JPH0211343U - - Google Patents
Info
- Publication number
- JPH0211343U JPH0211343U JP9033288U JP9033288U JPH0211343U JP H0211343 U JPH0211343 U JP H0211343U JP 9033288 U JP9033288 U JP 9033288U JP 9033288 U JP9033288 U JP 9033288U JP H0211343 U JPH0211343 U JP H0211343U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- support plate
- circuit board
- printed circuit
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 3
Description
図面はこの考案の一実施例を示し、第１図は発
熱素子の取付け構造を示す要部斜視図、第２図は
支持板の切起し部を示す斜視図、第３図は発熱素
子の仮取付け例を示す平面図、第４図は発熱素子
の仮取付け例を示す側面図、第５図〜第９図は従
来の発熱素子の取付け構造を示す要部斜視図、第
１０図および第１１図は従来の発熱素子の取付け
例を示す側面図である。
１１……発熱素子、１２……端子、１３……プ
リント基板、１４……本体、１５……支持板、１
６……切起し部、１７……取付け平面、１８……
ビス。
The drawings show one embodiment of this invention, with Fig. 1 being a perspective view of the main parts showing the mounting structure of the heating element, Fig. 2 being a perspective view showing the cut-out part of the support plate, and Fig. 3 showing the structure of the heating element. FIG. 4 is a plan view showing an example of temporary installation, FIG. 4 is a side view showing an example of temporary installation of the heating element, FIGS. FIG. 11 is a side view showing an example of mounting a conventional heating element. 11...Heating element, 12...Terminal, 13...Printed circuit board, 14...Main body, 15...Support plate, 1
6... cut and raised portion, 17... mounting plane, 18...
Screw.
Claims (1)
、発熱素子の本体を、プリント基板を固定支持す
る支持板に熱吸収除去可能に密接させて固定する
発熱素子の取付け構造であつて、 前記支持板の一部を、両側に繋がらせた状態で
プリント基板固定側に向けて切起し、この切起し
部に該支持板と平行する取付け平面を形成し、 この取付け平面上に前記発熱素子の本体を密接
させて固定する 発熱素子の取付け構造。[Scope of Claim for Utility Model Registration] Installation of a heating element in which the terminals of the heating element are wired and connected to a printed circuit board, and the main body of the heating element is closely fixed to a support plate that fixes and supports the printed circuit board so that heat can be absorbed and removed. The structure is such that a part of the support plate is cut and raised toward the printed circuit board fixing side while being connected to both sides, and a mounting plane parallel to the support plate is formed in this cut and raised part. A heating element mounting structure in which a main body of the heating element is closely fixed on a mounting plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9033288U JPH0211343U (en) | 1988-07-06 | 1988-07-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9033288U JPH0211343U (en) | 1988-07-06 | 1988-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211343U true JPH0211343U (en) | 1990-01-24 |
Family
ID=31314857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9033288U Pending JPH0211343U (en) | 1988-07-06 | 1988-07-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211343U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435576U (en) * | 1990-07-20 | 1992-03-25 |
-
1988
- 1988-07-06 JP JP9033288U patent/JPH0211343U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435576U (en) * | 1990-07-20 | 1992-03-25 |