JPH02124976U - - Google Patents

Info

Publication number
JPH02124976U
JPH02124976U JP1989030956U JP3095689U JPH02124976U JP H02124976 U JPH02124976 U JP H02124976U JP 1989030956 U JP1989030956 U JP 1989030956U JP 3095689 U JP3095689 U JP 3095689U JP H02124976 U JPH02124976 U JP H02124976U
Authority
JP
Japan
Prior art keywords
bonding wire
spool
bonding
spool body
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989030956U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989030956U priority Critical patent/JPH02124976U/ja
Publication of JPH02124976U publication Critical patent/JPH02124976U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07168Means for storing or moving the material for the connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07502Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
  • Winding Filamentary Materials (AREA)
  • Tension Adjustment In Filamentary Materials (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案の2つの実施例を示
すスプール及び孔空きガイド部材の各縦断面図、
第3図はワイヤボンデイング装置の一部断面を含
む略示正面図、第4図は従来のボンデイングワイ
ヤの巻回構造を示すスプールの縦断面図、第5図
はボンデイングワイヤの綾巻き形態を説明するス
プールの正面図、第6図はボンデイングワイヤの
巻層にくずれが発生した状態を説明するスプール
の部分拡大断面図である。 1……ワイヤボンデイング装置、2……ボンデ
イングワイヤ、5……スプール本体、8d……ス
プール本体の軸線方向に対して傾斜した巻回整列
層。
1 and 2 are longitudinal sectional views of a spool and a perforated guide member showing two embodiments of the present invention,
Fig. 3 is a schematic front view including a partial cross section of the wire bonding device, Fig. 4 is a vertical cross-sectional view of a spool showing a conventional bonding wire winding structure, and Fig. 5 explains the cross-wound form of the bonding wire. FIG. 6 is a partially enlarged cross-sectional view of the spool illustrating a state in which the winding layer of the bonding wire is distorted. 1... wire bonding device, 2... bonding wire, 5... spool body, 8d... winding alignment layer inclined with respect to the axial direction of the spool body.

Claims (1)

【実用新案登録請求の範囲】 綾巻きされたボンデイングワイヤをスプール本
体の中心孔を通してボンデイングツールに向けて
送り出すスプールに於いて、 前記ボンデイングワイヤがスプール本体の軸線
方向に対して傾斜した巻回整列層を形成してなる
ことを特徴とするボンデイングワイヤの巻回構造
[Claims for Utility Model Registration] In a spool that feeds a cross-wound bonding wire toward a bonding tool through a center hole of a spool body, the bonding wire has a winding alignment layer that is inclined with respect to the axial direction of the spool body. A bonding wire winding structure characterized by forming a bonding wire.
JP1989030956U 1989-03-18 1989-03-18 Pending JPH02124976U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989030956U JPH02124976U (en) 1989-03-18 1989-03-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989030956U JPH02124976U (en) 1989-03-18 1989-03-18

Publications (1)

Publication Number Publication Date
JPH02124976U true JPH02124976U (en) 1990-10-15

Family

ID=31533679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989030956U Pending JPH02124976U (en) 1989-03-18 1989-03-18

Country Status (1)

Country Link
JP (1) JPH02124976U (en)

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