JPH02104636U - - Google Patents
Info
- Publication number
- JPH02104636U JPH02104636U JP1376789U JP1376789U JPH02104636U JP H02104636 U JPH02104636 U JP H02104636U JP 1376789 U JP1376789 U JP 1376789U JP 1376789 U JP1376789 U JP 1376789U JP H02104636 U JPH02104636 U JP H02104636U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin sealing
- lead
- showing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例１を示す平面図、第２
図は本考案の実施例２を示す平面図、第３図は本
考案による樹脂封止後の状態を示す断面図、第４
図はリード成形状態を示す断面図、第５図は従来
例を示す平面図、第６図は従来例によるリード成
形を行つた状態を示す断面図である。
１……リードフレーム、２……メインランナ、
３……サブランナ、４……パツケージ、５……樹
脂ゲート、６……リード、９……キヤビテイ、１
０……樹脂部。
Figure 1 is a plan view showing the first embodiment of the present invention;
The figure is a plan view showing the second embodiment of the present invention, FIG. 3 is a sectional view showing the state after resin sealing according to the present invention, and FIG.
5 is a plan view showing a conventional example, and FIG. 6 is a sectional view showing a state in which lead forming is performed according to the conventional example. 1...Lead frame, 2...Main runner,
3...Subrunner, 4...Package, 5...Resin gate, 6...Lead, 9...Cavity, 1
0...Resin part.
Claims (1)
ード先端相互間を樹脂にて連結するためのサブラ
ンナを有することを特徴とするＩＣ用樹脂封止装
置。 A resin sealing device for IC, characterized in that the mold for resin sealing IC has a sub-runner for connecting the lead tips of a lead frame with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1376789U JPH02104636U (en) | 1989-02-08 | 1989-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1376789U JPH02104636U (en) | 1989-02-08 | 1989-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104636U true JPH02104636U (en) | 1990-08-20 |
Family
ID=31224361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1376789U Pending JPH02104636U (en) | 1989-02-08 | 1989-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104636U (en) |
-
1989
- 1989-02-08 JP JP1376789U patent/JPH02104636U/ja active Pending
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