JPH02102792U - - Google Patents
Info
- Publication number
- JPH02102792U JPH02102792U JP1029489U JP1029489U JPH02102792U JP H02102792 U JPH02102792 U JP H02102792U JP 1029489 U JP1029489 U JP 1029489U JP 1029489 U JP1029489 U JP 1029489U JP H02102792 U JPH02102792 U JP H02102792U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- semiconductor unit
- houses
- control panel
- cooling fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａ及びｂは本考案の内部正面、及び側面
説明図、第２図は従来例を示す内部正面、及び側
面説明図である。
１……筐体、４……排熱器、６……半導体ユニ
ツト、７……冷却フアン、８……半導体機器、９
……排熱口、１０……吸気口、１５……風胴、１
６……側壁、１７……下端部開口、１８……上端
部開口。
1A and 1B are internal front and side explanatory views of the present invention, and FIG. 2 is an internal front and side explanatory views of a conventional example. 1... Housing, 4... Heat exhauster, 6... Semiconductor unit, 7... Cooling fan, 8... Semiconductor equipment, 9
...Exhaust vent, 10...Intake port, 15...Wind barrel, 1
6... Side wall, 17... Lower end opening, 18... Upper end opening.
Claims (1)
冷却する吸気口、排気口、及び冷却フアンを一体
形成した半導体ユニツトと、その他の発熱体とを
収納した筐体よりなる制御盤において、 前記半導体ユニツトの排熱口上端と、前記筐体
の上面板間に風胴を取り付けて、前記半導体ユニ
ツト内及び筐体内の熱を前記冷却フアンで筐体外
に放熱するようにしたことを特徴とする制御盤。[Scope of Claim for Utility Model Registration] Consisting of a casing that houses a semiconductor device, and also houses a semiconductor unit integrally formed with an intake port, an exhaust port, and a cooling fan for cooling the semiconductor device, and other heating elements. In the control panel, a wind cylinder is installed between the upper end of the heat exhaust port of the semiconductor unit and the upper surface plate of the casing, and the heat inside the semiconductor unit and the casing is radiated to the outside of the casing by the cooling fan. A control panel characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1029489U JPH02102792U (en) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1029489U JPH02102792U (en) | 1989-01-31 | 1989-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102792U true JPH02102792U (en) | 1990-08-15 |
Family
ID=31217826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1029489U Pending JPH02102792U (en) | 1989-01-31 | 1989-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102792U (en) |
-
1989
- 1989-01-31 JP JP1029489U patent/JPH02102792U/ja active Pending
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