JPH02104627U - - Google Patents

Info

Publication number
JPH02104627U
JPH02104627U JP1989012307U JP1230789U JPH02104627U JP H02104627 U JPH02104627 U JP H02104627U JP 1989012307 U JP1989012307 U JP 1989012307U JP 1230789 U JP1230789 U JP 1230789U JP H02104627 U JPH02104627 U JP H02104627U
Authority
JP
Japan
Prior art keywords
photosensitive resin
flat belt
resin liquid
bottomed cup
coating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989012307U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989012307U priority Critical patent/JPH02104627U/ja
Publication of JPH02104627U publication Critical patent/JPH02104627U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
JP1989012307U 1989-02-03 1989-02-03 Pending JPH02104627U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989012307U JPH02104627U (2) 1989-02-03 1989-02-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989012307U JPH02104627U (2) 1989-02-03 1989-02-03

Publications (1)

Publication Number Publication Date
JPH02104627U true JPH02104627U (2) 1990-08-20

Family

ID=31221635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989012307U Pending JPH02104627U (2) 1989-02-03 1989-02-03

Country Status (1)

Country Link
JP (1) JPH02104627U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017104794A (ja) * 2015-12-08 2017-06-15 昭和電工株式会社 塗布材料の回収方法、半導体装置の製造方法、およびスピン塗布装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017104794A (ja) * 2015-12-08 2017-06-15 昭和電工株式会社 塗布材料の回収方法、半導体装置の製造方法、およびスピン塗布装置

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