JPH0212268B2 - - Google Patents
Info
- Publication number
- JPH0212268B2 JPH0212268B2 JP13697081A JP13697081A JPH0212268B2 JP H0212268 B2 JPH0212268 B2 JP H0212268B2 JP 13697081 A JP13697081 A JP 13697081A JP 13697081 A JP13697081 A JP 13697081A JP H0212268 B2 JPH0212268 B2 JP H0212268B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- adhesive
- formula
- metal
- integer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000002131 composite material Substances 0.000 claims description 21
- 229920006122 polyamide resin Polymers 0.000 claims description 20
- 150000001875 compounds Chemical class 0.000 claims description 9
- 150000007942 carboxylates Chemical group 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 8
- 239000012943 hotmelt Substances 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 16
- 239000004677 Nylon Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 229920001778 nylon Polymers 0.000 description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000007718 adhesive strength test Methods 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- JCELWOGDGMAGGN-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 JCELWOGDGMAGGN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000008753 Papaver somniferum Nutrition 0.000 description 1
- 241000218180 Papaveraceae Species 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- -1 aniline Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 235000012245 magnesium oxide Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- OHQOKJPHNPUMLN-UHFFFAOYSA-N n,n'-diphenylmethanediamine Chemical compound C=1C=CC=CC=1NCNC1=CC=CC=C1 OHQOKJPHNPUMLN-UHFFFAOYSA-N 0.000 description 1
- 125000005608 naphthenic acid group Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- IXZDIALLLMRYOU-UHFFFAOYSA-N tert-butyl hypochlorite Chemical compound CC(C)(C)OCl IXZDIALLLMRYOU-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Laminated Bodies (AREA)
Description
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The present invention relates to a method for producing a composite consisting of a metal and a polyamide resin. Polyamide resins such as 6-nylon, 6,6-nylon, and 1,2-nylon are excellent in strength, elastic modulus, and abrasion resistance, and more recently, there are also those reinforced with glass fiber or carbon fiber.
Its strength has improved dramatically and has reached the level of strength of some metals such as aluminum. For this reason, some metal composite products that use aluminum as a part of their components can be replaced with polyamide resin, which is lighter and cheaper than aluminum, and it is currently possible to replace the aluminum part with polyamide resin, which is lighter and cheaper than aluminum. Composite products comprising resin have also been proposed. However, currently known composite products of this type are manufactured by bonding already formed metal parts and resin parts using an epoxy adhesive, and therefore it is difficult to form both the metal and resin parts. It requires a total of three steps: a step of applying adhesive, and a step of joining both parts, and it is difficult to achieve high adhesion dimensional accuracy in the joining process, and furthermore, it is difficult to join the molded parts together. However, there was a major restriction in that both the metal and resin molded bodies had to have a shape that allowed them to be joined. It is obvious that if this geometrical constraint could be overcome, the possibilities of use of this type of composite would be significantly expanded. In order to remove this restriction, it is conceivable to bring a resin in a hot molten state into contact with the surface of the metal molded body coated with an adhesive, and then to cool and solidify the resin in a desired shape. Specifically, this is the application of injection molding and extrusion molding methods, and is intended to reduce the number of steps and improve bonding dimensional accuracy. However, when using conventional epoxy adhesives as adhesives, In practice, this application would not be possible unless new adhesives were developed, since strong adhesion between metal and resin does not occur. The purpose of the present invention is to provide a method for manufacturing a composite consisting of a metal and a polyamide resin, and basically, if possible, this type of composite can be manufactured using an injection molding method or an extrusion molding method. The goal is to develop adhesives that will tighten. This type of adhesive is required to have the following functions. 1. It has strong bonding ability with both metal and polyamide, 2. The adhesive itself has extremely high final strength,
and 3. Since polyamide resin shrinks during its cooling and solidification process, it must be able to cope with this resin shrinkage. As a result of intensive research to develop an adhesive that satisfies these conditions, it has been found that an adhesive containing the following two components as main components is suitable. (A)A-1 A compound having two or more NCO groups in one molecule, A-2 A compound with the formula in the molecule (In the formula, n means an integer of 1 to 3) A-3 A compound having a methylolated phenol in the molecule (In the formula, m means an integer of about 10) Compound (B) An acrylonitrile butadiene copolymer having an α,β-unsaturated carboxylate group in the molecule. Among the A components, typical A-1 components include triene diisocyanate, diphenylmethane-4,4'-diisocyanate, hexamethylene diisocyanate, triphenylmethane diisocyanate, trimethylolpropane-tris(3-isocyanate tolyl carbamate) ), etc. Typical examples of component A-2 include resol type phenol resins and compounds containing phenol resins as part of their molecular chains. Representative examples of component A-3 include novolak type phenolic resins and compounds containing them as part of the molecular chain. α, β- contained in the copolymer that is component B
The unsaturated carboxylate group is a group represented by the following general formula. (In the formula, X represents a halogen atom selected from chlorine, bromine and iodine, R 1 , R 2 and R 3 represent a hydrogen atom or a hydrocarbon residue having 1 to 10 carbon atoms, and n represents 2 to
5, m represents an integer of 1 to 4, l represents an integer of 1 to 30). Of the above components A and B, component A forms a strong bond with both metal and polyamide and contributes to increasing the final strength of the adhesive itself, while component B is a rubber component that follows the shrinkage of the resin. In addition to fulfilling its role, the presence of carboxylate groups improves adhesion to metals, and anaerobic polymerization occurs during the curing process, so it is administered to help strengthen the adhesive layer. Incidentally, since both metal and polyamide have high surface energy, the acrylonitrile butadiene copolymer used as component B preferably has a high polarity, and it is advantageous to use one having a nitrile content of 35 to 50%. The α,β-unsaturated carboxylate group can be introduced into the acrylonitrile butadiene copolymer by the method described in Japanese Patent Publication No. 53-6198. The adhesive used in the method of the present invention is the above A and B.
A curing accelerator for the other A component of both components and/or
It may contain polyhydric alcohols and polyamines that can react with component A. Typical examples of curing accelerators include heavy metal ions, naphthenic acid salts, tin compounds, and the like. The polyhydric alcohol is N,N-(2-hydroxypropyl)-
Examples of polyamines include diols such as aniline, various glycols, triols such as glycerin and trimethylolpropane, and aliphatic polyamines such as diethylenetriamine and triethylenetetramine.
Examples include aromatic polyamines such as 3'-dichloro-4,4'-diamino-diphenylmethane and methylene dianiline. Next, a filler, a curing agent, etc. can be added to the A-2 component. Examples of fillers include wood flour, pulp, cotton waste, mica, and the like. Examples of the curing accelerator include organic acids such as para-toluenesulfonic acid and benzoic acid, lime, and magnesium oxide. Further, the same filler as in the case of the B-2 component can be added to the A-3 component. Furthermore, A-
Since the three components do not cause crosslinking independently, a curing agent is required. The curing agent is usually hexamethylenetetramine in an amount of about 10% by weight of component A-3. The composition ratio of component A and component B is A in terms of solid content weight ratio.
The amount of component B may be in the range of 1 to 500 parts per 100 parts of component, but if component B is less than 5 parts, the shrinkage suppressing effect will be low.
If it exceeds 100 parts, the strength of the adhesive layer may be insufficient, so it is preferable to use 5 to 100 parts of component B. The adhesive is used in the form of a solution in which both components A and B, as well as additional components such as a curing accelerator added as necessary, are dissolved in an appropriate solvent. As a solvent, aliphatic solvents such as pentane and hexane,
Alicyclic solvents such as cyclohexane, aromatic solvents such as toluene and xylene, ether solvents such as dioxane and tetrahydrofuran, ethyl acetate,
Among ester solvents such as methyl acetate, ketone solvents such as acetone and methyl ethyl ketone, and halogen solvents such as methylene chloride and chloroform,
A single solvent or a mixed solvent can be appropriately selected depending on the types of components A and B used. In carrying out the method of the present invention, the bonding surface of the metal member is previously polished, degreased, and dried. Polishing can be performed using sandpaper, a grinder, etc., and degreasing can be performed using the above-mentioned organic solvent. Typical examples of materials constituting the metal member include iron, aluminum, and copper. Methods for applying the adhesive to metal members include dipping, brushing, and spraying, and the adhesive is dried after forming a uniform coating. As component A, A-2, A-
3, further baking is performed after drying. Bake in a heating device such as an oven at 150°C.
Do this for about 30 minutes at a temperature around â. Polyamide resins include 6-nylon, 6,6-nylon, 1,
Examples include 2-nylon, 1,1-nylon, and copolymerized nylon, and these resins may contain reinforcing materials such as glass fibers and carbon fibers, and fillers such as calcium carbonate. There are injection molding methods and extrusion molding methods for bringing hot-melt polyamide resin into contact with a metal member coated with an adhesive, and when using the injection molding method, the metal member treated with an adhesive is fixed in a mold, Hot melt resin is injected, and during the subsequent cooling process, molding of the resin part and adhesion of the resin part to the metal member are performed at the same time.
When extrusion molding is used, the extruded resin is brought into contact with the metal member and simultaneously cooled under pressure using a roll or the like to bond the two together. In the blow molding method, a hot melt resin film is expanded under pressure in a mold, brought into contact with a metal member fixed thereto, and bonded together during the subsequent cooling process. The description will now be made in conjunction with the accompanying drawings. FIG. 1 is a schematic cross-sectional view showing part of an apparatus for carrying out the method of the invention. 10 is a mold of an injection molding machine, 12 is an upper mold thereof, 14 is a lower mold thereof, and 121 is a passage formed in the upper mold 12 for injection of hot melt polyamide resin. 16 is a metal molded body fixed in the mold 10, and 18 is a passage 1
This is a polyamide resin injected into the mold 10 through the tube 21. The shape of the composite body manufactured by the molding machine shown in Figure 1 is as shown in Figures 2a and 2b, and the dimensions of each part of the samples manufactured in the manufacturing examples and comparative examples described below are as follows. It was hot on the street. Metal part Resin part is a cylindrical body with a diameter of 25.4 mm and a length of 40 mm.The large diameter part has a diameter of 25.4 mm and a length of 10 mm, and the small diameter part has a diameter of 12 mm and a length of 15 mm. Each end face in the length direction is molded and bonded. Next, the present invention will be explained in more detail with reference to examples and comparative examples in which molding machines and molded samples were manufactured as shown in the accompanying drawings. Examples 1 to 2 and Comparative Examples 1 to 4 (Composites made of steel and 6-nylon) (a) Preparation of steel molded bodies The test molded bodies were made of SS41 and buffed with #100 sandpaper. The poppies were washed with acetone and air-dried. (b) Preparation of adhesive (i) Component A As component A-1, Coronate (trade mark), a polyisocyanate adhesive (Example 1)
and Desmodyur (trademark) (Example 2) are used as the A-2 component, Sumilite Resin (trademark) PR11078, which is a resol type phenolic resin.
(Example 3) and Sumilite Resin (trademark) PR7031A (Example 4), which is a novolac type phenolic resin, were used as the A-3 component. (ii) Component B acrylonitrile butadiene copolymer 50g
After masticating with a roll at a temperature of 50â, it was dissolved in 450g of methyl ethyl ketone in a separable flask, and 4.3% of methacrylic acid was added while stirring.
(1 mole of methacrylic acid per 1000 g of copolymer) was added dropwise, and further 5.4 g of t-butylhypochloride (equal mole to methacrylic acid) was added and mixed, and stirring was continued for about 1 day. The reaction mixture was added to about 1500 g of methanol to precipitate the reaction product, collected by filtration, the solvent was removed, and this was dissolved again in about 450 g of methyl ethyl ketone to give about
Make a 10% solution and use this as component B. (iii) Mixing of component A and component B The stock solution of component A and the solution of component B are mixed at the composition ratio (solid weight ratio) shown in the table to form an adhesive. (c) Application of adhesive to steel molding A uniform thin film of the above adhesive is formed on the surface of the degreased steel molding by brush coating, and then dried. In some cases, baking was performed at 150°C for 30 minutes while the film was open. (d) Molding of composite The adhesive-treated steel molded body was fixed in a mold in the manner shown in Figure 1, and hot-melted 6-nylon (containing 30% glass fiber) at 240°C was placed in the mold. A composite body having the shape shown in FIGS. 2a and 2b was prepared. (e) Tensile test The obtained composite was set in a tensile testing machine and tested at a tensile speed of 0.5 mm/min in the direction shown by the arrow in Figure 2a. This result shows that commercially available epoxy adhesive (Epoxy Araldite), chlorinated rubber adhesive (Chemrock)
mark), polyurethane adhesive (Coronate-
Tests on composite samples (Comparative Examples 1 to 4) produced in the same manner as in the embodiment described in the previous section, using a polyfunctional polyisocyanate adhesive (Desmodyur Mark) and a polyfunctional polyisocyanate adhesive (Desmodyur Mark), respectively. The results are shown in Table 1 below.
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宿œäŸïŒãïŒåã³æ¯èŒäŸïŒãïŒ
ããªã¢ããæš¹èãšããŠïŒïŒïŒâãã€ãã³ãçšã
ã以å€ã¯å®æœäŸïŒåã³ïŒäžŠã³ã«æ¯èŒäŸïŒãïŒãšå
æ§ã«ããŠè€åäœãµã³ãã«ããããã補äœããåæ§
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瀺ãããéãã§ãã€ãã[Table] Examples 3 to 4 and Comparative Examples 5 to 8 Composite samples were produced in the same manner as in Examples 1 and 2 and Comparative Examples 1 to 4 except that 6,6-nylon was used as the polyamide resin, The results of an adhesion test conducted under similar conditions are shown in Table 2 below.
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宿œäŸïŒãïŒåã³æ¯èŒäŸïŒã12
ããªã¢ããæš¹èãšããŠïŒïŒïŒâãã€ãã³ãçšã
ã以å€ã¯å®æœäŸïŒåã³ïŒäžŠã³ã«æ¯èŒäŸïŒãïŒãšå
æ§ã«ããŠè€åäœãµã³ãã«ããããã補äœããåæ§
ãªæ¡ä»¶ã§æ¥çå詊éšãè¡ãªã€ãçµæã¯æ¬¡ã®è¡šïŒã«
瀺ãããéãã§ãã€ãã[Table] Examples 5 to 6 and Comparative Examples 9 to 12 Composite samples were produced in the same manner as in Examples 1 and 2 and Comparative Examples 1 to 4, except that 1,2-nylon was used as the polyamide resin, The results of an adhesion test conducted under similar conditions are shown in Table 3 below.
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宿œäŸïŒãïŒåã³æ¯èŒäŸ13ã16
éå±æåœ¢äœãšããŠã¢ã«ãããŠã 補äžå®çäœãçš
ãã以å€ã¯å®æœäŸïŒåã³ïŒäžŠã³ã«æ¯èŒäŸïŒãïŒãš
åæ§ã«ããŠè€åäœãµã³ãã«ããããã補äœããå
æ§ãªæ¡ä»¶ã§æ¥çå詊éšãè¡ãªã€ãçµæã¯æ¬¡ã®è¡šïŒ
ã«ç€ºãããéãã§ãã€ãã[Table] Examples 7 to 8 and Comparative Examples 13 to 16 Composite samples were produced in the same manner as Examples 1 and 2 and Comparative Examples 1 to 4, except that an aluminum solid cylinder was used as the metal molded body. However, the results of an adhesion test under similar conditions are shown in Table 4 below.
It was as shown.
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宿œäŸïŒã10åã³æ¯èŒäŸ17ã20
éå±æåœ¢äœãšããŠã¢ã«ãããŠã 補äžå®çäœãã
åããªã¢ããæš¹èãšããŠïŒïŒïŒâãã€ãã³ãçšã
ã以å€ã¯å®æœäŸïŒåã³ïŒäžŠã³ã«æ¯èŒäŸïŒãïŒãšå
æ§ã«ããŠè€åäœãµã³ãã«ããããã補äœããåæ§
ãªæ¡ä»¶ã§æ¥çå詊éšãè¡ãªã€ãçµæã¯æ¬¡ã®è¡šïŒã«
瀺ãããéãã§ãã€ãã[Table] Examples 9 to 10 and Comparative Examples 17 to 20 An aluminum solid cylinder was used as a metal molded body,
In addition, composite samples were prepared in the same manner as in Examples 1 and 2 and Comparative Examples 1 to 4, except that 6,6-nylon was used as the polyamide resin, and adhesive strength tests were conducted under the same conditions. The results were as shown in Table 5 below.
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宿œäŸ11ã12åã³æ¯èŒäŸ21ã24
éå±æåœ¢äœãšããŠã¢ã«ãããŠã 補äžå®çäœãã
åããªã¢ããæš¹èãšããŠïŒïŒïŒâãã€ãã³ãçšã
ã以å€ã¯å®æœäŸïŒåã³ïŒäžŠã³ã«æ¯èŒäŸïŒãïŒãšå
æ§ã«ããŠè€åäœãµã³ãã«ããããã補äœããåæ§
ãªæ¡ä»¶ã§æ¥çå詊éšãè¡ãªã€ãçµæã¯æ¬¡ã®è¡šïŒã«
瀺ãããéãã§ãã€ãã[Table] Examples 11-12 and Comparative Examples 21-24 An aluminum solid cylindrical body was used as a metal molded body,
In addition, composite samples were prepared in the same manner as in Examples 1 and 2 and Comparative Examples 1 to 4, except that 1,2-nylon was used as the polyamide resin, and adhesive strength tests were conducted under the same conditions. The results were as shown in Table 6 below.
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宿œäŸ 13
æåãšïŒ¢æåãšã®çµææ¯ãæ¥çåã«åãŒã圱
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ã«ä»£ããæ¥çå€ã調補ãã宿œäŸïŒåã³
ïŒãšåæ§ã«ããŠè€åäœãµã³ãã«ããããã補äœ
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ããéãã§ãã€ãã[Table] Example 13 In order to investigate the effect of the composition ratio of component A and component B on adhesive strength, Coronate (trademark), a polyurethane adhesive, was used as component A, and the composition ratio was varied. Composite samples were prepared in the same manner as in Examples 1 and 2, and adhesive tests were conducted. The results were as shown in Table 7 below.
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宿œäŸ 14
æ¥çå€ïŒ¢æå調補ã®åæã§ããã¢ã¯ãªããããª
ã«ãã¿ãžãšã³å
±éåäœã«Î±ïŒÎ²âäžé£œåã«ã«ãã
ã·ã¬ãŒãåºå°å
¥åŠçãè¡ãªããªãã€ãç¹ä»¥å€ã¯å®
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æåïŒã³ãããŒãâæšç« âã䜿çšïŒãšã®çµææ¯ã
çš®ã
ã«ä»£ããŠè€åäœãµã³ãã«ã補äœããæ¥çå詊
éšãè¡ãªã€ãçµæã¯æ¬¡ã®è¡šïŒã«ç€ºãããéãã§ã
ããããã宿œäŸ13ã®è¡šïŒã«ç€ºãããçµæãšæ¯èŒ
ãããšæ¥çåãèãããäœäžããŠããããšãå³ã¡
αïŒÎ²âäžé£œåã«ã«ããã·ã¬ãŒãåºã®ååšãæ¥ç
åã®åäžã«å¯äžããããšãå€ãã[Table] Example 14 The same procedure as in Examples 1 and 2 was carried out except that the α,β-unsaturated carboxylate group introduction treatment was not performed on the acrylonitrile butadiene copolymer, which was the raw material for preparing the adhesive B component. This B component and A
Composite samples were prepared with various composition ratios of the components (using Coronate - trademark) and an adhesion test was conducted. The results are shown in Table 8 below, and these are used as examples. Comparison with the results shown in Table 7 of No. 13 shows that the adhesive force is significantly reduced, that is, the presence of the α,β-unsaturated carboxylate group contributes to the improvement of the adhesive force.
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In the accompanying drawings, FIG. 1 shows metal-
FIG. 2 is a cross-sectional view illustrating a mold part of an apparatus for producing a polyamide resin composite, FIG. 2 is a side view illustrating an example of a metal-polyamide resin composite manufactured by the method of the present invention, and FIG. FIG. 3 is a front view of the complex shown. 10... Mold, 12... Upper mold, 121... Molten resin injection passage, 14... Lower mold, 16... Metal molded body, 18... Polyamide resin.
Claims (1)
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ïŒé ã«èšèŒã®è€åäœã®è£œæ³ã ïŒ å°åºæåœ¢æ³åã¯æŒåºæåœ¢æ³ã«ããéå±æåœ¢äœ
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ãïŒã€ã«èšèŒã®è€åäœã®è£œæ³ã[Claims] 1. A compound having two or more NCO groups in one molecule, or a compound having the formula (In the formula, n means an integer of 1 to 3) A compound having a methylolated phenol,
Or in the molecule (in the formula, m means an integer of about 10);
An adhesive whose main component is component B, which is an acrylonitrile butadiene copolymer having β-unsaturated carboxylate groups in the molecule, is applied to the surface of the metal molded object, and this is brought into contact with the polyamide resin in a hot melt state. , a method for producing a composite consisting of a metal and a polyamide resin, characterized in that the two are bonded together by subsequent cooling. 2 The α,β-unsaturated carboxylate group has the general formula (In the formula, X represents a halogen atom selected from chlorine, bromine and iodine, R 1 , R 2 and R 3 represent a hydrogen atom or a hydrocarbon residue having 1 to 10 carbon atoms, and n represents 2 to
5, m is an integer of 1 to 4, and l is an integer of 1 to 30. manufacturing method. 3. Claim 1 or 2, characterized in that the composition ratio of component A and component B of the adhesive is 5 to 100 parts of component B to 100 parts of component A in terms of solid weight ratio. Preparation of the described complexes. 4. A method for producing a composite according to any one of claims 1 to 3, characterized in that the metal molded body and the hot-melt polyamide resin are brought into contact by injection molding or extrusion molding. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13697081A JPS5839449A (en) | 1981-09-02 | 1981-09-02 | Manufacture of composite body consisting of metal and polyamide resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13697081A JPS5839449A (en) | 1981-09-02 | 1981-09-02 | Manufacture of composite body consisting of metal and polyamide resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5839449A JPS5839449A (en) | 1983-03-08 |
| JPH0212268B2 true JPH0212268B2 (en) | 1990-03-19 |
Family
ID=15187730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13697081A Granted JPS5839449A (en) | 1981-09-02 | 1981-09-02 | Manufacture of composite body consisting of metal and polyamide resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5839449A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665044A (en) * | 1979-10-31 | 1981-06-02 | Dainippon Ink & Chem Inc | Carbon fiber-reinforced resin composition |
-
1981
- 1981-09-02 JP JP13697081A patent/JPS5839449A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5839449A (en) | 1983-03-08 |
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