや
ターミナル形成がきわめて困難であった。Problems to be Solved by the Invention When a ceramic circuit board or a laminated ceramic package is actually used as an electronic component, it is necessary to bond the circuit pattern on the board or form a terminal. However, oxide superconductors have very different physical properties, such as wetting properties and adhesion to metals, that are significantly different from those of metals, so it has been extremely difficult to perform conventional bonding and terminal formation as described above.
そこで本発明は、ボンディングやターミナル形成が容易
な超電導回路基板およびその作製方法を提供するもので
ある。Therefore, the present invention provides a superconducting circuit board that allows easy bonding and terminal formation, and a method for manufacturing the same.
問題点を解決するための手段
本発明に従うと、超電導体で形成された回路を有するセ
ラミクス回路基板において、上記回路の電極パッド部が
厚膜導体で形成されていることを特徴とする超電導回路
基板が提供される。本発明の超電導回路基板に用いる超
電導体としては、Ｙ、ＢａおよびＣｕを含む複合酸化物
超電導体が好ましい。Means for Solving the Problems According to the present invention, there is provided a ceramic circuit board having a circuit formed of a superconductor, characterized in that the electrode pad portion of the circuit is formed of a thick film conductor. is provided. The superconductor used in the superconducting circuit board of the present invention is preferably a composite oxide superconductor containing Y, Ba, and Cu.
また、本発明に従うと、超電導体で形成された回路を有
するセラミクス基板を作製する方法において、基板上に
超電導体ペーストで回路パターンを形成し、上言己回路
パターン上の所望する位置に厚膜導体ペーストで電極パ
ッドを形成し、同時に焼成することで超電導回路を作製
することを特徴とする超電導回路基板の作製方法も提供
される。Further, according to the present invention, in a method of manufacturing a ceramic substrate having a circuit formed of a superconductor, a circuit pattern is formed on the substrate using a superconductor paste, and a thick film is formed at a desired position on the circuit pattern. Also provided is a method for manufacturing a superconducting circuit board, which comprises forming electrode pads with a conductive paste and simultaneously baking the superconducting circuit to manufacture a superconducting circuit board.
本発明に用いる厚膜導体ペーストの焼成温度は回路を形
成する酸化物超電導体の焼成温度より低く、両者の差が
１００℃以内であることが好ましい。The firing temperature of the thick film conductor paste used in the present invention is lower than the firing temperature of the oxide superconductor forming the circuit, and the difference between the two is preferably within 100°C.
作用
セラミクス回路基板や積層型のセラミクスパッケージに
おいて、超電導体を回路に用いることにより、低損失化
、電力消費の低減、基板およびパッケージの小型・高密
度化、クロストーク防止、インピーダンスチャタ−防止
等多くのメリットが期待される。回路を形成する超電導
体としては酸化物超電導体が用いられるが、酸化物超電
導体は、金属と物性が大幅に異なり、ろう付けおよびハ
ンダによる接合あるいはボンディングは困難である。By using superconductors in the circuits of functional ceramic circuit boards and laminated ceramic packages, there are many benefits such as lower loss, reduced power consumption, smaller and higher density substrates and packages, prevention of crosstalk, prevention of impedance chatter, etc. Benefits are expected. Oxide superconductors are used as superconductors to form circuits, but oxide superconductors have significantly different physical properties from metals and are difficult to join or bond by brazing or soldering.
また、めっきによるメタルパッド形成も不可能である。Further, it is also impossible to form metal pads by plating.
すなわち、酸化物超電導体を使用した回路基板は、回路
の全ての部分が超電導体で形成すると、ボンディングや
ターミナル形成がきわめて困難であり、従来は電子部品
である回路基板としての実用性が低かった。In other words, circuit boards using oxide superconductors are extremely difficult to bond and form terminals when all circuit parts are made of superconductors, making them less practical as circuit boards that are conventional electronic components. .
本発明に従うと、回路の電極パッド部が厚膜導体で形成
されていることを主要な特徴とする超電導回路基板が提
供される。本発明の超電導基板は、電極パッド部が厚膜
導体で形成されているのでボンディングや各種ピンのろ
う付は等は金属で回路が形成されている回路基板と同様
、従来の技術で容易に行うことができる。また、回路の
ほとんどの部分は超電導体で形成され、電極パッド部の
み厚膜導体で形成されているので超電導体を使用するメ
リットはなんら損なわれない。According to the present invention, there is provided a superconducting circuit board whose main feature is that the electrode pad portion of the circuit is formed of a thick film conductor. In the superconducting substrate of the present invention, since the electrode pad portion is formed of a thick film conductor, bonding and brazing of various pins can be easily performed using conventional techniques, similar to circuit boards whose circuits are formed of metal. be able to. Furthermore, most parts of the circuit are made of superconductors, and only the electrode pad portions are made of thick film conductors, so the advantages of using superconductors are not lost in any way.
本発明で使用する酸化物超電導体としては、周期律表１
１ａ族元素の中から選ばれる少なくとも１つの元素α、
周期律表■ａ族元素の中から選ばれる少なくとも１つの
元素βおよび周期律表Ｉｂ。As the oxide superconductor used in the present invention, the periodic table 1
at least one element α selected from group 1a elements,
■At least one element β selected from Group A elements of the Periodic Table and Ib of the Periodic Table.
Ｉ［ｂ、ｌｌＩｂ、］Ｖａ、■ａ族元素によって構成さ
れる群の中から選択される少なくとも１つの元素Ｔを含
有する酸化物で、
一般式： （αｌ−Ｘβｘ）ｒｙＯｚ
（但し、α、β、Ｔは、上記定義の元素であり、Ｘはα
＋βに対するβの原子比で、０．１≦Ｘ≦０．９であり
、ｙおよび２は（α、ＸβＸ）を１とした場合に０．４
≦ｙ≦３．０．１≦２≦５となる原子比である）
で表される組成のペロブスカイト型、酸素欠損ペロブス
カイト型またはペロブスカイト型結晶構造と類似のオル
ソロンピック型等の結晶構造を持つ、擬似ペロブスカイ
ト型というべき酸化物が好ましい。I [b, llIb, ] Va, ■ An oxide containing at least one element T selected from the group consisting of a group elements, with the general formula: (αl-Xβx)ryOz (however, α, β, T are the elements defined above, and X is α
The atomic ratio of β to +β is 0.1≦X≦0.9, and y and 2 are 0.4 when (α, XβX) is 1.
≦y≦3.0.1≦2≦5) It has a perovskite type, an oxygen-deficient perovskite type, or an orthorhombic type crystal structure similar to a perovskite type crystal structure. , pseudo-perovskite type oxides are preferred.
具体的には、Ｙ、 Ｂａ５Ｃｕを含む複合酸化物が好ま
しく、この場合超電導体は例えば
Ｂａ２Ｙ＋ＣｕａＯｓ−ｎ （ｎは酸素欠損を示す）
で表される酸素欠損ペロブスカイト型酸化物を主体とす
る混合相からなると考えられる。Specifically, a composite oxide containing Y and Ba5Cu is preferable, and in this case, the superconductor is, for example, Ba2Y+CuaOs-n (n indicates oxygen vacancy).
It is thought to consist of a mixed phase mainly consisting of an oxygen-deficient perovskite-type oxide represented by
本発明の方法に従うと、基板上に超電導体となる該複合
酸化物のペーストを用いた印刷法で回路を描き、電極パ
ッド部を厚膜導体ペーストで形成する。そして、両者を
同時に焼成する。本発明において回路を形成する複合酸
化物超電導体は、焼成等の熱処理を経ないと超電導性を
持たない。さらに、上記複合酸化物超電導体は、焼成時
の温度条件がたいへん厳しく、また、焼成過程の最後の
段階では酸素を十分取り込ませないと超電導特性が悪く
なる。According to the method of the present invention, a circuit is drawn on a substrate by a printing method using a paste of the composite oxide that becomes a superconductor, and electrode pad portions are formed with a thick film conductor paste. Then, both are fired at the same time. The composite oxide superconductor forming the circuit in the present invention does not have superconductivity unless it undergoes heat treatment such as firing. Furthermore, the temperature conditions during firing of the composite oxide superconductor described above are very severe, and the superconducting properties deteriorate unless sufficient oxygen is incorporated in the final stage of the firing process.
上記複合酸化物ペーストおよび厚膜導体ペーストはバイ
ンダーとして有機物を含んでいるため、焼成時は還元雰
囲気となる。従って、上記複合酸化物超電導体で回路を
形成し、焼成を行った後に厚膜導体の焼成を行うと複合
酸化物超電導体は還元され、超電導特性が悪化し、最悪
の場合は超電導性を失う。Since the composite oxide paste and the thick film conductor paste contain an organic substance as a binder, a reducing atmosphere is created during firing. Therefore, if a thick film conductor is fired after forming a circuit with the above composite oxide superconductor and firing it, the composite oxide superconductor will be reduced, the superconducting properties will deteriorate, and in the worst case, the superconductivity will be lost. .
上記の理由で本発明の方法では、超電導体となる複合酸
化物ペーストおよび厚膜ペーストとを同時に焼成し、最
後に適当な酸素含有雰囲気として上記複合酸化物超電導
体に酸素を十分に取り込ませ、よりよい超電導特性を得
る。厚膜導体を焼成した後、複合酸化物超電導体を焼成
することも可能であるが、両者の焼成温度が比較的近く
、また、厚膜導体の焼成温度には幅があり、しかも調整
できることから両者を同時に焼成することが可能であり
、より効率的である。For the above reasons, in the method of the present invention, the composite oxide paste and the thick film paste that will become the superconductor are simultaneously fired, and finally an appropriate oxygen-containing atmosphere is created to sufficiently incorporate oxygen into the composite oxide superconductor. Obtain better superconducting properties. It is also possible to fire the composite oxide superconductor after firing the thick film conductor, but this is because the firing temperatures for both are relatively close, and the firing temperature for thick film conductors has a wide range and can be adjusted. It is possible to fire both at the same time, which is more efficient.
しかしながら、厚膜導体の焼成温度と複合酸化物超電導
体の焼成温度との差があまり大きいと、厚膜が形成でき
なかったり、厚膜表面が酸化される恐れがあるため、本
発明の方法では厚膜導体の焼成温度は複合酸化物超電導
体の焼成温度以下で両者の差が１００℃以下とした。However, if the difference between the firing temperature of the thick film conductor and the composite oxide superconductor is too large, a thick film may not be formed or the thick film surface may be oxidized. The firing temperature of the thick film conductor was set to be lower than the firing temperature of the composite oxide superconductor, and the difference between the two was set to be 100° C. or less.
具体的には、本発明の方法で使用する厚膜導体ペースト
としては、Ａｇ−Ｐｄ、へｇ−Ｐｔ、Ａｕペースト等が
好ましい。Specifically, the thick film conductor paste used in the method of the present invention is preferably Ag-Pd, Heg-Pt, Au paste, or the like.
また、本発明の方法として、基板のグリーンシート上に
上記複合酸化物で回路を描き、厚膜導体ペーストで電極
パッド部を形成し、王者を同時に焼成する方法も考えら
れる。Further, as a method of the present invention, a method may be considered in which a circuit is drawn using the above-mentioned composite oxide on a green sheet of a substrate, electrode pad portions are formed using a thick film conductor paste, and the final layer is fired at the same time.
実施例
実施例ｌ
Ａｌ２Ｏ３基板１上にＹ＝Ｂａ−Ｃｕ−０のペーストを
スクリーン印刷法で第１図（ａ）に示すようパターニン
グし、またＡｕペーストで電極パッド部３をやはりスク
リーン印刷法で形成した。その後、大気中において９２
０℃で２０時間焼成した。Examples Example 1 A paste of Y=Ba-Cu-0 was patterned on an Al2O3 substrate 1 by a screen printing method as shown in FIG. Formed. After that, 92
It was baked at 0°C for 20 hours.
こうして得られた本発明の超電導回路基板の超電導回路
部は、９４にで抵抗が完全に０となった。The resistance of the superconducting circuit portion of the superconducting circuit board of the present invention thus obtained became completely zero at 94 days.
実施例２
実施例１と同様な材料を用い、同様な手順で第１図ら）
に示す超電導回路基板を作製した。この基板上の超電導
回路部は、９６にで抵抗が完全にＯとなった。Example 2 Using the same materials and following the same procedure as in Example 1 (Figure 1 et al.)
The superconducting circuit board shown in Figure 1 was fabricated. The resistance of the superconducting circuit section on this substrate became completely O at 96.
次に、熱圧着ボンダーでＡｕ線を用い第１図（ｂ）に示
すようボンディングを行い破断強度を調べた。Next, bonding was performed using an Au wire with a thermocompression bonder as shown in FIG. 1(b), and the breaking strength was examined.
結果を第１表に示す。The results are shown in Table 1.
第１表
また、端部ターミナル部にハンダ付法によって第１図（
Ｃ）に示すようリードフレームを取り付けたが、良好な
るハンダ付けが可能であった。Table 1 Also, by soldering the end terminal part as shown in Figure 1 (
The lead frame was attached as shown in C), and good soldering was possible.
実施例３
Ａ１２０３グリーンシート上にＹ−Ｂａ−Ｃｕ−０のペ
ーストを用いて、実施例１で作製したものと同じパター
ンの超電導回路をスクリーン印刷法でバターニングし、
またＡｕペーストで電極パッド部やはリスクリーン印刷
法で形成した。その後、人気中において９４０℃で２４
時間焼成した。こうして得られた本発明の超電導基板は
、９０にで抵抗が完全に０となった。Example 3 Using a Y-Ba-Cu-0 paste on an A1203 green sheet, a superconducting circuit with the same pattern as that produced in Example 1 was patterned by screen printing, and
Further, the electrode pad portions were formed using Au paste using a rescreen printing method. After that, 24 degrees at 940℃ during the popular period.
Baked for an hour. The superconducting substrate of the present invention obtained in this way had completely zero resistance at 90°C.
この超電導基板の電極パッド部３にプラグインパッケー
ジに使用されるコバールの０．４３φのネールヘッドピ
ン４を第１図（ｄ）に示すようにロウ付した。ロウ付強
度を測定するため、引張試験で破断強度を測定したがす
べてコバールのピン部で破断し、ロウ付は部は充分なる
強度を有することがわかった。A 0.43φ nail head pin 4 made of Kovar used for a plug-in package was soldered to the electrode pad portion 3 of this superconducting substrate as shown in FIG. 1(d). In order to measure the brazing strength, the breaking strength was measured by a tensile test, but all the pieces broke at the Kovar pin part, and it was found that the brazing part had sufficient strength.
発明の詳細
な説明したように、本発明の超電導回路基板は、超電導
体を用いることによる種々のメリットを十分活かせるも
のとなっている。As described in detail, the superconducting circuit board of the present invention can fully utilize the various advantages of using a superconductor.
これは、本発明に独特な厚膜導体により形成された電極
パッド部を持つ超電導回路によって実現したものである
。This is achieved by a superconducting circuit having an electrode pad portion formed of a thick film conductor unique to the present invention.
さらに本発明に従うと、上記の超電導回路基板の作成方
法も提供される。Furthermore, according to the present invention, a method for producing the above superconducting circuit board is also provided.
本発明により、超電導の集積回路への応用はいっそう促
進される。The present invention further promotes the application of superconductivity to integrated circuits.
第１図（ａ）は、本発明の方法によりＡｌ２Ｏを基板上
に形成された厚膜導体による電極パッドを有する超電導
回路の１例を示す図であり、
第１図（ｂ）は、ボンディングの強度を測定するのに用
いた本発明による超電導回路基板を示す図であり、
第１図（Ｃ）は、本発明の超電導回路基板の電極パッド
部へのリードフレームをロウ付けした様子を示す図であ
り、
第１図（ｄ）は、本発明の超電導回路基板の電極パッド
部へプラグインパッケージに用いられるコバールのネー
ルへラドピンをロウ付けした様子を表す概念図である。
（主な参照番号）
１・・・基板、
２・・・超電導体、
３・・・厚膜導体による電極パッド、
４・・・リードフレーム、
５・・・Ａｕ線、
６・・・ピン
特許出願人 住友電気工業株式会社FIG. 1(a) shows an example of a superconducting circuit having an electrode pad made of a thick film conductor formed on an Al2O substrate by the method of the present invention, and FIG. 1(b) shows a bonding FIG. 1C is a diagram showing a superconducting circuit board according to the present invention used to measure strength, and FIG. FIG. 1(d) is a conceptual diagram showing how a Rad pin is brazed to a Kovar nail used in a plug-in package to an electrode pad portion of a superconducting circuit board of the present invention. (Main reference numbers) 1... Substrate, 2... Superconductor, 3... Electrode pad made of thick film conductor, 4... Lead frame, 5... Au wire, 6... Pin patent Applicant: Sumitomo Electric Industries, Ltd.
Claims (4)
路基板において、上記回路の電極パッド部が厚膜導体で
形成されていることを特徴とする超電導回路基板。(1) A ceramic circuit board having a circuit formed of a superconductor, characterized in that an electrode pad portion of the circuit is formed of a thick film conductor.
酸化物超電導体であることを特徴とする特許請求の範囲
第１項に記載の超電導回路基板。(2) The superconducting circuit board according to claim 1, wherein the superconductor is a composite oxide superconductor containing Y, Ba, and Cu.
板を作製する方法において、基板上に超電導体となる複
合酸化物ペーストで回路パターンを形成し、上記回路パ
ターン上の所望する位置に厚膜導体ペーストで電極パッ
ドを形成し、同時に焼成することで超電導回路を作製す
ることを特徴とする超電導回路基板の作製方法。(3) In a method for producing a ceramic substrate having a circuit formed of a superconductor, a circuit pattern is formed on the substrate using a composite oxide paste that becomes a superconductor, and a thick film conductor is placed at a desired position on the circuit pattern. 1. A method for producing a superconducting circuit board, comprising forming electrode pads with paste and simultaneously producing a superconducting circuit by firing.
成する酸化物超電導体の焼成温度より低く、両者の差が
、１００℃以内であることを特徴とする特許請求の範囲
第３項に記載の超電導体回路基板の作製方法。(4) The firing temperature of the thick film conductor paste is lower than the firing temperature of the oxide superconductor forming the circuit, and the difference between the two is within 100°C. The method for producing the superconductor circuit board described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62254963A JPH0196989A (en) | 1987-10-09 | 1987-10-09 | Superconducting circuit substrate and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62254963A JPH0196989A (en) | 1987-10-09 | 1987-10-09 | Superconducting circuit substrate and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0196989A true JPH0196989A (en) | 1989-04-14 |
Family
ID=17272299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62254963A Pending JPH0196989A (en) | 1987-10-09 | 1987-10-09 | Superconducting circuit substrate and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0196989A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0341782A (en) * | 1989-07-10 | 1991-02-22 | Sanyo Electric Co Ltd | Method for forming electrodes of oxide superconductor film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645041A (en) * | 1987-06-29 | 1989-01-10 | Shinko Electric Ind Co | Manufacture of ceramic body having superconducting circuit pattern |
-
1987
- 1987-10-09 JP JP62254963A patent/JPH0196989A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645041A (en) * | 1987-06-29 | 1989-01-10 | Shinko Electric Ind Co | Manufacture of ceramic body having superconducting circuit pattern |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0341782A (en) * | 1989-07-10 | 1991-02-22 | Sanyo Electric Co Ltd | Method for forming electrodes of oxide superconductor film |
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