JPH0197573U - - Google Patents

Info

Publication number
JPH0197573U
JPH0197573U JP1987193360U JP19336087U JPH0197573U JP H0197573 U JPH0197573 U JP H0197573U JP 1987193360 U JP1987193360 U JP 1987193360U JP 19336087 U JP19336087 U JP 19336087U JP H0197573 U JPH0197573 U JP H0197573U
Authority
JP
Japan
Prior art keywords
circuit board
square
circuit
hole
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987193360U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987193360U priority Critical patent/JPH0197573U/ja
Publication of JPH0197573U publication Critical patent/JPH0197573U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による角部を有する角型貫通穴
の実施例を説明する回路基板の平面図、第２図は
従来の角部を有する角型貫通穴の実施例を説明す
る回路基板の平面図、第３図は理想とする角部が
直角を有する角型貫通穴の回路基板の平面図であ
る。 １…回路基板、２…角型貫通穴、３…集積回路
またはチツプ型電子部品、４…角型貫通穴の角部
。 FIG. 1 is a plan view of a circuit board illustrating an embodiment of a square through hole having corners according to the present invention, and FIG. 2 is a plan view of a circuit board illustrating an embodiment of a conventional square through hole having corners. The plan view of FIG. 3 is a plan view of an ideal circuit board having a rectangular through hole with right-angled corners. 1... Circuit board, 2... Square through hole, 3... Integrated circuit or chip type electronic component, 4... Corner of square through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両側表面に回路層を有する回路基板において、
集積回路とチツプ型電子部品とを埋設して実装す
る前記回路基板の板厚方向にあけられた角型貫通
穴の角部が、前記角型貫通穴の二辺の交点を通る
円弧形成されていることを特徴とする回路基板。 In a circuit board having circuit layers on both surfaces,
A corner of a square through-hole drilled in the board thickness direction of the circuit board on which an integrated circuit and a chip-type electronic component are buried and mounted is formed into an arc passing through an intersection of two sides of the square through-hole. A circuit board characterized by:
JP1987193360U 1987-12-18 1987-12-18 Pending JPH0197573U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987193360U JPH0197573U (en) 1987-12-18 1987-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987193360U JPH0197573U (en) 1987-12-18 1987-12-18

Publications (1)

Publication Number Publication Date
JPH0197573U true JPH0197573U (en) 1989-06-29

Family

ID=31484154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987193360U Pending JPH0197573U (en) 1987-12-18 1987-12-18

Country Status (1)

Country Link
JP (1) JPH0197573U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011253835A (en) * 2010-05-31 2011-12-15 Tdk-Lambda Corp Boards for electronic circuit
JP2012216575A (en) * 2011-03-31 2012-11-08 Nec Toppan Circuit Solutions Inc Component built-in printed circuit board and manufacturing method thereof
JP2016018842A (en) * 2014-07-07 2016-02-01 富士電機株式会社 Semiconductor device
JP2016151666A (en) * 2015-02-17 2016-08-22 キヤノン株式会社 Scanning optical device
US10281834B2 (en) 2015-02-17 2019-05-07 Canon Kabushiki Kaisha Optical scanning device
JP2019139249A (en) * 2019-05-07 2019-08-22 キヤノン株式会社 Scanning optical device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011253835A (en) * 2010-05-31 2011-12-15 Tdk-Lambda Corp Boards for electronic circuit
JP2012216575A (en) * 2011-03-31 2012-11-08 Nec Toppan Circuit Solutions Inc Component built-in printed circuit board and manufacturing method thereof
JP2016018842A (en) * 2014-07-07 2016-02-01 富士電機株式会社 Semiconductor device
JP2016151666A (en) * 2015-02-17 2016-08-22 キヤノン株式会社 Scanning optical device
US10281834B2 (en) 2015-02-17 2019-05-07 Canon Kabushiki Kaisha Optical scanning device
JP2019139249A (en) * 2019-05-07 2019-08-22 キヤノン株式会社 Scanning optical device

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