JPH0212070A - Manufacture of inspection device - Google Patents

Manufacture of inspection device

Info

Publication number
JPH0212070A
JPH0212070A JP16351288A JP16351288A JPH0212070A JP H0212070 A JPH0212070 A JP H0212070A JP 16351288 A JP16351288 A JP 16351288A JP 16351288 A JP16351288 A JP 16351288A JP H0212070 A JPH0212070 A JP H0212070A
Authority
JP
Japan
Prior art keywords
lead
circuit board
stylus
inspected
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16351288A
Other languages
Japanese (ja)
Inventor
Kenichiro Kamei
謙一郎 亀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16351288A priority Critical patent/JPH0212070A/en
Publication of JPH0212070A publication Critical patent/JPH0212070A/en
Pending legal-status Critical Current

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  • Measuring Leads Or Probes (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Liquid Crystal (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To surely inspect an object even when the object has a fine pitch by constituting the manufacturing process of a process for working a metallic sheet to a comb-line electrode group, process for electrically connecting each electrode, process for forming a measuring probe section, and process for forming a measuring section by combining one or more probe sections. CONSTITUTION:Firstly, each metallic lead beam 9 (91-9n) of a metallic sheet (lead plate) 7 is plated with solder by about a half. A heat resistive tape, etc., is stuck and fixed to the lead beams 9 on the plated wide and one side of the sheet 7 is cut off. The processed lead plate 7 is fixed to the surface of a circuit board 2. A lead wiring pattern of the same pitch and same number as those of the lead beams 91-9n is formed on the circuit board 2. The soldering side of the lead beams 91-9n is put on and soldered to one edge of the wiring pattern and the lead beams 91-9n are fixed to the circuit board 2 by means of a holding plate 4. Then the lead beams 91-9n projecting from the circuit board 2 are cut off after the projecting part is fixed with a tape 11, etc. When a plating process is performed to the leading edge section, a probe head is manufactured.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、被検査体の電気的諸特性を検査するための検
査装置の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing an inspection device for inspecting various electrical characteristics of an object to be inspected.

(従来の技術) 従来より、被検査体例えば半導体ウェハや回路基板等の
電気的請特性を検査する際には検査装置としてプローブ
装置が用いられているが、近年の電子部品の高密度化、
高集積化による被検査体測定部の微細化にともない、こ
のプローブ装置も微細化した被検査体の測定に対応する
構造のものが開発されつつある。
(Prior Art) Probe devices have traditionally been used as inspection devices when inspecting the electrical characteristics of objects to be inspected, such as semiconductor wafers and circuit boards.
With the miniaturization of test object measurement units due to high integration, probe devices with structures that can cope with measurements of miniaturized test objects are being developed.

このような微細化された被検査体としては、例えば近年
急速に普及している高精細の液晶デイスプレィ(テレビ
)があり、この液晶デイスプレィでは、液晶デイスプレ
ィ部のガラス基板縁部に液晶駆動用の多数の電極端子が
設けられて、これら電極端子に所定の電気信号を加える
ことにより液晶表示を行うように構成されている。
An example of such a miniaturized object to be inspected is a high-definition liquid crystal display (television) that has become rapidly popular in recent years. A large number of electrode terminals are provided, and a liquid crystal display is performed by applying predetermined electrical signals to these electrode terminals.

例えば、液晶テレビでは、四角なデイスプレィ部の一辺
から約0.3amのピッチで200本以上の電極端子が
突設されており、この電極ピッチは今後さらに狭ピッチ
化が進む傾向にある。
For example, in a liquid crystal television, more than 200 electrode terminals are protruded from one side of a square display part at a pitch of about 0.3 am, and the electrode pitch is likely to become narrower in the future.

そして、上記多数の電極端子にフレキシブル回路基板を
接続、あるいは異方性コネクタを介して回路基板に接続
して製品とするが、その前工程として、液晶デイスプレ
ィ部の表示性能テストや、それに接続される回路基板を
テストする検査工程がある。この検査工程でのテストに
は、微細ピッチの電極端子に外部端子を接続する必要が
あり、従来より異方性コネクタを介して外部回路基板と
接続する方法が用いられていた。
Then, a flexible circuit board is connected to the above-mentioned large number of electrode terminals, or a circuit board is connected to the circuit board via anisotropic connectors to produce a product.As a pre-process, the display performance test of the liquid crystal display section and the connection to the flexible circuit board are performed. There is an inspection process that tests the circuit boards used. Testing in this inspection process requires connecting external terminals to fine-pitch electrode terminals, and a conventional method has been to connect them to external circuit boards via anisotropic connectors.

ところが、このような方法では、電極端子とコネクタと
の接触不良等が生じやすく、信頼性に欠けるという問題
があった。さらに、高微細ピッチでは、異方性コネクタ
の性質上、隣同志の端子の絶縁性がとれないという欠点
もあった。
However, such a method has a problem in that poor contact between the electrode terminal and the connector is likely to occur, resulting in a lack of reliability. Furthermore, with a high fine pitch, there is a drawback that insulation between adjacent terminals cannot be maintained due to the nature of the anisotropic connector.

そこで、このような微細ピッチの被検査体を検査する方
法として、プローブカードを用いた測定方法が用いられ
ている。このプローブカードを用いた検査方法では、触
針(プローブ針)と被検査体との機械的接触力が安定が
しているため、高い信頼性を得ることができる。
Therefore, a measurement method using a probe card is used as a method for inspecting objects to be inspected with such fine pitches. In the inspection method using this probe card, high reliability can be obtained because the mechanical contact force between the stylus (probe needle) and the object to be inspected is stable.

(発明が解決しようとする課題) しかしながら、上述した従来のプローブカードを用いた
検査装置では、高微細なピッチに対応するべく触針を多
数本配置形成することが技術的に困難であり、また非常
に高価なものになるという問題があった。
(Problems to be Solved by the Invention) However, with the above-mentioned inspection device using the conventional probe card, it is technically difficult to arrange and form a large number of stylus in order to correspond to a high fine pitch. The problem was that it was very expensive.

本発明は上述した問題点を解決するためになされたもの
で、微細ピッチの被検査体でも確実に検査することがで
き、しかも安価に製造可能な検査装置の製造方法を提供
することを目的とする。
The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing an inspection device that can reliably inspect even objects to be inspected with a fine pitch and can be manufactured at low cost. do.

[発明の構成] (課題を解決するための手段) 本発明の検査装置の製造方法は、被検査体上の一群の被
検査部に接触する測定用触針を備え、この1lll定用
触針により前記被検査体の電気的特性を検査する検査装
置の製造において、金属薄板を被検査部の配列ピッチと
等しいピッチを有する櫛歯状電極群に加工する工程と、
この電極群の配列ピッチと同一ピッチに形成されたリー
ド線を有する測定用基板の該リード線に前記金属薄板の
各電極を夫々電気的に接続する工程と、この測定用基板
に取付けられた櫛歯状電極群を測定用基板から所定量突
出した位置で切断して測定用触針部を形成する工程と、
測定用触針部を1つ以上組合せて測定部を形成する工程
とからなることを特徴とするものである。
[Structure of the Invention] (Means for Solving the Problems) The method for manufacturing an inspection device of the present invention includes a measuring stylus that contacts a group of inspected parts on an object to be inspected, and this 1llll measuring stylus In the manufacturing of an inspection device for inspecting the electrical characteristics of the object to be inspected, a step of processing a thin metal plate into a comb-like electrode group having a pitch equal to the arrangement pitch of the inspection object;
A step of electrically connecting each electrode of the thin metal plate to the lead wires of a measurement board having lead wires formed at the same pitch as the arrangement pitch of the electrode group, cutting the tooth-shaped electrode group at a position protruding from the measurement substrate by a predetermined amount to form a measurement stylus;
This method is characterized by comprising a step of forming a measuring section by combining one or more measuring stylus sections.

(作 用) 本発明の方法により、触針型の検査装置で一本ずつ触針
を位置合せしながら並べる作業がなくなり、安価で信頼
性の高い検査装置を製造することができる。
(Function) The method of the present invention eliminates the work of aligning and arranging the stylus probes one by one in a stylus-type inspection device, making it possible to manufacture an inexpensive and highly reliable inspection device.

(実施例) 以下、本発明の方法を液晶基板測定用プローバのプロー
ブヘッドの製造に適用した実施例について図を参照して
説明する。
(Example) Hereinafter, an example in which the method of the present invention is applied to manufacturing a probe head of a prober for measuring a liquid crystal substrate will be described with reference to the drawings.

第1図は実施例の方法により製作したプローブヘッドを
示す図で、プローブヘッド1は、一方面に多数のリード
線を形成した回路基板2と、この回路基板の各リード線
に電気的に接続されて突設したプローブ触針3と、これ
ら触針を回路基板2に固定するための押え板4とから構
成されている。
FIG. 1 is a diagram showing a probe head manufactured by the method of the embodiment, in which the probe head 1 is electrically connected to a circuit board 2 having a large number of lead wires formed on one side, and to each lead wire of this circuit board. The probe stylus 3 includes a protruding probe stylus 3 and a holding plate 4 for fixing the stylus to the circuit board 2.

測定に際しては、第2図に示すように例えば液晶基板の
電極端子群等の被検査体に対し、適当な角度θで触針3
を所定の圧力で接触させて行う。
During measurement, as shown in Figure 2, the stylus 3 is placed at an appropriate angle θ relative to the object to be inspected, such as a group of electrode terminals on a liquid crystal board.
are brought into contact with each other under a predetermined pressure.

このときの測定値は、回路基板のリード線の一端に例え
ばフラットケーブル等を介して電気的に接続されたテス
タ6等に送られる。
The measured value at this time is sent to a tester 6 or the like electrically connected to one end of the lead wire of the circuit board via, for example, a flat cable.

このような構成のプローブヘッドの製造方法について以
下に説明する。
A method of manufacturing a probe head having such a configuration will be described below.

第3図は本例のプローブヘッドの触針を製作するための
薄い金属片を示す図で、まず、この金属片7に多数のス
リット穴(81,82、・・・・・・81.8 、、、
 )を放電加工または電解加工により夫々平行に穿設す
る。この場合、エツチング加工が考えられるが、エツチ
ングは等方性であり、リードビームの断面が異形になる
。
FIG. 3 is a diagram showing a thin metal piece for manufacturing the stylus of the probe head of this example. First, a large number of slit holes (81, 82, . . . ,,,
) are drilled parallel to each other by electric discharge machining or electrolytic machining. In this case, etching may be considered, but etching is isotropic and the cross section of the lead beam becomes irregular.

各スリット穴間に残された細い各金属リードビーム(9
1,92、・・・・・・9.)のピッチPは、被検査物
の電極ピッチと同一とし、この金属リードビーム(91
,92、・・・・・91.l)がプローブヘッド完成時
には触針となる。
Each thin metal lead beam (9) left between each slit hole
1,92,...9. ) is the same as the electrode pitch of the object to be inspected, and this metal lead beam (91
,92,...91. 1) becomes the stylus when the probe head is completed.

第4図は、こうして穴あけ加工した金属薄板(以降、リ
ード板と呼ぶ)7を使ったブローバ製作工程を示す図で
ある。
FIG. 4 is a diagram showing the process of manufacturing a blower using the thin metal plate (hereinafter referred to as lead plate) 7 that has been drilled in this manner.

まず、リード板7の各金属リードビーム(91,92、
・・・・・・9n)を夫々約半分だけノ\ンダメ、ツキ
しく第4図(a)) 、次にそのメツキ側の金属リード
ビームに位置ズレ防出用の耐熱テープ等を貼着して固定
し、金属リードビームの片端を切断装置で切断する(第
4図(b))。
First, each metal lead beam (91, 92,
・・・・・・Press about half of each of 9n) as shown in Figure 4(a)), then attach heat-resistant tape or the like to prevent misalignment on the metal lead beam on the plating side. Then, one end of the metal lead beam is cut using a cutting device (FIG. 4(b)).

こうして切断加工したリード板7を回路基板2上に固定
する。この回路基板2には、第5図に示すように、上記
リードビーム(91,92、・・・・・・9、)と同ピ
ツチ、同数のリード配線パターン11が夫々平行に形成
されており、これらリード配線10にはハンダメツキが
施されている。
The lead plate 7 thus cut is fixed onto the circuit board 2. As shown in FIG. 5, on this circuit board 2, lead wiring patterns 11 of the same pitch and number as the lead beams (91, 92, . . . 9,) are formed in parallel. , these lead wires 10 are solder-plated.

このリード配線パターン10の一端10aにリードビー
ム(91,92、・・・・・・9.)のノ\ンタ付側を
所定量重ね合せて熱圧着等でノ1ンダ付し、さらに機械
的強度を増すため、押え板4によりり一ドビームを回路
基板2に押圧して固定する(第4図(C))。
The marked sides of the lead beams (91, 92, . . . 9.) are overlapped by a predetermined amount on one end 10a of this lead wiring pattern 10, and the marked sides are bonded by thermocompression bonding or the like. In order to increase the strength, the fixed beam is pressed and fixed to the circuit board 2 by the holding plate 4 (FIG. 4(C)).

次に、回路基板2から突出したリードビーム(91,9
2、・・・・・・9.)をテープ11等で固定した後(
第4図(d)) 、リードビームの突出端を切断する。
Next, lead beams (91, 9
2,...9. ) after fixing it with tape 11 etc. (
Figure 4(d)) Cut the protruding end of the lead beam.

次のその先端部に所要のメツキ処理をして(第4図(e
)) 、前述第1図に示したプローブヘッド1が完成す
る。
Next, apply the necessary plating to the tip (Fig. 4 (e)
)) The probe head 1 shown in FIG. 1 is completed.

こうして作製されたプローブヘッドによる検査では、第
2図に示したように、触針3の接触時に、各触針は加圧
により夫々曲げられるため、その弾性により接触部の凹
凸に対する各触針の追従性が良く、接触の信頼性が高い
。従って、正確な測定が可能となる。
In the inspection using the probe head manufactured in this way, as shown in FIG. 2, when the stylus 3 makes contact, each stylus is bent by pressure, so its elasticity allows each stylus to respond to the unevenness of the contact area. Good followability and high contact reliability. Therefore, accurate measurements are possible.

また、触針3と被検査体5との位置関係は上記製造方法
により十分に精度が得られている。
Further, the positional relationship between the stylus 3 and the object to be inspected 5 is sufficiently accurate by the above manufacturing method.

上述実施例では触針3となる金属リードビーム(91,
92、・・・・・・9.)の形成において、金属薄板7
に多数のスリット穴(81,8;!、・・・・・・8゜
、811+1 )を夫々平行に穿設したが、被検査体の
ピッチが大きく、リードビームを太くできるものの場合
には、加工による変形が少ないため、金属薄板を一度で
櫛歯状に加工することができ、製作工程の簡略化ができ
る。この場合、プローブヘッド製作工程は回路基板の接
続から行われる。
In the above embodiment, a metal lead beam (91,
92,...9. ), the thin metal plate 7
A large number of slit holes (81, 8; !, 8 degrees, 811 + 1) were drilled in parallel to each other, but if the pitch of the object to be inspected is large and the lead beam can be made thicker, Since there is little deformation due to processing, a thin metal plate can be processed into a comb-like shape in one step, simplifying the manufacturing process. In this case, the probe head manufacturing process starts from connecting the circuit board.

また、リードビームと回路基板との接続はハンダ付に限
定されず、リードビームは配線パターンとの接続ができ
、機械的強度を確保できればいずれの方法でもよい。
Further, the connection between the lead beam and the circuit board is not limited to soldering, and any method may be used as long as the lead beam can be connected to the wiring pattern and mechanical strength can be ensured.

ところで、上述の実施例のプローブヘッドの構成は、所
定のピッチで連続して並んだ被検査電極に対し、1つの
金属薄板で作成した1列の触針を対応させる構成とした
が、電極ピッチがさらに微細化すると金属薄板にスリッ
ト穴加工が困難になり、また、リードビームも変形しや
すくなる。
By the way, the configuration of the probe head in the above-mentioned embodiment is such that one row of stylus made of one thin metal plate corresponds to the electrodes to be inspected that are consecutively lined up at a predetermined pitch. As the size of the lead beam becomes even smaller, it becomes difficult to form slit holes in a thin metal plate, and the lead beam also becomes easily deformed.

このような場合でも、本発明は容易にその対応が可能と
なる。即ち、被検査体の電極ピッチの2倍ピッチで1列
に形成した触針を、上述の実施例の方法で2組作成し、
これを互いに1ピツチずらして、重ね合せて一体化する
構成とすればよい。
Even in such a case, the present invention can easily deal with it. That is, two sets of stylus probes formed in a row at a pitch twice the electrode pitch of the object to be inspected were created using the method of the above-mentioned embodiment.
They may be shifted one pitch from each other and then overlapped and integrated.

第6図はこのようなプローブヘッド21の構成を示す図
で、第1の回路基板22と第1の触針23で構成される
第1のプローブヘッド24と、第2の回路基板25と触
針26で構成される第2プローブヘツド27とがスペー
サ28により所定の間隙を保持して固定されると同時に
、第1の触針23と第2の触針26の配列ピッチは互い
に1ピツチ分ずれて取付けられている。従って、被検査
物の電極接触は、例えば第1の触針23が偶数番目(奇
数番I」)、第2の触針26が奇数番目(偶数番目)の
電極に接触することになる。
FIG. 6 is a diagram showing the configuration of such a probe head 21, in which a first probe head 24 consisting of a first circuit board 22 and a first stylus 23, a second circuit board 25, and a stylus 23 are connected to each other. At the same time, the second probe head 27 composed of the needle 26 is fixed with a predetermined gap maintained by the spacer 28, and at the same time, the arrangement pitch of the first stylus 23 and the second stylus 26 is one pitch from each other. It is installed out of alignment. Therefore, when contacting the electrodes of the object to be inspected, for example, the first stylus 23 contacts an even-numbered (odd number I) electrode, and the second stylus 26 contacts an odd-numbered (even-numbered) electrode.

このような構成とすれば、プローブ製作が非常に容易に
なると同時に、リードビームの形状も寸法余裕がある分
だけ、自由に変えることができる。
With such a configuration, the probe can be manufactured very easily, and at the same time, the shape of the lead beam can be freely changed to the extent that there is a dimensional margin.

即ち、リードビームの根元の方を太く、接触端を細くし
て適正な剛性や接触信頼性を確保することができる。
That is, by making the lead beam thicker at the base and thinner at the contact end, appropriate rigidity and contact reliability can be ensured.

[発明の効果] 以上説明したように本発明方法によれば、微細ピッチの
被検査体でも確実に検査することができ、しかも安価に
製造可能な構造を有する検査装置を製造することが可能
となる。
[Effects of the Invention] As explained above, according to the method of the present invention, it is possible to manufacture an inspection device that can reliably inspect even objects to be inspected with a fine pitch and has a structure that can be manufactured at low cost. Become.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による実施例のプローブヘッドを示す図
、第2図は第1図のプローブヘッドの検査状態を示す図
、第3図は実施例のプローブヘッドの触針となるリード
板を示す図、第4図は実施例の製造工程を説明するため
の図、第5図は実弛例のプローブヘッドに用いる回路基
板を示す図、第6図は本発明の他の実施例のプローブヘ
ットの検査状態を示す図である。 1・・・・・・・・・プローブヘッド 2・・・・・・・・・回路基板 3・・・・・・・・・触針 4・・・・・・・・・押え板 5・・・・・・・・・被検査体 7・・・・・・・・・リード板 9・・・・・・・・・リードビーム 10・・・・・・・・・リード配線パターン(b) 第3図 第1図 第2図 (G) (d) 第4図
FIG. 1 is a diagram showing a probe head according to an embodiment of the present invention, FIG. 2 is a diagram showing an inspection state of the probe head in FIG. 1, and FIG. 4 is a diagram for explaining the manufacturing process of the embodiment, FIG. 5 is a diagram showing a circuit board used in the probe head of the actual relaxation example, and FIG. 6 is a diagram of the probe of another embodiment of the present invention. It is a figure showing the inspection state of a head. 1... Probe head 2... Circuit board 3... Stylus 4... Holding plate 5. ......Object to be inspected 7...Lead plate 9...Lead beam 10...Lead wiring pattern (b ) Figure 3 Figure 1 Figure 2 (G) (d) Figure 4

Claims (1)

【特許請求の範囲】[Claims] 被検査体上の一群の被検査部に接触する測定用触針を備
え、この測定用触針により前記被検査体の電気的特性を
検査する検査装置の製造において、金属薄板を被検査部
の配列ピッチと等しいピッチを有する櫛歯状電極群に加
工する工程と、この電極群の配列ピッチと同一ピッチに
形成されたリード線を有する測定用基板の該リード線に
前記金属薄板の各電極を夫々電気的に接続する工程と、
この測定用基板に取付けられた櫛歯状電極群を測定用基
板から所定量突出した位置で切断して測定用触針部を形
成する工程と、測定用触針部を1つ以上組合せて測定部
を形成する工程とからなることを特徴とする検査装置の
製造方法。
In the manufacture of an inspection device that is equipped with a measuring stylus that contacts a group of parts to be inspected on an object to be inspected, and which tests the electrical characteristics of the object to be inspected using the measuring stylus, a thin metal plate is attached to the part to be inspected. A step of processing into a comb-like electrode group having a pitch equal to the arrangement pitch, and attaching each electrode of the metal thin plate to the lead wire of a measurement board having lead wires formed at the same pitch as the arrangement pitch of this electrode group. A process of electrically connecting each,
A step of cutting the comb-like electrode group attached to the measurement substrate at a position protruding from the measurement substrate by a predetermined amount to form a measurement stylus, and a step of combining one or more measurement stylus portions to perform measurement. 1. A method of manufacturing an inspection device, comprising the step of forming a part.
JP16351288A 1988-06-30 1988-06-30 Manufacture of inspection device Pending JPH0212070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16351288A JPH0212070A (en) 1988-06-30 1988-06-30 Manufacture of inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16351288A JPH0212070A (en) 1988-06-30 1988-06-30 Manufacture of inspection device

Publications (1)

Publication Number Publication Date
JPH0212070A true JPH0212070A (en) 1990-01-17

Family

ID=15775273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16351288A Pending JPH0212070A (en) 1988-06-30 1988-06-30 Manufacture of inspection device

Country Status (1)

Country Link
JP (1) JPH0212070A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812723B2 (en) 2000-10-24 2004-11-02 Nec Electronics Corporation Probe pin for a probe card
JP2011221031A (en) * 2011-06-14 2011-11-04 Japan Electronic Materials Corp Probe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812723B2 (en) 2000-10-24 2004-11-02 Nec Electronics Corporation Probe pin for a probe card
JP2011221031A (en) * 2011-06-14 2011-11-04 Japan Electronic Materials Corp Probe

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