JPH02116790U - - Google Patents
Info
- Publication number
- JPH02116790U JPH02116790U JP2505989U JP2505989U JPH02116790U JP H02116790 U JPH02116790 U JP H02116790U JP 2505989 U JP2505989 U JP 2505989U JP 2505989 U JP2505989 U JP 2505989U JP H02116790 U JPH02116790 U JP H02116790U
- Authority
- JP
- Japan
- Prior art keywords
- metal frame
- circuit board
- sub
- notch
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 12
- 238000007598 dipping method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図はこの考案の実施例である電子部品の組
立構造を表す斜視図である。第２図および第３図
は同電子部品の主要部の組立構造を表す斜視図お
よび正面断面図である。第４図は従来技術および
本願考案が適用される主金属フレームの外観形状
を表す斜視図である。第５図Ａ，Ｂはその主金属
フレームの構成部品を示す斜視図である。第６図
は半田浸漬の様子を示す概略図である。第７図Ａ
〜Ｃは第４図に示した特定箇所におけるシールド
プレートの組み合わせ構造を示す部分斜視図であ
る。第８図と第９図は従来の電子部品における副
金属フレームの組立構造を表す図である。
１……副金属フレーム、２……突出部、３……
脚部、４，４ａ，４ｂ……主金属フレーム、５…
…回路基板、６……アースランド、１４ａ，１４
ｂ……シールドプレート。
FIG. 1 is a perspective view showing an assembly structure of electronic components according to an embodiment of this invention. 2 and 3 are a perspective view and a front sectional view showing the assembled structure of the main parts of the electronic component. FIG. 4 is a perspective view showing the external shape of the main metal frame to which the prior art and the present invention are applied. 5A and 5B are perspective views showing the components of the main metal frame. FIG. 6 is a schematic diagram showing the state of solder dipping. Figure 7A
-C are partial perspective views showing a combination structure of shield plates at specific locations shown in FIG. 4. FIGS. 8 and 9 are diagrams showing the assembly structure of a sub-metal frame in a conventional electronic component. 1...Sub-metal frame, 2...Protrusion, 3...
Legs, 4, 4a, 4b...Main metal frame, 5...
...Circuit board, 6...Earth land, 14a, 14
b...Shield plate.
Claims (1)
路基板の裏面から副金属フレームを取り付け、半
田浸漬法により主金属フレーム、回路基板および
副金属フレーム相互を半田付けした電子部品にお
いて、 主金属フレームの切込部または突当部の隙間に
対向して前記回路基板に切欠部を形成し、副金属
フレームの取付時に前記回路基板の切欠部に挿入
される舌片形状の突出部を前記副金属フレームの
一部に設けたことを特徴とする電子部品。[Claims for Utility Model Registration] An electronic component in which a circuit board is attached to a main metal frame, a sub metal frame is attached from the back side of the circuit board, and the main metal frame, circuit board, and sub metal frame are soldered to each other using the solder dipping method. A notch is formed in the circuit board opposite to the gap between the notch or abutment of the main metal frame, and a tongue-shaped protrusion is inserted into the notch of the circuit board when the secondary metal frame is attached. An electronic component, characterized in that a part is provided in a part of the sub-metal frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2505989U JPH02116790U (en) | 1989-03-03 | 1989-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2505989U JPH02116790U (en) | 1989-03-03 | 1989-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116790U true JPH02116790U (en) | 1990-09-19 |
Family
ID=31245454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2505989U Pending JPH02116790U (en) | 1989-03-03 | 1989-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116790U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017195307A (en) * | 2016-04-21 | 2017-10-26 | 株式会社東海理化電機製作所 | Substrate unit |
-
1989
- 1989-03-03 JP JP2505989U patent/JPH02116790U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017195307A (en) * | 2016-04-21 | 2017-10-26 | 株式会社東海理化電機製作所 | Substrate unit |
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