JPH0211384U - - Google Patents
Info
- Publication number
- JPH0211384U JPH0211384U JP9009988U JP9009988U JPH0211384U JP H0211384 U JPH0211384 U JP H0211384U JP 9009988 U JP9009988 U JP 9009988U JP 9009988 U JP9009988 U JP 9009988U JP H0211384 U JPH0211384 U JP H0211384U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- view
- side sectional
- fixed
- metal case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図ａ，ｂは本考案による第１の実施例の要
部側断面図および平面図、第２図ａ，ｂは本考案
による第２の実施例の要部側断面図および平面図
、第３図ａ，ｂは本考案による第３の実施例の要
部側断面図および平面図、第４図ａ，ｂは第１図
および第２図の弾性変形した状態を示す側断面図
、第５図は従来技術の斜視図、第６図は第５図の
側断面図、第７図は第６図の半田接合部の要部側
断面図、第８図は第７図の半田のクラツク状態を
示す要部側断面図、第９図は第７図のパツドの剥
離状態を示す要部側断面図である。
図において、１は金属ケース、１ａは内壁面、
２，２−１，２−２は回路基板、２ａは周縁部、
２ｂはパツド、２ｃはスルーホール、３，３−１
，３−２は固定用金具、３ａ，３ｂは折曲片、３
ａ−１は突起を示す。
1A and 1B are a side sectional view and a plan view of the main part of the first embodiment according to the present invention, FIGS. 2A and 2B are a side sectional view and a plan view of the main part of the second embodiment according to the present invention, 3a and 3b are side sectional views and plan views of main parts of the third embodiment of the present invention, and FIGS. 4a and 4b are side sectional views showing the elastically deformed state of FIGS. 1 and 2, 5 is a perspective view of the prior art, FIG. 6 is a side sectional view of FIG. 5, FIG. 7 is a side sectional view of the main part of the solder joint in FIG. FIG. 9 is a side sectional view of the main part showing a cracked state, and FIG. 9 is a side sectional view of the main part showing a peeled state of the pad in FIG. In the figure, 1 is a metal case, 1a is an inner wall surface,
2, 2-1, 2-2 are circuit boards, 2a is a peripheral part,
2b is padded, 2c is through hole, 3, 3-1
, 3-2 is a fixing fitting, 3a, 3b is a bent piece, 3
a-1 indicates a protrusion.
Claims (1)
間に支持固定する構造であつて、 前記回路基板２の周縁部２ａと、前記金属ケー
ス１の内壁面１ａとの間に弾性を有する固定用金
具３を介在し半田付け固定することを特徴とする
回路基板の固定構造。[Claims for Utility Model Registration] A structure in which a circuit board 2 is fitted into a metal case 1 and supported and fixed in the internal space, and between a peripheral edge 2a of the circuit board 2 and an inner wall surface 1a of the metal case 1. A circuit board fixing structure characterized in that a fixing metal fitting 3 having elasticity is interposed between the circuit board and the circuit board is fixed by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9009988U JPH0211384U (en) | 1988-07-06 | 1988-07-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9009988U JPH0211384U (en) | 1988-07-06 | 1988-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211384U true JPH0211384U (en) | 1990-01-24 |
Family
ID=31314632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9009988U Pending JPH0211384U (en) | 1988-07-06 | 1988-07-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211384U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181905U (en) * | 1981-05-12 | 1982-11-18 |
-
1988
- 1988-07-06 JP JP9009988U patent/JPH0211384U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181905U (en) * | 1981-05-12 | 1982-11-18 |