JPH0197596U - - Google Patents

Info

Publication number
JPH0197596U
JPH0197596U JP19333887U JP19333887U JPH0197596U JP H0197596 U JPH0197596 U JP H0197596U JP 19333887 U JP19333887 U JP 19333887U JP 19333887 U JP19333887 U JP 19333887U JP H0197596 U JPH0197596 U JP H0197596U
Authority
JP
Japan
Prior art keywords
dummy element
air cover
air
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19333887U
Other languages
Japanese (ja)
Other versions
JPH064636Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19333887U priority Critical patent/JPH064636Y2/en
Publication of JPH0197596U publication Critical patent/JPH0197596U/ja
Application granted granted Critical
Publication of JPH064636Y2 publication Critical patent/JPH064636Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の原理側面図、第2図は本考案
による一実施例の説明図で、aは斜視図、bは側
面図、第3図は従来の説明図で、aは側面図、b
は平面図を示す。 図において、1はプリント基板、2は半導体素
子、3はダミー素子、4はエアカバー、5は止め
板、6は押え板、7はエア、8は通風路を示す。
Fig. 1 is a side view of the principle of the present invention, Fig. 2 is an explanatory view of one embodiment of the invention, where a is a perspective view, b is a side view, and Fig. 3 is a conventional explanatory view, and a is a side view. ,b
shows a plan view. In the figure, 1 is a printed circuit board, 2 is a semiconductor element, 3 is a dummy element, 4 is an air cover, 5 is a stop plate, 6 is a holding plate, 7 is air, and 8 is a ventilation path.

Claims (1)

【実用新案登録請求の範囲】 複数の半導体素子2が実装されたプリント基板
1と、該半導体素子2が実装された実装面1Aを
覆うエアカバー4と、該プリント基板1と該エア
カバー4との間に形成された通風路8に配設され
たダミー素子3とを備え、該通風路8に通風され
るエア7のバランスが得られるように形成される
ダミー素子の取付構造であつて、 前記ダミー素子3の一端に止め板5を設け、該
止め板5を前記エアカバー4とによつて挟持する
よう該エアカバー4に係止される押え板6が設け
られて成ることを特徴とするダミー素子の取付構
造。
[Claims for Utility Model Registration] A printed circuit board 1 on which a plurality of semiconductor elements 2 are mounted, an air cover 4 that covers the mounting surface 1A on which the semiconductor elements 2 are mounted, and the printed circuit board 1 and the air cover 4. A dummy element mounting structure is provided with a dummy element 3 disposed in a ventilation passage 8 formed between the two, and is formed so as to obtain a balance of air 7 ventilated in the ventilation passage 8, A stop plate 5 is provided at one end of the dummy element 3, and a presser plate 6 is provided that is locked to the air cover 4 so as to sandwich the stop plate 5 with the air cover 4. Mounting structure of dummy element.
JP19333887U 1987-12-18 1987-12-18 Dummy element mounting structure Expired - Lifetime JPH064636Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19333887U JPH064636Y2 (en) 1987-12-18 1987-12-18 Dummy element mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19333887U JPH064636Y2 (en) 1987-12-18 1987-12-18 Dummy element mounting structure

Publications (2)

Publication Number Publication Date
JPH0197596U true JPH0197596U (en) 1989-06-29
JPH064636Y2 JPH064636Y2 (en) 1994-02-02

Family

ID=31484136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19333887U Expired - Lifetime JPH064636Y2 (en) 1987-12-18 1987-12-18 Dummy element mounting structure

Country Status (1)

Country Link
JP (1) JPH064636Y2 (en)

Also Published As

Publication number Publication date
JPH064636Y2 (en) 1994-02-02

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