JPH02118366U - - Google Patents
Info
- Publication number
- JPH02118366U JPH02118366U JP1989027727U JP2772789U JPH02118366U JP H02118366 U JPH02118366 U JP H02118366U JP 1989027727 U JP1989027727 U JP 1989027727U JP 2772789 U JP2772789 U JP 2772789U JP H02118366 U JPH02118366 U JP H02118366U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- image sensor
- solid
- state image
- drive circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は本考案による固体撮像素子の取付構造
の一実施例を示す側面断面図、第２図は従来の固
体撮像素子の取付構造の外部側面図、第３図は第
２図におけるホルダーおよびレンズ鏡筒の内部を
示す側面断面図、第４図は一般の固体撮像素子に
おける温度と暗電流との関係を示すグラフである
。
２１……基板、２２……駆動回路、２４……ホ
ルダー、２５，２６……ネジ、２７……レンズ、
２８……レンズ鏡筒、３２……ローパスフイルタ
、３３……固体撮像素子、３５……クツシヨン、
３６……フレキシブリ・プリント・サーキツト。
FIG. 1 is a side sectional view showing an embodiment of the mounting structure for a solid-state image sensor according to the present invention, FIG. 2 is an external side view of a conventional mounting structure for a solid-state image sensor, and FIG. 3 is a holder and a FIG. 4, a side sectional view showing the inside of the lens barrel, is a graph showing the relationship between temperature and dark current in a general solid-state image sensor. 21... Board, 22... Drive circuit, 24... Holder, 25, 26... Screw, 27... Lens,
28...Lens barrel, 32...Low pass filter, 33...Solid image sensor, 35...Cushion,
36...Flexible print circuit.
Claims (1)
この駆動回路に前記基板を介して電気的に接続し
て設けられた固体撮像素子とを備え、前記基板を
加熱性材料により形成したことを特徴とする固体
撮像素子の取付構造。 a substrate, a drive circuit provided on the substrate,
A mounting structure for a solid-state image sensor, comprising a solid-state image sensor electrically connected to the drive circuit via the substrate, and the substrate is made of a heatable material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989027727U JPH02118366U (en) | 1989-03-10 | 1989-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989027727U JPH02118366U (en) | 1989-03-10 | 1989-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118366U true JPH02118366U (en) | 1990-09-21 |
Family
ID=31250471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989027727U Pending JPH02118366U (en) | 1989-03-10 | 1989-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118366U (en) |
-
1989
- 1989-03-10 JP JP1989027727U patent/JPH02118366U/ja active Pending
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