JPH0211342U - - Google Patents
Info
- Publication number
- JPH0211342U JPH0211342U JP8917288U JP8917288U JPH0211342U JP H0211342 U JPH0211342 U JP H0211342U JP 8917288 U JP8917288 U JP 8917288U JP 8917288 U JP8917288 U JP 8917288U JP H0211342 U JPH0211342 U JP H0211342U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- semiconductor device
- power semiconductor
- substrate
- exterior case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003292 glue Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂは本考案の一実施例である樹脂封
止型電力半導体装置の断面図及び平面図、第２図
は同実施例である接着剤層部分Ｂの拡大図、第３
図ａ，ｂは従来の実施例である樹脂封止型電力半
導体装置の断面図及び平面図、第４図は同実施例
である接着剤層部分Ａの拡大図である。
２１……メタルベース基板、２２……半導体素
子、２３……電子部品、２４……外装ケース、２
５……封止樹脂、２６……外部入出力端子、２７
……接着剤。
1A and 1B are a cross-sectional view and a plan view of a resin-sealed power semiconductor device which is an embodiment of the present invention, FIG. 2 is an enlarged view of the adhesive layer portion B of the same embodiment, and FIG.
Figures a and b are a cross-sectional view and a plan view of a resin-sealed power semiconductor device according to a conventional embodiment, and FIG. 4 is an enlarged view of an adhesive layer portion A according to the same embodiment. 21...Metal base board, 22...Semiconductor element, 23...Electronic component, 24...Exterior case, 2
5... Sealing resin, 26... External input/output terminal, 27
……glue.
Claims (1)
ースを接着剤により接合する樹脂封止型電力の半
導体装置において、前記メタルベース基板の回路
部品搭載側の端部を凹ませ、前記外装ケースと前
記メタルベース基板端部との間〓に前記接合のた
めの接着剤層を形成したことを特徴とする電力半
導体装置。 In a resin-sealed power semiconductor device in which a metal base board on which a circuit component is mounted and an exterior case are bonded together with an adhesive, the end of the metal base board on the side where the circuit component is mounted is recessed, and the exterior case and the metal base are bonded together. A power semiconductor device characterized in that an adhesive layer for the bonding is formed between the substrate and the end portion of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8917288U JPH0211342U (en) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8917288U JPH0211342U (en) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211342U true JPH0211342U (en) | 1990-01-24 |
Family
ID=31313722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8917288U Pending JPH0211342U (en) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211342U (en) |
-
1988
- 1988-07-05 JP JP8917288U patent/JPH0211342U/ja active Pending
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