JPH02108567U - - Google Patents
Info
- Publication number
- JPH02108567U JPH02108567U JP1491589U JP1491589U JPH02108567U JP H02108567 U JPH02108567 U JP H02108567U JP 1491589 U JP1491589 U JP 1491589U JP 1491589 U JP1491589 U JP 1491589U JP H02108567 U JPH02108567 U JP H02108567U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- coil spring
- shaft
- poles
- inverted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は従来のはんだ付け装置の断面図である。
１……こて先、２……コイルスプリング、３…
…シヤフト、４……はんだ、５……チツプ部品、
６……プリント板、１０……こて先。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional soldering device. 1... Soldering tip, 2... Coil spring, 3...
...Shaft, 4...Solder, 5...Chip parts,
6...Printed board, 10...Soldering iron tip.
Claims (1)
形状をしたこて先と、該こて先の中央に位置する
穴内に保持されたコイルスプリング等の弾性体と
、該弾性体と連動し穴内を摺動するシヤフトから
構成されるチツプ部品用はんだごて。 The tip is shaped like an inverted U shape so that both poles of the tip can be heated simultaneously, and an elastic body such as a coil spring is held in a hole located in the center of the tip. A soldering iron for chip parts that consists of a shaft that slides on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1491589U JPH02108567U (en) | 1989-02-09 | 1989-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1491589U JPH02108567U (en) | 1989-02-09 | 1989-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02108567U true JPH02108567U (en) | 1990-08-29 |
Family
ID=31226517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1491589U Pending JPH02108567U (en) | 1989-02-09 | 1989-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02108567U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08181426A (en) * | 1994-12-27 | 1996-07-12 | Nec Corp | Reflow soldering device and reflow soldering method |
-
1989
- 1989-02-09 JP JP1491589U patent/JPH02108567U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08181426A (en) * | 1994-12-27 | 1996-07-12 | Nec Corp | Reflow soldering device and reflow soldering method |