JPH02106705U

JPH02106705U -

Info

Publication number: JPH02106705U
Application number: JP1388189U
Authority: JP
Priority date: 1989-02-08
Filing date: 1989-02-08
Publication date: 1990-08-24

Description

[Brief explanation of drawings]

第１図はこの考案の一実施例によるマイクロ波
装置の上面図、第２図は第１図の底面図、第３図
は第１図の正面断面図、第４図は段差部を示す部
分拡大側断面図、第５図はこの考案の他の実施例
であるマイクロ波装置の底面図、第６図は第５図
部分拡大側断面図、第７図は従来のマイクロ波装
置の上面図、第８図は第７図の正面断面図である
。図において、１０は収容筐体、１０ａは迫り出
し部、１０ｂは段差部、２はＭＩＣキヤリア、２
ａは張り出し部、３はＭＩＣ基板、４は固定ねじ
、５は上面カバー、６は接栓、７は下面カバー、
８は押さえ金具である。なお、図中、同一符号は
同一、又は相当部分を示す。 Fig. 1 is a top view of a microwave device according to an embodiment of this invention, Fig. 2 is a bottom view of Fig. 1, Fig. 3 is a front sectional view of Fig. 1, and Fig. 4 is a portion showing a stepped portion. 5 is an enlarged side sectional view, FIG. 5 is a bottom view of a microwave device according to another embodiment of the invention, FIG. 6 is a partially enlarged side sectional view of FIG. 5, and FIG. 7 is a top view of a conventional microwave device. , FIG. 8 is a front sectional view of FIG. 7. In the figure, 10 is a storage case, 10a is a protruding part, 10b is a stepped part, 2 is a MIC carrier, 2
a is an overhang, 3 is a MIC board, 4 is a fixing screw, 5 is a top cover, 6 is a plug, 7 is a bottom cover,
8 is a presser metal fitting. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims

[Scope of Claim for Utility Model Registration] A microwave integrated circuit is constructed by bonding a dielectric substrate on which a metal pattern is formed onto a metal carrier, and this microwave integrated circuit is housed in a housing case. In a microwave device in which a plug is attached to a side wall of the body for taking out a connecting terminal of the microwave integrated circuit to the outside, the accommodation casing has a protruding part on the inner surface of the upper part of the opposing side wall, A top cover is placed over the protrusion, and the microwave integrated circuit board is placed below the protrusion, so that the top cover, the protrusion, and the microwave integrated circuit board cover the dielectric substrate. A shielded space is formed, a stepped surface is provided at the lower part of the plug of the accommodation casing on the same plane as the lower side of the protruding part, and the metal carrier is placed on both the lower part of the protruding part and the stepped surface. A microwave device characterized by having a structure in which it comes into contact with.