JPH02120899U

JPH02120899U -

Info

Publication number: JPH02120899U
Application number: JP2965489U
Authority: JP
Priority date: 1989-03-15
Filing date: 1989-03-15
Publication date: 1990-09-28

Description

[Brief explanation of drawings]

第１図は本案装置の一例での概略正面図、第２
図と第３図は本案装置を備えたリード線切断装置
の概略側面図と平面図、第４図はブラシ状の反り
矯正体の正面図、第５図は同上中央縦断面図、第
６図は基板の反り矯正状態の説明図、第７図は従
来例の説明図である。１８……カツター、３０……一対のブラケツト
、３１……軸杆、３４……ブラシ状の反り矯正体
、３５……リング体、３６……軸杆遊挿穴、３７
……ポリアミド系合成繊維刷毛。 Figure 1 is a schematic front view of an example of the proposed device;
3 and 3 are a schematic side view and a plan view of a lead wire cutting device equipped with the device of the present invention, FIG. 4 is a front view of a brush-shaped warp correcting body, FIG. 5 is a central longitudinal sectional view of the same, and FIG. 7 is an explanatory diagram of a state in which the substrate is warped, and FIG. 7 is an explanatory diagram of a conventional example. 18... Cutter, 30... Pair of brackets, 31... Axial rod, 34... Brush-shaped warpage correction body, 35... Ring body, 36... Axial rod loose insertion hole, 37
...Polyamide synthetic fiber brush.

Claims

[Scope of utility model registration request]

In a lead wire cutting device that uses a high-speed rotating disk-shaped cutter to cut the lead wires protruding from the bottom surface of a chip-mixed board while transporting it in a fixed direction, a pair of lead wires are installed below the starting end of the board transfer path near the cutter. The brackets are erected to face each other, and between the pair of brackets, a brush-shaped warp correction body consisting of numerous polyamide synthetic fiber brushes radially planted around the outer periphery of a ring body rotates freely. A device for straightening warpage of chip-embedded boards, characterized by a structure in which the chips are freely supported.