JPH02107579A - Joining method for ceramic - Google Patents
Joining method for ceramicInfo
- Publication number
- JPH02107579A JPH02107579A JP25951988A JP25951988A JPH02107579A JP H02107579 A JPH02107579 A JP H02107579A JP 25951988 A JP25951988 A JP 25951988A JP 25951988 A JP25951988 A JP 25951988A JP H02107579 A JPH02107579 A JP H02107579A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- layer
- electroless plating
- joining
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明はセラミックスと金属またはセラミックス部材同
一にを接合させる方法に関する。史に詳細には、本発明
は接合力を一層向」ニさせることのできるセラミックス
と金属またはセラミックス部材同一1−の接合方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for joining ceramics and metal or ceramic members together. More specifically, the present invention relates to a method for joining ceramics and metal or ceramic members of the same type, which can further improve the joining force.
[従来の技術]
ガスタービンやディーゼルエンジンなどの内燃機関によ
うに高温、高負何で使用される機械部品あるいは宇宙機
器部品および特殊条件で使用される軸受等では耐負荷性
、耐熱性、耐食性および耐摩耗性の向」二や軽[Il化
を目的としてセラミックスが使用されることが多い。[Conventional technology] Mechanical parts or space equipment parts used in internal combustion engines such as gas turbines and diesel engines at high temperatures and high loads, and bearings used under special conditions have high load resistance, heat resistance, corrosion resistance, and Ceramics are often used for the purpose of improving wear resistance and light weight.
また、包丁やナイフ等の刃物類においては、超高嫂度に
よる高度な切削性、耐摩耗性、耐食性および軽量性のた
め、セラミックスが用いられ始めている。In addition, ceramics have begun to be used in cutlery such as kitchen knives and knives due to their high cutting properties due to their ultra-high strength, wear resistance, corrosion resistance, and light weight.
しかし、セラミックスは難加工性であるため、複雑な形
状で高精度の部品あるいは大型の部品を製作することは
一般的に困難であり、無理にやろうとすればコストがか
かり過ぎてしまう。However, since ceramics are difficult to process, it is generally difficult to manufacture highly accurate parts or large parts with complex shapes, and if you try to do it forcibly, it will be too costly.
また、セラミックスは低靭性であるため、刃物等では落
ドや打撃などの衝撃により破損しやすく、取扱に[−分
な注意が必要である。In addition, since ceramics have low toughness, they are easily damaged by impacts such as drops or blows on knives, etc., and special care must be taken when handling them.
このため、複数のセラミックス部材あるいはセラミック
スと金属または合金部材に分割製造し、これらの部材を
使用条件に適合するように接合し一体化させることによ
り、製作を容易化し、製造コストを低減させる試みが行
われている。For this reason, attempts have been made to simplify manufacturing and reduce manufacturing costs by separately manufacturing multiple ceramic components or ceramic and metal or alloy components, and then joining and integrating these components to suit usage conditions. It is being done.
[発明が解決しようとする課題]
比較的小形のセラミックス部品や刃物類等は本構造であ
るが、ガスタービン用ブレードやエンジン部品笠はセラ
ミックスと鉄、銅、アルミニウム等の5111体金属あ
るいは合金等との拡散接合、圧接、焼成め、あるいはロ
ー付は等が行われている。[Problems to be Solved by the Invention] Relatively small ceramic parts and cutlery have this structure, but gas turbine blades and engine parts shade are made of ceramics and 5111 metals or alloys such as iron, copper, aluminum, etc. Diffusion bonding, pressure welding, firing, brazing, etc. are performed.
拡散接合は設備が大型となり、更に、接合時にセラミッ
クス部材および金属または合金部材の接合部を融点付近
に加熱するため、組織変化等による機能、品質の劣化や
、熱変形、熱応力による精度および強度の低ドの原因と
なることかある。Diffusion bonding requires large equipment, and since the joint of ceramic components and metal or alloy components is heated to near the melting point during bonding, there may be deterioration of function and quality due to structural changes, and accuracy and strength may be affected due to thermal deformation or thermal stress. This may cause low energy levels.
一方、II−接、焼成め、ロー付は等では接合力を確保
するため、大きな接合部が必要となり、また、大きな加
圧力あるいは嵌合力が必要となり、歪みおよび残留応力
等が生じ易い。On the other hand, in II-welding, firing, brazing, etc., a large joint is required to ensure the joining force, and a large pressing force or fitting force is also required, which tends to cause distortion, residual stress, etc.
部の接合面に高温ローを施し、高置/I!la導加熱に
よりロー付けする方法が実施されている。この方法は必
要な接合力を得るため、大面積を殻し、高温加熱による
による歪みや残留応力が発生しやすい。また、ロー祠を
インサートとして用いる場合には接合部材の形状が制約
される。Apply high-temperature brazing to the joint surfaces of the parts and place high / I! A method of brazing by la conduction heating has been implemented. In order to obtain the necessary bonding force, this method involves covering a large area, which tends to cause distortion and residual stress due to high-temperature heating. Furthermore, when using a wax hod as an insert, the shape of the joining member is restricted.
従って、本発明の[1的はセラミックス部材と金属また
は合金部材あるいはセラミックス部材間りを接合させる
際に、両部材を高l舐加熱しなくても強固に接合させる
ことのできる方法を提供することである。Therefore, one object of the present invention is to provide a method that can firmly join a ceramic member and a metal or alloy member or a ceramic member without subjecting both members to high heat. It is.
[課題を解決するための丁段コ
前記L1的を迷成するために、本発明では、セラミック
ス部材と金属系部材あるいはセラミックス部材間トを接
合する方法において、少なくとも何れか 力の部材の接
合部に、導電性金属または合金の少なくとも何れか一方
の無電解メッキ層と、少なくとも2種類の異なる材料の
層が交riに積層されてなるロー材層とを連続的に設け
るか、もしくは、一方の部材の接合面に前記無電解メッ
キ層を設け、他方の部材の接合部に前記ロー材層を設け
、接合部およびその近傍を高周波誘導加熱により加熱し
、前記ロー材層を溶融拡散させることにより両部材を接
合させることを特徴とするセラミックスの接合力法を提
供する。[To solve the problem] In order to avoid the above-mentioned point L1, in the present invention, in the method of joining a ceramic member and a metal member or between ceramic members, at least one of the joining parts of the force member is used. An electroless plating layer of at least one of a conductive metal or an alloy and a brazing material layer formed by laminating layers of at least two different materials in an alternating manner are continuously provided, or one of the electroless plating layers is continuously provided. By providing the electroless plating layer on the joining surface of the members, providing the brazing material layer on the joining part of the other member, heating the joining part and its vicinity by high-frequency induction heating, and melting and diffusing the brazing material layer. A method of bonding force for ceramics is provided, which is characterized by bonding both members.
セラミックス部材の接合面となる部分の素地表面および
金属系部材の接合部となる部分の素地表面の一方または
両方をエツチング処理してから(!(電解メッキ層を設
けることが好ましい。It is preferable to perform an etching treatment on one or both of the base surface of the part that will become the joint surface of the ceramic member and the base surface of the part that will become the joint part of the metal-based member (! (It is preferable to provide an electrolytic plating layer.
セラミックス部材と金属系部材あるいはセラミックス部
材同士が互いに嵌合しあう構造にpめ作製しておくと一
層高い接合力が得られる。Even higher bonding strength can be obtained by creating a structure in which the ceramic member and the metal member or the ceramic members fit into each other.
[作用]
+lif記のように、本発明の接合方法によれば、無電
解メッキ層と共に、少なくとも2種類の異なる材料の層
が交IEに積層されてなるロー材層を介在させることに
よりセラミックス部材と金属系部材またはセラミックス
部材間「を接合させる。[Function] As described in +lif, according to the joining method of the present invention, a ceramic member can be bonded by interposing a brazing material layer in which layers of at least two different materials are laminated in an alternating IE together with an electroless plating layer. and metal or ceramic members.
無電解メッキ層とロー材層とを併用し、セラミックス部
材と金属部材を接合させる方法は特開昭60−2008
89号公報に開示されている。しかし、この方法ではM
o −M nコート層を介して無電解メッキ層が形成
されており、また、ロー材層もN1−Pアモルファス7
1の中層であり、本発明のノJ法と顕なる。A method for joining ceramic members and metal members by using both an electroless plating layer and a brazing material layer is disclosed in Japanese Patent Application Laid-Open No. 60-2008.
It is disclosed in Publication No. 89. However, with this method, M
An electroless plating layer is formed through the o -M n coating layer, and the brazing material layer is also N1-P amorphous 7.
This is the middle layer of 1, and is manifested as the NoJ method of the present invention.
実際、+1を層のロー祠に比べて、2種類以−1−の穴
なる材料を交ll:に積層させることにより形成された
ロー材層をj!1(電解メッキ層と併用すると接合強度
がイしく高められること、および、比較的低温の適当な
接合温度を選定することにより両部材の歪を抑制するこ
とが発見された。In fact, by comparing +1 with the row material of the layer, a row material layer formed by laminating two or more types of hole materials in a j! 1 (It has been discovered that the bonding strength can be greatly increased when used in combination with an electrolytic plated layer, and that distortion of both members can be suppressed by selecting an appropriate bonding temperature that is relatively low.
[実施例]
以下、図面を参照しながら本発明の具体例について史に
詳細に説明する。[Example] Hereinafter, specific examples of the present invention will be described in detail with reference to the drawings.
セラミックスは・股的に電気的絶縁体もしくは高電気抵
抗体であり、直接電気メッキあるいはロー付げにより金
属被膜を施すことは極めて難しい。Ceramics are electrical insulators or highly electrically resistive materials, and it is extremely difficult to apply a metal coating directly to them by electroplating or brazing.
このため、本発明においては、セラミックスの素地表面
を化学的に腐食(エツチング)させ、強固な被膜を得る
のに要する微細孔を形成させる。エツチング微細孔を有
するセラミックス素地表面に金属および/または合金を
無電解メンキすると、金属および/または合金が@細1
孔中に侵入し、いわゆる「投錨」効果により極め強固な
無電解メッキ層が形成される。しかし、このエツチング
処理は本発明の必須安住ではない。ガラス系セラミ。Therefore, in the present invention, the surface of the ceramic base is chemically etched to form micropores necessary to obtain a strong coating. When a metal and/or alloy is electrolessly etched onto the surface of a ceramic base material having fine pores, the metal and/or alloy becomes
It penetrates into the holes and forms an extremely strong electroless plating layer due to the so-called "anchoring" effect. However, this etching process is not essential to the present invention. Glass ceramic.
クスなとのように本来的に粗面性のものならば直接無電
解メッキしてもメッキ層の投錨効果が得られる。If the surface of the material is inherently rough, such as clay, direct electroless plating can provide the anchoring effect of the plating layer.
化学的腐食(工、チング)を行うには、苛性アルカリ、
フ、化物等および硝酸、フッ酸等が使用される。To perform chemical corrosion (etching), use caustic alkali,
Hydrofluoric acid, hydrofluoric acid, etc., and nitric acid, hydrofluoric acid, etc. are used.
例えば、水酸化ナトリウム(NaOH,200g)とフ
ッ化ナトリウム(NaF、100g/λ)からなる溶液
を140’cに加熱し、この溶液に、アルミニウムとア
ルミナ(AJ!203 )を主体とするセラミックス素
材を約25分間浸漬することにより、Aλ203の焼結
された粒界に侵食孔が形成される。侵食孔は約0.5μ
m〜10μm程度の孔径と深さを有し、メッキする金属
の投錨効果を十分に果たすことができる。孔の深さは最
大でも、その[ユに被覆される無電解メッキ層厚と同じ
程度であることが好ましい。孔の深さはエツチング液の
濃度、温度、浸l青時間等によりコントロールすること
ができる。For example, a solution consisting of sodium hydroxide (NaOH, 200 g) and sodium fluoride (NaF, 100 g/λ) is heated to 140'C, and a ceramic material mainly composed of aluminum and alumina (AJ!203) is added to the solution. By soaking for about 25 minutes, erosion pores are formed in the sintered grain boundaries of Aλ203. Erosion hole is approximately 0.5μ
It has a hole diameter and depth of approximately 10 μm to 10 μm, and can sufficiently provide an anchoring effect for the metal to be plated. The maximum depth of the hole is preferably approximately the same as the thickness of the electroless plating layer covering the hole. The depth of the pores can be controlled by the etching solution concentration, temperature, immersion time, etc.
エツチング処理を終えたセラミックスに金属および/ま
たは合金被膜を形成するには化学的に置換自己還元を行
う無電解メッキ(化学メッキ)法により行うことが好ま
しい。In order to form a metal and/or alloy coating on ceramics that have undergone etching treatment, it is preferable to use an electroless plating (chemical plating) method that performs chemical substitution and self-reduction.
無電解メッキを直接セラミックス素材に行うには、N+
+ N+ Co+ Ag+ Au+ Cu+ Pd
+Sr1等が使用できるが、セラミックス素材のエツチ
ング微細孔中に析出し、投錨の強度を期待するにはNi
およびその合金類が最も好ましい。To perform electroless plating directly on ceramic materials, N+
+ N+ Co+ Ag+ Au+ Cu+ Pd
+Sr1 etc. can be used, but Ni is precipitated in the etched micropores of the ceramic material and is required for anchoring strength.
and its alloys are most preferred.
無電解メッキは一般的に、(1)感受性付1ノ、(反応
促進)、(2)触媒活性化、(3)化学メッキの1’−
程からなる。Electroless plating generally involves (1) susceptibility, (reaction acceleration), (2) catalyst activation, and (3) chemical plating.
It consists of steps.
先ず、セラミックス表面の微細孔中に化学メッキの触媒
となる金属Pdを沈析させた後、化学メッキを行う。こ
のように処理されたセラミックス素材を、塩化第1錫5
〜20gおよび塩酸(12N)50〜200mJ!/J
!からなる水溶液に20〜50℃の温度で、約1〜5分
間浸漬する。First, metal Pd, which serves as a catalyst for chemical plating, is precipitated in micropores on the surface of the ceramic, and then chemical plating is performed. The ceramic material treated in this way is treated with 5% tin of tin chloride.
~20g and 50-200mJ of hydrochloric acid (12N)! /J
! It is immersed in an aqueous solution consisting of for about 1 to 5 minutes at a temperature of 20 to 50°C.
次に、このセラミックスを1°分に水洗し、その後、触
媒活性化溶液(塩化パラジウム0.05〜0.1gおよ
び塩酸10〜50m柔からなる水溶液100100Oに
20〜50′Cの温度で、約1〜5分間浸漬する。かく
して、塩化第1錫により還元された金属パラジウムの超
微粒fがセラミックス素材の表面に析出する。Next, this ceramic was washed with water for 1°, and then added to a catalyst activation solution (an aqueous solution of 100,100 O consisting of 0.05 to 0.1 g of palladium chloride and 10 to 50 molar hydrochloric acid at a temperature of 20 to 50'C, about Immerse for 1 to 5 minutes.In this way, ultrafine particles f of metallic palladium reduced by the stannous chloride are deposited on the surface of the ceramic material.
セラミックスを1・分に水としし、残存する塩素イオン
を除去した後、化学ニッケルメッキ浴においてニンケル
被膜を析出さ仕る。化学ニッケルメッキ浴中において、
温度60〜95°Cで素材に沈析した金属パラジウムが
初期反応として、化学ニッケル浴の二ノゲルイオンと反
応し、セラミックス表面に金属ニッケルを析出せしめ、
次いで、そのニンケル面1−に更にニッケルが還元析出
する。化学ニッケル浴の温度、水素イオン濃度、浸漬時
間等の因r、をコントロールすることにより、7易とす
る膜厚の無電解ニッケルメンキ第1層を形成することが
できる。After the ceramics are soaked in water for 1 min to remove residual chloride ions, a nickel coating is deposited in a chemical nickel plating bath. In a chemical nickel plating bath,
Metallic palladium precipitated on the material at a temperature of 60 to 95°C reacts with Ni-nogel ions in the chemical nickel bath as an initial reaction, precipitating metal nickel on the ceramic surface,
Next, further nickel is reduced and precipitated on the nickel surface 1-. By controlling factors such as the temperature, hydrogen ion concentration, and immersion time of the chemical nickel bath, it is possible to form the electroless nickel coated first layer with a film thickness of 70%.
このようにして形成された無電解メッキ層をイfするセ
ラミックス部材の断面構造を第1図に示す。FIG. 1 shows a cross-sectional structure of a ceramic member having an electroless plating layer formed in this way.
図示されているように、セラミックス1の1−面の、エ
ツチング処理により生じた微細孔2の内部に無電解メッ
キにより析出された金属3が侵入し、投錨効果を発揮し
ている。この微細孔トの表面には史に金属が析出して無
電解メッキ層4を形成している。As shown in the figure, metal 3 deposited by electroless plating enters into micropores 2 formed by etching on one side of ceramic 1, exerting an anchoring effect. Metal is precipitated on the surface of these fine holes to form an electroless plating layer 4.
この第1層(無電解メッキ層)の形成材料としては、N
iの他、Ni−Co、Ag+ Au+ CurPd、8
口等が使用されるが、N iまたはNi合金によると−
・股的に、最も高い19材微細孔への析出、投錨強度か
得られる。The material for forming this first layer (electroless plating layer) is N
In addition to i, Ni-Co, Ag+ Au+ CurPd, 8
However, according to Ni or Ni alloy -
・In terms of strength, the highest precipitation and anchoring strength of 19 materials can be obtained.
この第1層の1−に、該第1層が形成されているセラミ
’7クス部材と接合する金属系部材(例えば、甲体金属
または合金)あるいはセラミックス部材に所定の温度で
1−分に熱拡散を行い得る、ロー材層が電気メッキ法ま
たは無電解メッキ法により形成される。部材の形状がt
li純な甲面的なものならば電気メッキ法によりロー材
層を形成させることができるが、穴などのような複雑な
形状の場合には一般的に、無電解メッキ法によらなけれ
ばロー材層を形成させることが困難か、あるいは不i−
+J能である。This first layer is heated at a predetermined temperature for 1 minute to a metal member (for example, shell metal or alloy) or a ceramic member to be bonded to the ceramic member on which the first layer is formed. A brazing material layer capable of thermal diffusion is formed by electroplating or electroless plating. The shape of the member is t
If it is a pure back surface, a brazing material layer can be formed by electroplating, but in the case of a complex shape such as a hole, it is generally not possible to form a brazing material layer unless electroless plating is used. It is difficult or impossible to form a material layer.
+J Noh.
なお、ロー材第2層は必ずしもj!!(電解メッキ第1
層l二に連続的に積層させる必要はなく、接合の相手部
材となる金属系部材あるいはセラミ’7クス部材の方に
形成させることもできる。また、このように接合相T:
部材の方にロー材層を形成させる場合、ロー材層が形成
される部材の素地表面を工、チング処理して微細孔を生
成させ、この微細孔]1にロー材を侵入させることによ
り前記と同様な投錨効果を得ることもできる。Note that the second layer of brazing material is not necessarily j! ! (Electrolytic plating 1st
It is not necessary to continuously laminate the layers 1 and 2, but it can also be formed on the metal member or ceramic member that will be the mating member to be joined. Also, in this way, the joining phase T:
When a brazing material layer is formed on a member, the material surface of the material on which the brazing material layer is to be formed is processed to create micropores, and the brazing material is allowed to penetrate into these micropores. It is also possible to obtain a similar anchoring effect.
使用されるロー材としては、接合部材、特に金属または
合金部材の融点および加熱時の熱変態による予防+lな
との点を4慮して、低融点の金属または合金を選択する
ことか好ましい。As the brazing material used, it is preferable to select a metal or alloy with a low melting point, taking into account the melting point of the joining member, especially the metal or alloy member, and prevention of thermal transformation during heating.
Ag−Cu合金は、その2成分間で全域にわたって完全
固溶体であり、特にAg70wt%:Cu30wt%近
傍では780℃の共融点で最も良好なロー材となる。The Ag-Cu alloy is a complete solid solution between its two components over the entire region, and in particular, in the vicinity of 70 wt% Ag:30 wt% Cu, it becomes the best brazing material with a eutectic point of 780°C.
そこで、−例として、無電解メッキした第1層を有する
セラミックス部材または金属あるいは合金部材を陰極と
してAgメ、キとCuメッキを交lI:に、各層2〜3
μmの膜厚で積重させ、Ag:Cuが所定の比率(融点
780°Cでは7:3)になるように多層メッキする。Therefore, as an example, using a ceramic member, metal, or alloy member having the first layer plated electrolessly as a cathode, Ag plated, plated, and Cu plated are alternately plated for each layer 2 to 3.
The layers are stacked to a thickness of .mu.m, and multilayer plating is performed so that the Ag:Cu ratio becomes a predetermined ratio (7:3 at a melting point of 780.degree. C.).
合金混合比率は積層する層数たけでなく膜厚を変化させ
ることによってもコントロールすることができる。The alloy mixing ratio can be controlled not only by changing the number of laminated layers but also by changing the film thickness.
Ag−Cuロー材をメッキ被覆したセラミックス部材の
断面構造を第2図に示す。図示されているように、!!
に電解メッキ第1層4の」―にAgロー祠5とCuロー
材6とが交ljに積層されてロー材第2層7が形成され
ている。FIG. 2 shows the cross-sectional structure of a ceramic member plated with Ag-Cu brazing material. As shown! !
A second brazing material layer 7 is formed by stacking an Ag brazing material 5 and a Cu brazing material 6 in an alternating manner on the first electroplated layer 4.
ロー材メッキ層の全体の膜厚は必要な接合力に応じて、
5〜100μmの範囲内で適切に選択することができる
。The overall thickness of the brazing material plating layer depends on the required bonding force.
It can be appropriately selected within the range of 5 to 100 μm.
Ag−Cu間の金属拡散は常温でも時間の経過と共に徐
々に行われるが、250°C位から急速に進行し、共融
点では第1層の無電解メッキ金属(例えば、Ni)、接
合相手の金属系部材あるいはセラミックス部材にも拡散
し、完全なロー付けが行われる。Metal diffusion between Ag and Cu occurs gradually over time even at room temperature, but it progresses rapidly from around 250°C, and at the eutectic point, the electroless plated metal of the first layer (for example, Ni) and the bonding partner It also diffuses into metal parts or ceramic parts and completely brazes them.
本発明で使用できる代表的なロー材を下記の表1に挙げ
る。Typical brazing materials that can be used in the present invention are listed in Table 1 below.
ム一り
方のセラミックス部材にのみ無電解メッキ層とロー材層
とを連続的に積層させる例について説明してきたが、接
合される相手方の金属系部材またはセラミックス部材に
も無電解メッキ層とロー材層を積層させることも当然i
iJ能である。この場合、一方の接合部材のロー材層と
他方の接合部材のロー材層との総和により所望のロー材
層が形成されるように調整する必要がある。We have described an example in which an electroless plating layer and a brazing material layer are continuously laminated only on one ceramic member, but the electroless plating layer and brazing material layer are also laminated on the other metal or ceramic member to be joined. Of course, it is also possible to laminate layers of materials.
iJ Noh. In this case, it is necessary to adjust so that a desired brazing material layer is formed by the sum of the brazing material layer of one joining member and the brazing material layer of the other joining member.
次に、部材の接合丁−段について説明する。Next, the joining stages of the members will be explained.
第3図に示されるように、無電解メッキ第1層4および
ロー材第2層7を被覆されたセラミ・ソクス部材1と相
手方接合部材10とを係合させ、接合部の外面に誘導r
12を沿わせ、高周波誘導加熱を加え、接合面のロー材
を溶融させる。溶融されたロー材は無電解メッキ層と均
質に4シざり合い、セラミックス部材および相り方接合
部材へ均一・に拡散し、強固な接合面が形成される。As shown in FIG. 3, the ceramic sock member 1 coated with the first layer 4 of electroless plating and the second layer 7 of brazing material is engaged with the mating member 10, and an induced r
12 are aligned and high-frequency induction heating is applied to melt the brazing material on the joint surface. The molten brazing material is homogeneously bonded to the electroless plating layer and diffused uniformly into the ceramic member and the mating member to form a strong bonding surface.
このとき、山部材の構造、・J゛法、材質に応じ、高周
波周波数、出ツバ誘導子の大きさ、形状、巻数を設定す
ることにより、所定の加熱温度および加熱時間にコント
ロールすることができる。At this time, the heating temperature and heating time can be controlled to a predetermined value by setting the high frequency, the size, shape, and number of turns of the protruding flange inductor according to the structure, J method, and material of the mountain member. .
また、高周波誘導子に付加される周波数は一般的に、1
〜1000kHzの範囲内であり、接合部材の材質、形
状および・J゛法に応じて適宜選択することができる。Additionally, the frequency added to the high frequency inductor is generally 1
It is within the range of ~1000 kHz, and can be appropriately selected depending on the material and shape of the joining member and the J method.
ロー材の溶融71度、相り方接合部材の大きさに応じて
高周波誘導Y−の出力を適当にコントロールすることに
より、数秒間〜数分間の短時間内に加熱接合させること
ができる。By appropriately controlling the output of the high-frequency induction Y- according to the melting temperature of the brazing material at 71 degrees and the size of the joining members, heating and joining can be carried out within a short period of several seconds to several minutes.
第3図に示されるような形状の部材の接合強度について
、本発明の方法と従来の方法を比較した。The method of the present invention and the conventional method were compared with respect to the bonding strength of members having the shape shown in FIG.
セラミックス部材としてはAJI203を使用し、金属
系部材としては軟鋼を使用した。セラミックス部材の接
合面をエツチング処理し、N1−Pからなり、膜厚2〜
5 tt mの無電解メッキ層を形成し、この」ユに更
に、AgとCuが交互に積層(Ag:3層+Cu:2層
で計5層)され、Ag:Cuの小ht比が7:3となる
膜厚20,30゜40および60μmのロー材層を形成
させた。この接合面に金属部材の接合面を当接させ、接
合部外周から誘導子(周波数: 200kHz)で約5
秒間加熱し、ロー材を溶融拡散させて両部材を接合させ
た。一方、比較例として、tめ重吸比が約7=3に調節
されたAg−Cu合金ロー材を前記と同じ膜厚で1層の
形で前記と同様な無電解メッキ層の」−に積層させ、前
記と同じ条件で接合させた。本発明の接合部材と比較例
の接合部材とをアムスラ引張圧縮試験機にかけ、接合強
度を測定した。その結果、本発明の接合部材の接合強度
は平均で120MPaであるのに対し、比較例の接合部
材の接合強度は・1シ均で80MPaにしかならなかっ
た。AJI203 was used as the ceramic member, and mild steel was used as the metal member. The bonding surface of the ceramic member is etched and made of N1-P, with a film thickness of 2~
An electroless plating layer of 5 tt m was formed, and Ag and Cu were further alternately laminated on this layer (3 layers of Ag + 2 layers of Cu, total of 5 layers), and the small ht ratio of Ag:Cu was 7. Brazing material layers with film thicknesses of 20, 30, 40 and 60 μm were formed. The joint surface of the metal member is brought into contact with this joint surface, and an inductor (frequency: 200 kHz) is applied from the outer periphery of the joint to approximately 5
It was heated for seconds to melt and diffuse the brazing material to join both members together. On the other hand, as a comparative example, an Ag-Cu alloy brazing material whose heavy absorption ratio was adjusted to about 7=3 was coated with the same electroless plating layer as above in the form of one layer with the same film thickness as above. They were laminated and bonded under the same conditions as above. The joining member of the present invention and the joining member of the comparative example were subjected to an Amsura tensile compression tester to measure the joining strength. As a result, the bonding strength of the bonding member of the present invention was 120 MPa on average, whereas the bonding strength of the bonding member of the comparative example was only 80 MPa on average.
以1−の1r実から、本発明の方法に従い、2種類以上
の+fitなる材料を交11:に積層させることにより
形成されたロー材層を無電解メッキ層と併用すると極め
て優れた接合強度が得られることが理解される。From the facts in 1-1 below, extremely excellent bonding strength can be obtained when a brazing material layer formed by laminating two or more types of +fit materials in an intersecting manner according to the method of the present invention is used in combination with an electroless plating layer. It is understood that what is gained.
第4図に示される接合方法は合金鋼とセラミックスとの
接合に使用されるものである。合金鋼14の内径面16
にAg−Cu (7: 3)ロー材層18を無電解メッ
キ法により膜厚20±1μmの厚さで積層させた。−ツ
バセラミックスボス1の外径面20にはNi90%PI
O%からなる無電解メッキ層22を形成させた。合金鋼
14の内径面16を次に述べるF加熱によりセラミック
スボス1の外径面20に嵌合させ、合金鋼14の接合部
外周に沿って?、周波誘導加熱装置の誘導7’12を配
置した。合金鋼14を高周波誘導加熱(子加熱)により
適当に熱膨張させ、セラミックスボス1を図示されてい
るように嵌入して両部材を一体化させ、誘導T12によ
り数秒間〜数分間誘導加熱することによりロー材を溶融
拡散させ、強固な接合力を得ると同時に、冷却(例えば
、空冷、油または水による焼入れ冷却)により合金鋼を
収縮させることにより合金鋼とセラミックスとの嵌合力
が相乗され、更に一層高い接合力(実験例では接合強さ
180MPa)が得られる。また、合金鋼の収縮により
セラミックス接合面に適切な圧縮応力が付与され、セラ
ミックスの疲労強度を高めることもできる。The joining method shown in FIG. 4 is used for joining alloy steel and ceramics. Inner diameter surface 16 of alloy steel 14
A brazing material layer 18 made of Ag-Cu (7:3) was laminated thereon to a thickness of 20±1 μm by electroless plating. - The outer diameter surface 20 of the collar ceramic boss 1 is made of Ni90% PI.
An electroless plating layer 22 consisting of 0% was formed. The inner diameter surface 16 of the alloy steel 14 is fitted to the outer diameter surface 20 of the ceramic boss 1 by F heating described below, and the inner diameter surface 16 of the alloy steel 14 is fitted along the outer circumference of the joint part of the alloy steel 14. , the induction 7'12 of the frequency induction heating device was placed. The alloy steel 14 is suitably thermally expanded by high-frequency induction heating (child heating), the ceramic boss 1 is inserted as shown in the figure to integrate both members, and induction heating is performed for several seconds to several minutes using induction T12. By melting and diffusing the brazing material to obtain a strong bonding force, and at the same time shrinking the alloy steel by cooling (for example, air cooling, quenching cooling with oil or water), the fitting force between the alloy steel and ceramics is synergized, Furthermore, even higher bonding strength (bonding strength of 180 MPa in the experimental example) can be obtained. In addition, the shrinkage of the alloy steel imparts appropriate compressive stress to the ceramic joint surface, making it possible to increase the fatigue strength of the ceramic.
これにより、250〜1200℃程度の比較的低温で短
時間(−膜内に数秒間〜数十秒間)局部加熱するだけで
接合されるため、組織的機能や品質の低ドおよび変形−
千み等を極小に抑制することができる。As a result, bonding can be achieved by simply heating locally for a short time (several seconds to tens of seconds within the film) at a relatively low temperature of about 250 to 1200 degrees Celsius, resulting in poor structural function and quality, and deformation.
It is possible to suppress noise, etc. to a minimum.
なお、第4図に示されるような接合方法では、接合後の
冷却により適切な締付力が得られるよう、合金鋼の内径
およびセラミックスボスの外径を定めることが好ましい
。In addition, in the joining method as shown in FIG. 4, it is preferable to determine the inner diameter of the alloy steel and the outer diameter of the ceramic boss so that an appropriate tightening force can be obtained by cooling after joining.
Ijf 記の場合のセラミックス部材はS iN4 +
SiC,AJ!203.2r02.PSZ等の常用のセ
ラミックス材料から構成されている。また、合金鋼は耐
熱鋼、高張力鋼、構造用鋼などである。The ceramic member in the case of Ijf is S iN4 +
SiC, AJ! 203.2r02. It is constructed from commonly used ceramic materials such as PSZ. Furthermore, alloy steels include heat-resistant steel, high-strength steel, and structural steel.
これら以外の合金類も当然、本発明の方法によりセラミ
ックス部材と接合させることができる。Naturally, alloys other than these can also be joined to the ceramic member by the method of the present invention.
第5図(a)および(b)はナイフや包丁などの刃物類
への適用例を示すものである。FIGS. 5(a) and 5(b) show examples of application to cutlery such as knives and kitchen knives.
第5図(a)および(b)において、22aおよび22
bには、剛性に富み、疲労強度の1t6い合金鋼、ステ
ンレス、チタンまたはチタン合金などの金属系部材を使
用することが好ましい。また、24aおよび24bには
Zr01PSZ1A、11203、サイアスロンなどの
高硬度で耐摩耗性の高いセラミックス部材を使用するこ
とが好ましい。In FIGS. 5(a) and (b), 22a and 22
For b, it is preferable to use a metal member such as alloy steel, stainless steel, titanium, or titanium alloy, which is rich in rigidity and has a high fatigue strength. Further, it is preferable to use ceramic members with high hardness and high wear resistance such as Zr01PSZ1A, 11203, and Siathrone for 24a and 24b.
第5図(a)では、セラミックス部材24 aの接合面
側にNi90%とPIO%からなる膜厚5μmの無電解
メッキ第1層と、AgとCuとを交lE、に電気メッキ
法により積層させ、7:3の、膜厚20μmのロー材第
2層を連続的に形成させた。In FIG. 5(a), a first layer of electroless plating with a thickness of 5 μm consisting of 90% Ni and % PIO is laminated on the bonding surface side of the ceramic member 24a by electroplating. Then, a second brazing material layer having a ratio of 7:3 and a thickness of 20 μm was continuously formed.
一方、第5図(b)では、セラミックス部材24bの接
合面側に前記と同じ構成の無電解メッキ層を形成させ、
金属系部材22bの接合面側に前記と同じ構成のロー材
層を電気メッキ法により形成させた。On the other hand, in FIG. 5(b), an electroless plating layer having the same structure as described above is formed on the joint surface side of the ceramic member 24b,
A brazing material layer having the same structure as described above was formed on the joint surface side of the metal member 22b by electroplating.
第5図(a)および(b)に示されるように両部材を嵌
合させる際、接合面に微小な隙間が存在するように各M
く材の外径または内径を調整することが好ましい。As shown in FIGS. 5(a) and 5(b), when fitting both members, each M
It is preferable to adjust the outer diameter or inner diameter of the material.
高周波誘導子12を接合j1≦外周に沿って配置し、加
熱する。誘導子は各接合面が均等に加熱汗温されるよう
に配列し、適当な昇温温度−昇温速度が得られるように
、印加電圧と電流を制御する。各接合面がほぼ溶融温度
に達したとき、金属系部材22aおよび22bとセラミ
ックス部材24aおよび24bとの接合面に適切な面圧
が負荷される荷重PlまたはP2をかけて両部材を口E
?’Fさせながら史に誘導加熱を行い、両部材を接合さ
せる。The high frequency inductor 12 is placed along the junction j1≦outer circumference and heated. The inductors are arranged so that each joint surface is evenly heated and heated, and the applied voltage and current are controlled so that an appropriate heating temperature and heating rate are obtained. When each bonding surface reaches approximately the melting temperature, a load Pl or P2 that applies an appropriate surface pressure to the bonding surfaces of the metal members 22a and 22b and the ceramic members 24a and 24b is applied to bring both members together.
? While heating, induction heating is performed to join both parts.
ロー材の溶融および拡散後、冷却すると最も高い接合力
が得られる。特に、第5図(a)では接合後の冷却によ
り金属系部材の収縮によりセラミックス部材に締圧力が
負荷されるので−・層効宋的な接合が達成される。The highest bonding strength can be obtained by cooling the brazing material after melting and spreading. In particular, in FIG. 5(a), a clamping force is applied to the ceramic member due to contraction of the metal member due to cooling after joining, so that a layer-like joining is achieved.
この方法では、比較的低/1.1(500〜800°C
)で数秒間〜数十秒間の局部加熱により両部材を接合さ
せることができるため、セラミックス部材または金属系
部材の歪みが小さく、切削性等の機能や強度の低下を防
11−シ、後加■二の追加等による]二程数の増加を抑
制することができる。This method uses relatively low/1.1 (500-800°C
), it is possible to join both parts by local heating for several seconds to several tens of seconds, so the distortion of the ceramic or metal parts is small, preventing deterioration of functions such as machinability and strength, and post-addition. ■It is possible to suppress the increase in the number of conjuncts (due to the addition of 2, etc.).
第6図(a)および(b)は接合面が比較的長い場合の
接合方法を示すものである。FIGS. 6(a) and 6(b) show a joining method when the joining surfaces are relatively long.
第6図(a)はセラミックス部材30と金属系部材32
を固定状態に維持して、誘導子12を接合面に沿って移
動させる方式であり、第6図(b)は誘導子を固定状態
に維持して接合部材を移動させる方式である。この何れ
の方式においても、誘導Y−12の出力を適当に調整し
、金属系部材32を加熱し、これが膨張した後、セラミ
ックス部材30を金属系部材の穿設穴の最奥部にまで挿
入してから両部材を接合させると、前記の第4図に示し
た事例と同様な極めて高い接合強度が得られる。FIG. 6(a) shows a ceramic member 30 and a metal member 32.
In this method, the inductor 12 is moved along the bonding surface while the inductor is maintained in a fixed state. FIG. 6(b) is a method in which the inductor is maintained in a fixed state and the bonding member is moved. In either method, the output of the induction Y-12 is adjusted appropriately, the metal member 32 is heated, and after it expands, the ceramic member 30 is inserted to the deepest part of the hole drilled in the metal member. If both members are then joined together, an extremely high joint strength similar to the case shown in FIG. 4 described above can be obtained.
接合にあたっては、誘導子出ノへ周波数および移動速度
を適切に選定し、接合面の各部位を所定の温度に5¥温
し、ロー材の溶融拡散に必要な時間保持し、ロー材の酸
化等による劣化を防ぐことが好ましい。For joining, the frequency and moving speed of the inductor are appropriately selected, each part of the joint surface is heated to a specified temperature for 5 yen, and the temperature is maintained for the time necessary for melting and diffusion of the brazing material, and the brazing material is oxidized. It is preferable to prevent deterioration caused by the like.
[発明の効果コ
以上説明したように、本発明の方法によれば、無電解メ
ッキ層と共に、少なくとも2種類の兇なる材料の層が交
げに積層されてなるロー材層を介在させることによりセ
ラミックス部材と金属系部材またはセラミックス部材同
士を接合させる。[Effects of the Invention] As explained above, according to the method of the present invention, ceramics can be made by interposing a brazing material layer formed by alternately laminating layers of at least two different materials together with an electroless plating layer. Joining a member and a metal member or a ceramic member.
中層のロー材に比べて、2秤類以七の異なる材料を交互
に積層させることにより形成されたロー材層を無電解メ
ッキ層と併用すると接合強度が著しく高められる。Compared to the middle layer brazing material, when a brazing material layer formed by alternately laminating two or more different materials is used in combination with an electroless plating layer, the bonding strength is significantly increased.
また、接合温度を比較的低温にすることにより接合部材
の歪を抑制することができる。Further, by setting the bonding temperature to a relatively low temperature, distortion of the bonded member can be suppressed.
第1図はセラミックス部材をエツチング処理してから無
電解メッキ層を形成させた状態の断面図であり、第2図
は無電解メッキ層の一1ユにロー材層を積層させた状態
の断面図であり、第3図、第4図、第5図(a)、第5
図(b)、第6図(a)および第6図(b)はセラミッ
クス部材と金属系部材またはセラミックス部材との接合
方法を示す模式図である。
■・・・セラミックス部材、2・・・微細孔、3・・・
析出金属、4・・・jjg電解メッキ層、5・・・Ag
層。
6・・・C,u層、7・・・ロー材層、10・・・相手
方接合部材、12・・・誘導丁122a、22bおよび
32・・・金属系囚<材、24 at 24 bおよ
び30 b ・・・セラミックス部材Figure 1 is a cross-sectional view of a ceramic member with an electroless plated layer formed after etching, and Figure 2 is a cross-sectional view of a brazing material layer laminated on top of the electroless plated layer. 3, 4, 5(a), and 5.
FIG. 6(b), FIG. 6(a), and FIG. 6(b) are schematic diagrams showing a method of joining a ceramic member and a metal-based member or a ceramic member. ■... Ceramic member, 2... Fine pore, 3...
Deposited metal, 4...jjg electrolytic plating layer, 5...Ag
layer. 6... C, u layer, 7... Brazing material layer, 10... Other joining member, 12... Guiding blades 122a, 22b and 32... Metallic material, 24 at 24 b and 30 b...Ceramics member
Claims (3)
クス部材同士を接合する方法において、少なくとも何れ
か一方の部材の接合面に、導電性金属または合金の少な
くとも何れか一方の無電解メッキ層と、少なくとも2種
類の異なる材料の層が交互に積層されてなるロー材層と
を連続的に設けるか、もしくは、一方の部材の接合面に
前記無電解メッキ層を設け、他方の部材の接合面に前記
ロー材層を設け、接合面およびその近傍を高周波誘導加
熱により加熱し、前記ロー材層を溶融拡散させることに
より両部材を接合させることを特徴とするセラミックス
の接合方法。(1) In a method for joining a ceramic member and a metallic member or ceramic members to each other, at least one of the members is provided with an electroless plating layer of at least one of conductive metals or alloys on the joining surface, and at least two types of electroless plating layers. Alternatively, the electroless plating layer may be provided on the bonding surface of one member and the brazing material layer may be provided on the bonding surface of the other member. A method for joining ceramics, comprising: providing a layer, heating the joint surface and its vicinity by high-frequency induction heating, and melting and diffusing the brazing material layer to join both members.
または金属系部材の接合面となる部分の素地表面の少な
くとも一方の表面をエッチング処理してから無電解メッ
キ層またはロー材層を設けることを特徴とする請求項1
記載のセラミックスの接合方法。(2) The electroless plating layer or brazing material layer should be provided after etching at least one surface of the base surface of the part that will be the joint surface of the ceramic member or the base surface of the part that will be the joint surface of the metal-based member. Claim 1
The described method for joining ceramics.
クス部材同士が互いに嵌合しあう構造に予め作製されて
いることを特徴とする、請求項1記載のセラミックスの
接合方法。(3) The method for joining ceramics according to claim 1, characterized in that the ceramic member and the metal member or the ceramic members are prepared in advance in a structure in which they fit into each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25951988A JPH02107579A (en) | 1988-10-17 | 1988-10-17 | Joining method for ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25951988A JPH02107579A (en) | 1988-10-17 | 1988-10-17 | Joining method for ceramic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02107579A true JPH02107579A (en) | 1990-04-19 |
| JPH055789B2 JPH055789B2 (en) | 1993-01-25 |
Family
ID=17335225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25951988A Granted JPH02107579A (en) | 1988-10-17 | 1988-10-17 | Joining method for ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02107579A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996020333A1 (en) * | 1994-12-28 | 1996-07-04 | Sumitomo Electric Industries, Ltd. | Sliding part and method of manufacturing the same |
| JP2010103168A (en) * | 2008-10-21 | 2010-05-06 | Mitsubishi Materials Corp | Method for producing ceramic substrate, and method for producing substrate for power-module |
| US9079264B2 (en) | 2007-11-06 | 2015-07-14 | Mitsubishi Materials Corporation | Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate |
| KR20200074866A (en) * | 2018-12-14 | 2020-06-25 | 코마도 쏘시에떼 아노님 | Method for brazing titanium alloy components with zirconia-based ceramic components for horology or jewellery |
-
1988
- 1988-10-17 JP JP25951988A patent/JPH02107579A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996020333A1 (en) * | 1994-12-28 | 1996-07-04 | Sumitomo Electric Industries, Ltd. | Sliding part and method of manufacturing the same |
| US9079264B2 (en) | 2007-11-06 | 2015-07-14 | Mitsubishi Materials Corporation | Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate |
| JP2010103168A (en) * | 2008-10-21 | 2010-05-06 | Mitsubishi Materials Corp | Method for producing ceramic substrate, and method for producing substrate for power-module |
| KR20200074866A (en) * | 2018-12-14 | 2020-06-25 | 코마도 쏘시에떼 아노님 | Method for brazing titanium alloy components with zirconia-based ceramic components for horology or jewellery |
| US11498879B2 (en) | 2018-12-14 | 2022-11-15 | Comadur Sa | Method for brazing titanium alloy components with zirconia-based ceramic components for horology or jewellery |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH055789B2 (en) | 1993-01-25 |
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