JPH0197557U - - Google Patents
Info
- Publication number
- JPH0197557U JPH0197557U JP19369887U JP19369887U JPH0197557U JP H0197557 U JPH0197557 U JP H0197557U JP 19369887 U JP19369887 U JP 19369887U JP 19369887 U JP19369887 U JP 19369887U JP H0197557 U JPH0197557 U JP H0197557U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- hollow part
- board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案によるＩＣ回路基板の一例の要
部の略線的拡大平面図、第２図はそのＡ―Ａ線上
の拡大断面図、第３図は電子部品の他の例の斜視
図、第４図及び第５図は従来基板の各例の断面図
及び斜視図である。
１は基板、２は回路配線パターン、３はＩＣチ
ツプ、５は樹脂、８は中空抜け部分７を有する電
子部品である。
FIG. 1 is a schematic enlarged plan view of essential parts of an example of an IC circuit board according to the present invention, FIG. 2 is an enlarged sectional view taken along line A-A, and FIG. 3 is a perspective view of another example of an electronic component. , FIG. 4, and FIG. 5 are a sectional view and a perspective view of each example of a conventional substrate. 1 is a substrate, 2 is a circuit wiring pattern, 3 is an IC chip, 5 is a resin, and 8 is an electronic component having a hollow portion 7.
Claims (1)
抜け部分を有しこのＩＣチツプをほぼ囲むように
電子部品とが配置固着され、 前記ＩＣチツプが収容された前記電子部品の前
記中空抜け部分内に前記ＩＣチツプを覆つて樹脂
が充填配置されてなるＩＣ回路基板。[Claims for Utility Model Registration] An IC chip and an electronic component having a hollow part that can accommodate the IC chip are arranged and fixed on a board on which a circuit wiring pattern is formed so as to almost surround the IC chip, An IC circuit board, wherein a resin is filled and placed in the hollow part of the electronic component in which the IC chip is housed, covering the IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19369887U JPH0197557U (en) | 1987-12-21 | 1987-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19369887U JPH0197557U (en) | 1987-12-21 | 1987-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197557U true JPH0197557U (en) | 1989-06-29 |
Family
ID=31484476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19369887U Pending JPH0197557U (en) | 1987-12-21 | 1987-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197557U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087294A (en) * | 2008-09-30 | 2010-04-15 | Toshiba Corp | Printed circuit board and electronic apparatus having printed circuit board |
-
1987
- 1987-12-21 JP JP19369887U patent/JPH0197557U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087294A (en) * | 2008-09-30 | 2010-04-15 | Toshiba Corp | Printed circuit board and electronic apparatus having printed circuit board |