JPH02106841U - - Google Patents
Info
- Publication number
- JPH02106841U JPH02106841U JP1356189U JP1356189U JPH02106841U JP H02106841 U JPH02106841 U JP H02106841U JP 1356189 U JP1356189 U JP 1356189U JP 1356189 U JP1356189 U JP 1356189U JP H02106841 U JPH02106841 U JP H02106841U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- leads
- lead insertion
- insertion holes
- plate member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案に係るリード補強用板部材の
縦断面図、第２図は第１図の矢視線による平面
図、第３図は本考案に係る板部材の使用一実施例
の横断面図、第４図は本考案に係る板部材の使用
例側面図、第５図は本考案に係る板部材の製造過
程における一態様の平面図。
１０，１０′……リード補強用板部材、１２…
…リード挿入孔、１４……凹所、１６……集積回
路、１８……リード、２０……プリント基板、２
２……スルーホール。
Fig. 1 is a longitudinal sectional view of a lead reinforcing plate member according to the present invention, Fig. 2 is a plan view taken along the arrow line in Fig. 1, and Fig. 3 is a cross-sectional view of an example of use of the plate member according to the present invention. FIG. 4 is a side view of an example of use of the plate member according to the present invention, and FIG. 5 is a plan view of one aspect of the manufacturing process of the plate member according to the present invention. 10, 10'...Lead reinforcing plate member, 12...
... Lead insertion hole, 14 ... Recess, 16 ... Integrated circuit, 18 ... Lead, 20 ... Printed circuit board, 2
2...Through hole.
Claims (1)
ツチを有すると共に該リードの太さと概ね同一の
寸法を有した複数のリード挿入孔１２を設け、前
記集積回路に対向する面の反対側の面において前
記各リード挿入孔の端部周辺に凹所１４を形成し
たことを特徴とする集積回路のリード補強用板部
材。 A plurality of lead insertion holes 12 having a pitch equal to the pitch of the leads 18 of the integrated circuit 16 and dimensions approximately the same as the thickness of the leads are provided, and each of the lead insertion holes 12 is provided on the surface opposite to the surface facing the integrated circuit. A plate member for reinforcing leads of an integrated circuit, characterized in that a recess 14 is formed around the end of a lead insertion hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1356189U JPH02106841U (en) | 1989-02-09 | 1989-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1356189U JPH02106841U (en) | 1989-02-09 | 1989-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106841U true JPH02106841U (en) | 1990-08-24 |
Family
ID=31223973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1356189U Pending JPH02106841U (en) | 1989-02-09 | 1989-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106841U (en) |
-
1989
- 1989-02-09 JP JP1356189U patent/JPH02106841U/ja active Pending