JPH02123373U - - Google Patents
Info
- Publication number
- JPH02123373U JPH02123373U JP3095489U JP3095489U JPH02123373U JP H02123373 U JPH02123373 U JP H02123373U JP 3095489 U JP3095489 U JP 3095489U JP 3095489 U JP3095489 U JP 3095489U JP H02123373 U JPH02123373 U JP H02123373U
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical body
- solder
- mesh
- introduction hole
- oxidizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一具体例を示す一部を断面に
した半田供給装置の正面図、第２図イ，ロ，ハは
従来装置の略示断面図である。
２……放熱板、３……半田、１０……筒体、１
９……メツシユ、９、１８……非酸化性ガスの供
給管路、１６……半田の導入穴。
FIG. 1 is a partially sectional front view of a solder supply device showing a specific example of the present invention, and FIGS. 2A, 2B, and 2C are schematic sectional views of a conventional device. 2... Heat sink, 3... Solder, 10... Cylindrical body, 1
9...Mesh, 9, 18...Non-oxidizing gas supply pipe, 16...Solder introduction hole.
Claims (1)
て、 上下動自在に支持された筒体の下面にメツシユ
を張設すると共に、前記筒体に非酸化性ガスの供
給管路を接続し、かつ、前記筒体の側壁部に定量
半田の導入穴を開口せしめたことを特徴とする半
田供給装置。[Claims for Utility Model Registration] A device for supplying a predetermined amount of solder onto a heat dissipation plate, wherein a mesh is stretched on the lower surface of a cylindrical body supported so as to be movable up and down, and the cylindrical body is coated with non-oxidizing 1. A solder supply device, characterized in that a gas supply conduit is connected thereto, and a metered amount solder introduction hole is opened in the side wall of the cylindrical body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095489U JPH02123373U (en) | 1989-03-18 | 1989-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095489U JPH02123373U (en) | 1989-03-18 | 1989-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02123373U true JPH02123373U (en) | 1990-10-11 |
Family
ID=31256456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3095489U Pending JPH02123373U (en) | 1989-03-18 | 1989-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02123373U (en) |
-
1989
- 1989-03-18 JP JP3095489U patent/JPH02123373U/ja active Pending
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