JPH0199619U - - Google Patents
Info
- Publication number
- JPH0199619U JPH0199619U JP1987195614U JP19561487U JPH0199619U JP H0199619 U JPH0199619 U JP H0199619U JP 1987195614 U JP1987195614 U JP 1987195614U JP 19561487 U JP19561487 U JP 19561487U JP H0199619 U JPH0199619 U JP H0199619U
- Authority
- JP
- Japan
- Prior art keywords
- composite material
- layer
- gas barrier
- resin
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 7
- 239000006260 foam Substances 0.000 claims description 5
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims 2
- 229920006122 polyamide resin Polymers 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims 1
- 235000011037 adipic acid Nutrition 0.000 claims 1
- 239000001361 adipic acid Substances 0.000 claims 1
- -1 m-xylylene adipamide Chemical compound 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 229920005990 polystyrene resin Polymers 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
第１図は、本考案の緩衝性複合材の断面図であ
り、第２図は本考案の他の例の緩衝性複合材の断
面図であり、第３図は本考案の更に他の例の緩衝
性複合材の断面図である。
Ａ……上層シート、Ｂ……下層シート、Ｃ……
独立中空室、１，１′，１″……ガスバリヤー層
、２，２′……接着層、３……発泡体層、４……
ポリオレフイン系樹脂層。
FIG. 1 is a cross-sectional view of a cushioning composite material of the present invention, FIG. 2 is a cross-sectional view of another example of a cushioning composite material of the present invention, and FIG. 3 is a still another example of the present invention. FIG. 2 is a cross-sectional view of a cushioning composite material. A... Upper layer sheet, B... Lower layer sheet, C...
Independent hollow chamber, 1, 1', 1''... gas barrier layer, 2, 2'... adhesive layer, 3... foam layer, 4...
Polyolefin resin layer.
Claims (1)
中空室が形成されている緩衝性複合材において、
上層シート及び下層シートはいずれもガスバリヤ
ー層を含み、かつ少くとも一方のシートの最外層
には熱可塑性樹脂発泡体層が設けられていること
を特徴とする緩衝性複合材。 (2) ガスバリヤー層がガスバリヤー性樹脂の単
独層である実用新案登録請求の範囲第１項記載の
緩衝性複合材。 (3) ガスバリヤー層がガスバリヤー性樹脂とポ
リオレフイン系樹脂からなる混合樹脂層である実
用新案登録請求の範囲第１項記載の緩衝性複合材
。 (4) ガスバリヤー樹脂がポリアミド系樹脂であ
る実用新案登録請求の範囲第２項又は第３項記載
の緩衝性複合材。 (5) ポリアミド系樹脂がｍ―キシリレンアジパ
ミドあるいはｍ―キシリレンジアミンと、アジピ
ン酸、イソフタール酸及びテレフタール酸から選
ばれた２種以上の有機酸との共重縮合体である実
用新案登録請求の範囲第４項記載の緩衝性複合材
。 (6) 熱可塑性樹脂発泡体がポリオレフイン系樹
脂発泡体あるいはポリスチレン系樹脂発泡体であ
る実用新案登録請求の範囲第１項乃至第５項のい
ずれか記載の緩衝性複合材。[Claims for Utility Model Registration] (1) In a cushioning composite material in which a large number of independent hollow chambers are formed between an upper layer sheet and a lower layer sheet,
1. A cushioning composite material, wherein both the upper sheet and the lower sheet include a gas barrier layer, and at least one of the sheets has a thermoplastic resin foam layer provided on the outermost layer. (2) The cushioning composite material according to claim 1, wherein the gas barrier layer is a single layer of gas barrier resin. (3) The cushioning composite material according to claim 1, wherein the gas barrier layer is a mixed resin layer consisting of a gas barrier resin and a polyolefin resin. (4) The cushioning composite material according to claim 2 or 3, wherein the gas barrier resin is a polyamide resin. (5) A utility model in which the polyamide resin is a copolycondensate of m-xylylene adipamide or m-xylylene diamine and two or more organic acids selected from adipic acid, isophthalic acid, and terephthalic acid. A cushioning composite material according to registered claim 4. (6) The cushioning composite material according to any one of claims 1 to 5, wherein the thermoplastic resin foam is a polyolefin resin foam or a polystyrene resin foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987195614U JPH0611183Y2 (en) | 1987-12-23 | 1987-12-23 | Cushioning composite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987195614U JPH0611183Y2 (en) | 1987-12-23 | 1987-12-23 | Cushioning composite |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0199619U true JPH0199619U (en) | 1989-07-04 |
| JPH0611183Y2 JPH0611183Y2 (en) | 1994-03-23 |
Family
ID=31486285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987195614U Expired - Lifetime JPH0611183Y2 (en) | 1987-12-23 | 1987-12-23 | Cushioning composite |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611183Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0237873U (en) * | 1988-08-31 | 1990-03-13 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52147178U (en) * | 1976-04-30 | 1977-11-08 | ||
| JPS6112862A (en) * | 1984-06-29 | 1986-01-21 | Mitsubishi Electric Corp | Chip material for commutator and its manufacture |
-
1987
- 1987-12-23 JP JP1987195614U patent/JPH0611183Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52147178U (en) * | 1976-04-30 | 1977-11-08 | ||
| JPS6112862A (en) * | 1984-06-29 | 1986-01-21 | Mitsubishi Electric Corp | Chip material for commutator and its manufacture |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0237873U (en) * | 1988-08-31 | 1990-03-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611183Y2 (en) | 1994-03-23 |
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