JPH0211349U - - Google Patents
Info
- Publication number
- JPH0211349U JPH0211349U JP8969488U JP8969488U JPH0211349U JP H0211349 U JPH0211349 U JP H0211349U JP 8969488 U JP8969488 U JP 8969488U JP 8969488 U JP8969488 U JP 8969488U JP H0211349 U JPH0211349 U JP H0211349U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pellet
- island portion
- thin film
- aluminum metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の一実施例のリードフレーム
の正面図で、第２図は、従来のリードフレームの
正面図である。
１……アルミニウム金属薄膜、２……ペレツト
搭載（アイランド）部、３……銀めつきを施した
エリア。
FIG. 1 is a front view of a lead frame according to an embodiment of the present invention, and FIG. 2 is a front view of a conventional lead frame. 1... Aluminum metal thin film, 2... Pellet loading (island) part, 3... Silver plating area.
Claims (1)
トの電極を外部へ取り出すための複数のリードを
有する半導体装置用リードフレームにおいて、前
記アイランド部の一主面の外周部にアルミニウム
金属の薄膜層を設けたことを特徴とする半導体装
置用リードフレーム。 A lead frame for a semiconductor device having an island portion on which a pellet is mounted and a plurality of leads for taking out electrodes of the pellet to the outside, characterized in that a thin film layer of aluminum metal is provided on the outer periphery of one main surface of the island portion. Lead frame for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8969488U JPH0211349U (en) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8969488U JPH0211349U (en) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211349U true JPH0211349U (en) | 1990-01-24 |
Family
ID=31314239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8969488U Pending JPH0211349U (en) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211349U (en) |
-
1988
- 1988-07-05 JP JP8969488U patent/JPH0211349U/ja active Pending
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